×

High strength carbon fiber composite wafers for microfabrication

  • US 9,174,412 B2
  • Filed: 11/02/2012
  • Issued: 11/03/2015
  • Est. Priority Date: 05/16/2011
  • Status: Active Grant
First Claim
Patent Images

1. A wafer comprising:

  • a. at least one sheet of carbon fiber composite (CFC) including carbon fibers embedded in a matrix;

    b. a wafer thickness of between 10-500 micrometers;

    c. at least one side of the wafer having a root mean square surface roughness Rq of less than 300 nm in an area of 100 micrometers by 100 micrometers and less than 500 nm along a line of 2 millimeter length;

    d. a yield strength at fracture of greater than 0.5 gigapascals (GPa), wherein yield strength is defined as a force, in a direction parallel with a plane of a side of the wafer, per unit area, to cause the wafer to fracture; and

    e. a strain at fracture of more than 0.01, wherein strain is defined as the change in length caused by a force in a direction parallel with a plane of the wafer divided by original length.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×