Lithographic apparatus and device manufacturing method using dose control

• US 9,176,392 B2
• Filed: 02/26/2014
• Issued: 11/03/2015
• Est. Priority Date: 06/08/2004
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Troost, Kars Zeger, Bleeker, Arno Jan
• Primary Examiner(s): Whitesell Gordon, Steven H
• Application Number:
  US14/190,147
• Publication Number:
  US 20140176929A1
• Time in Patent Office: 615 Days
• Field of Search: 355/53, 430/5
• US Class Current: 1/1
• CPC Class Codes: G03F 7/70058 Mask illumination systems
• CPC Class Codes: G03F 7/70275 Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
• CPC Class Codes: G03F 7/70291 Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
• CPC Class Codes: G03F 7/70383 Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams maskless lithography using a programmable mask G03F7/70291
• CPC Class Codes: G03F 7/70425 Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning

Abstract

A system and method are used to manufacture a device using at least one exposure step. Each exposure step projects a patterned beam of radiation onto a substrate. The patterned beam includes a plurality of pixels. Each pixel delivers a radiation dose no greater than a predetermined normal maximum dose to the target portion in the exposure step and/or at least one selected pixel delivers an increased radiation dose, greater than the normal maximum dose. The increased dose may be delivered to compensate for the effect of a defective element at a known position in the array on a pixel adjacent a selected pixel or compensate for underexposure of the target portion at the location of a selected pixel resulting from exposure of that location to a pixel affected by a known defective element in another exposure step.

Claims

1. A method comprising:

providing a patterned radiation beam using individually controllable elements, wherein;

the patterned radiation beam comprises a plurality of pixels, and

the individually controllable elements comprise a defective element corresponding to a defective pixel in the plurality of pixels; and

projecting the patterned radiation beam onto a target portion of a substrate, wherein the projecting comprises;

delivering a first radiation dose corresponding to a first pixel of the plurality of pixels to form a white region in the target portion, and

delivering a second radiation dose corresponding to a second pixel of the plurality of pixels to form a compensating white region in the target portion in order to at least partially compensate for an underexposed region in the target portion, wherein;

the second radiation dose is twice the first radiation dose;

the second pixel is adjacent to the defective pixel;

the compensating white region is adjacent to the underexposed region; and

the underexposed region corresponds to the defective pixel.

2. The method of claim 1, wherein the projecting further comprises delivering a third radiation dose corresponding to a third pixel of the plurality of pixels to form a black region in the target portion, the third radiation dose being smaller than the first radiation dose.

3. The method of claim 1, wherein the providing of the patterned radiation beam comprises controlling the individually controllable elements.

4. The method of claim 1, wherein the providing of the patterned radiation beam comprises:

controlling a first one of the individually controllable elements to provide the first radiation dose; and

controlling a second one of the individually controllable elements to provide the second radiation dose.

5. The method of claim 1, wherein:

the substrate comprises a layer of radiation sensitive material having an activation threshold value; and

the first radiation dose is greater than the activation threshold value.

6. The method of claim 1, wherein each pixel of the plurality of pixels corresponds to each of the individually controllable elements.

7. The method of claim 1, wherein the white region and the compensating white region are formed substantially simultaneously in a single exposure step.

8. A device manufacturing method comprising:

providing a patterned radiation beam using individually controllable elements, wherein;

the patterned radiation beam comprises a plurality of pixels, and

the individually controllable elements comprises a defective element corresponding to a defective pixel in the plurality of pixels;

delivering a first radiation dose corresponding to a first pixel of the plurality of pixels to form a white region in a target portion of the substrate; and

delivering a second radiation dose corresponding to a second pixel of the plurality of pixels to form a compensating white region in the target portion in order to at least partially compensate for an underexposed region in the target portion, wherein;

the second radiation dose is twice the first radiation dose;

the second pixel is adjacent to the defective pixel;

the compensating white region is adjacent to the underexposed region; and

the underexposed region corresponds to the defective pixel.

9. The device manufacturing method of claim 8, further comprising delivering a third radiation dose corresponding to a third pixel of the plurality of pixels to form a black region in the target portion, the third radiation dose being smaller than the first radiation dose.

10. The device manufacturing method of claim 8, wherein the providing of the patterned radiation beam comprises controlling the individually controllable elements.

11. The device manufacturing method of claim 8, wherein the providing of the patterned radiation beam comprises:

controlling a first one of the individually controllable elements to provide the first radiation dose; and

controlling a second one of the individually controllable elements to provide the second radiation dose.

12. The device manufacturing method of claim 8, wherein:

the substrate comprises a layer of radiation sensitive material having an activation threshold value; and

the first radiation dose is greater than the activation threshold value.

13. The device manufacturing method of claim 8, wherein each pixel of the plurality of pixels corresponds to each of the individually controllable elements.

14. The device manufacturing method of claim 8, wherein the white region and the compensating white region are formed substantially simultaneously in a single exposure step.