Optimizing bias points for a semiconductor device
First Claim
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1. A method comprising:
- determining a corner value for each of a plurality of device types of a semiconductor die based on operation of each of the device types and storing the corner value for each of the device types in a storage of the semiconductor diedetermining environmental conditions at which the semiconductor die is operating using one or more sensors of the semiconductor die;
using a controller of the semiconductor die to access a table in the storage based on the determined environmental conditions, the table including a set of bias points, to determine a bias point for each of a plurality of blocks based on the environmental conditions and heuristics for the semiconductor die, wherein the table is partitioned into a plurality of partitions each associated with at least one of the blocks and including a plurality of bias points each corresponding to a set of environmental conditions and based on the determined corner value of each of the plurality of device types; and
dynamically operating the semiconductor die at a bias point accessed from the table based on the determined environmental conditions.
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Abstract
In one embodiment, a method includes determining environmental conditions associated with operation of a chip having multiple device types, accessing a table stored in the chip based on the determined environmental conditions, and dynamically operating the chip at a bias point accessed from the table based on the determined environmental conditions.
14 Citations
19 Claims
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1. A method comprising:
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determining a corner value for each of a plurality of device types of a semiconductor die based on operation of each of the device types and storing the corner value for each of the device types in a storage of the semiconductor die determining environmental conditions at which the semiconductor die is operating using one or more sensors of the semiconductor die; using a controller of the semiconductor die to access a table in the storage based on the determined environmental conditions, the table including a set of bias points, to determine a bias point for each of a plurality of blocks based on the environmental conditions and heuristics for the semiconductor die, wherein the table is partitioned into a plurality of partitions each associated with at least one of the blocks and including a plurality of bias points each corresponding to a set of environmental conditions and based on the determined corner value of each of the plurality of device types; and dynamically operating the semiconductor die at a bias point accessed from the table based on the determined environmental conditions. - View Dependent Claims (2, 3, 4, 5, 6, 16, 17, 18)
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7. An apparatus comprising:
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a transistor sensor including a plurality of different transistor types to be switchably coupled to a first test line to receive a test signal and to output a test output to enable detection of a corner of each of the different transistors types; a resistor sensor including a plurality of different resistor types to be switchably coupled to a second test line to receive a test signal and to output a test output to enable detection of a corner of each of the different resistor types; a capacitor sensor including a plurality of different capacitor types to be switchably coupled to a third test line to receive a test signal and to output a test output to enable detection of a corner of each of the different capacitor types; a temperature sensor to generate a value representative of a temperature at which the apparatus is operating; a voltage sensor to generate an output representative of a voltage of a power source coupled to the apparatus; an analog-to-digital converter (ADC) switchably coupled to each of the sensors to digitize a corresponding output; and a microcontroller to control switching of the sensors to the ADC, receive the corresponding digitized outputs, determine a corner for each of the different transistor types, the resistor types and the capacitor types, store each of the determined corners in a first storage, determine a set of bias points for each of a plurality of blocks of the apparatus based on the determined corners and each for a set of environmental conditions, and store the set of bias points in a second storage of the apparatus. - View Dependent Claims (8, 9, 10, 11, 19)
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12. A system comprising:
a receiver formed on a single semiconductor die, the receiver including a signal path having an analog front end to receive and process a radio frequency (RF) signal to provide a digital output and a digital signal processor (DSP) to receive the digital output and to process the digital output to generate a content signal, wherein the receiver includes; at least one process sensor to generate an output indicative of process corner information of a plurality of device types of the semiconductor die; at least one temperature sensor to generate an output indicative of a temperature condition of the semiconductor die; an analog-to-digital converter (ADC) separate from an ADC of the signal path switchably coupled to each of the sensors to digitize a corresponding output; a microcontroller coupled to the ADC to control switching of the sensors to the ADC, receive the corresponding digitized outputs, determine the process corner information for each of the plurality of device types, and determine a set of bias points for each of a plurality of blocks of the receiver based on the process corner information, each of the set of bias points including a plurality of bias points each associated with a temperature condition at which the receiver may operate; a non-volatile storage to store the set of bias points for each of the plurality of blocks of the receiver. - View Dependent Claims (13, 14, 15)
Specification