Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer

• US 9,177,848 B2
• Filed: 07/06/2012
• Issued: 11/03/2015
• Est. Priority Date: 05/04/2007
• Status: Active Grant

• Current Assignee: JCET Semiconductor (Shaoxing) Co., Ltd.
• Original Assignee: Stats Chippac Limited
• Inventors: Do, Byung Tai, Kuan, Heap Hoe, Chua, Linda Pei Ee
• Primary Examiner(s): Tran, Minh-Loan
• Assistant Examiner(s): WHITE, SHAKA SHAKAR
• Application Number:
  US13/543,618
• Publication Number:
  US 20120273967A1
• Time in Patent Office: 1,215 Days
• Field of Search: 438/667
• US Class Current: 1/1
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/76898 formed through a semiconductor substrate
• CPC Class Codes: H01L 2221/68336 involving stretching of the auxiliary support post dicing
• CPC Class Codes: H01L 2221/68345 used as a support during the manufacture of self supporting substrates
• CPC Class Codes: H01L 2221/68372 used to support a device or wafer when forming electrical connections thereto when forming bonding pads H01L24/03; when forming bump connectors H01L24/11; when forming layer connectors H01L24/27
• CPC Class Codes: H01L 2224/02371 connecting the bonding area on a surface of the semiconductor or solid-state body with another surface of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/02377 Fan-in arrangement
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/05008 Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body, e.g.
• CPC Class Codes: H01L 2224/05099 Material
• CPC Class Codes: H01L 2224/05548 Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/0557 the external layer being disposed on a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/32145 : the bodies being stacked
• CPC Class Codes: H01L 2224/32225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 : being circular
• CPC Class Codes: H01L 2224/45099 : Material
• CPC Class Codes: H01L 2224/48091 : Arched
• CPC Class Codes: H01L 2224/48227 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48472 : the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 2224/73267 : Layer and HDI connectors
• CPC Class Codes: H01L 2224/82001 : involving a temporary auxiliary member not forming part of the bonding apparatus
• CPC Class Codes: H01L 2225/06513 : Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/06551 : Conductive connections on the side of the device
• CPC Class Codes: H01L 23/481 : Internal lead connections, e.g. via connections, feedthrough structures
• CPC Class Codes: H01L 24/03 : Manufacturing methods
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/12 : Structure, shape, material or disposition of the bump connectors prior to the connecting process
• CPC Class Codes: H01L 24/19 : Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/25 : of a plurality of high density interconnect connectors
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/82 : by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 25/03 : all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19104 : on the semiconductor or solid-state device, i.e. passive-on-chip
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/30105 : Capacitance

Abstract

A semiconductor wafer contains a plurality of die with contact pads disposed on a first surface of each die. Metal vias are formed in trenches in the saw street guides and are surrounded by organic material. Traces connect the contact pads and metal vias. The metal vias can be half-circle vias or full-circle vias. The metal vias are surrounded by organic material. Redistribution layers (RDL) are formed on a second surface of the die opposite the first surface. The RDL and through-hole vias (THV) provide expanded interconnect flexibility to adjacent die. Repassivation layers are formed between the RDL on the second surface of the die for electrical isolation. The die are stackable and can be placed in a semiconductor package with other die. The RDL provide electrical interconnect to the adjacent die. Bond wires and solder bumps also provide electrical connection to the semiconductor die.

Claims

1. A method of making a semiconductor device, comprising:

providing a plurality of first semiconductor die;

forming a separation area between the first semiconductor die;

depositing an insulating material in the separation area between the first semiconductor die extending from a first surface of the first semiconductor die to a second surface of the first semiconductor die opposite the first surface;

forming a via through the insulating material;

forming a conductive trace between the first surface of the first semiconductor die and the via;

forming a conductive layer over the second surface of the first semiconductor die opposite the first surface of the first semiconductor die and including a portion of the conductive layer connected to the via; and

singulating the first semiconductor die through the insulating material while leaving the conductive via intact.

2. The method of claim 1, further including forming the conductive trace between a contact pad on the first semiconductor die and the via.

3. The method of claim 1, further including forming an insulating layer over the second surface of the first semiconductor die.

4. The method of claim 1, further including forming the vias side-by-side through the insulating material.

5. The method of claim 1, further including disposing a second semiconductor die over the first surface of the first semiconductor die or the second surface of the first semiconductor die.

6. The method of claim 1, further including stacking the plurality of first semiconductor die.

7. A method of making a semiconductor device, comprising:

providing a first semiconductor die;

depositing an insulating material in a separation area between the first semiconductor die;

forming a plurality of vias through the insulating material;

forming a first conductive layer from a first surface of the first semiconductor die to the vias;

depositing a conductive material in the vias to form a plurality of conductive vias after forming the first conductive layer; and

forming a second conductive layer over the conductive vias and a second surface of the first semiconductor die opposite the first surface of the first semiconductor die.

8. The method of claim 7, wherein the second conductive layer is electrically connected to the conductive vias.

9. The method of claim 7, further including forming an insulating layer over the second surface of the first semiconductor die.

10. The method of claim 7, further including forming the conductive vias side-by-side in the insulating material.

11. The method of claim 7, further including disposing a second semiconductor die over the first surface of the first semiconductor die or the second surface of the first semiconductor die.

12. The method of claim 7, further including:

stacking a plurality of first semiconductor die; and

electrically connecting the stacked first semiconductor die through the conductive vias.

13. A method of making a semiconductor device, comprising:

providing a first semiconductor die;

depositing an insulating material around a peripheral region of the first semiconductor die and substantially coplanar with an active surface of the first semiconductor die;

forming a plurality of vias through the insulating material;

forming a first conductive layer over the active surface of the first semiconductor die between a contact pad on the active surface and the vias; and

forming a second conductive layer over the vias and a second surface of the first semiconductor die opposite the active surface of the first semiconductor die.

14. The method of claim 13, further including forming the vias side-by-side around the peripheral region of the first semiconductor die.

15. The method of claim 13, further including forming an insulating layer over the active surface of the first semiconductor die.

16. The method of claim 13, further including disposing a second semiconductor die over the first semiconductor die.

17. The method of claim 13, further including stacking a plurality of first semiconductor die.

18. A semiconductor device, comprising:

a plurality of first semiconductor die;

an insulating material deposited in a die separation area between the first semiconductor die and substantially coplanar with an active surface of the first semiconductor die;

a plurality of conductive vias formed through the insulating material;

a first conductive layer extending from a contact pad on the active surface of the first semiconductor die to the conductive vias; and

a second conductive layer formed over the conductive vias and a second surface of the first semiconductor die opposite the active surface of the first semiconductor die.

19. The semiconductor device of claim 18, further including a second semiconductor die disposed over one of the first semiconductor die.

20. The semiconductor device of claim 18, further including a plurality of stacked first semiconductor die electrically connected through the conductive vias.