Chuck for mounting a semiconductor wafer for liquid immersion processing

• US 9,177,849 B2
• Filed: 12/18/2012
• Issued: 11/03/2015
• Est. Priority Date: 12/18/2012
• Status: Expired due to Fees

• Current Assignee: Intermolecular Incorporated
• Original Assignee: Intermolecular Incorporated
• Inventors: Kelekar, Rajesh, Egami, Glen Eric, Francis, Aaron T.
• Primary Examiner(s): Kornakov, Michael
• Assistant Examiner(s): COLEMAN, RYAN L
• Application Number:
  US13/719,136
• Publication Number:
  US 20140166050A1
• Time in Patent Office: 1,050 Days
• US Class Current: 1/1
• CPC Class Codes: G03F 7/707 Chucks, e.g. chucking or un-chucking operations or structural details
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H01L 21/68735 characterised by edge profile or support profile
• CPC Class Codes: H01L 21/68757 characterised by a coating or a hardness or a material
• CPC Class Codes: Y10T 279/11 Vacuum

Abstract

Chucks for mounting and retaining semiconductor wafers during processing are described, particularly suited for wafer processing involving total immersion of the wafer-chuck structure in a liquid. Chuck structures are disclosed for preventing or hindering processing chemicals from contacting and contaminating large portions of the underside of the wafer undergoing processing, limiting such chemical contact to readily cleaned, relatively small annular regions on the periphery of the wafer. Embodiments include structures with supplemental gas flows on the underside of the wafer as well as the creation of gas/liquid meniscusci to prevent chemical penetration of the wafer'"'"'s underside. Methods of processing semiconductor wafers employing such chucks are also described.

Claims

1. A chuck for holding a wafer, the chuck comprising:

a surface;

wherein the surface comprises

a plurality of vacuum channels connected to a vacuum source;

an inner ring; and

an outer ring;

wherein the inner ring surrounds the plurality of vacuum channels;

wherein the inner ring is operable to carry flushing gases;

wherein the outer ring surrounds the inner ring;

wherein the outer ring is in fluid communication with the inner ring;

wherein the outer ring is connected to a vacuum source and is operable for drawing a vacuum;

an exterior ring surrounding the outer ring and in fluidic communication with the outer ring;

wherein the exterior ring includes one or more ports that are connected to a source of solvent and are configured for supplying solvent;

wherein the exterior ring includes one or more ports that are connected to a vacuum source and are configured for applying a vacuum; and

wherein the exterior ring includes one of more ports configured for outflow of solvent.

2. A chuck as in claim 1 wherein the chuck material is an engineered plastic.

3. A chuck as in claim 2 wherein the engineered plastic is a copolymer of ethylene and chlorotrifluoroethylene.

4. A chuck as in claim 1 wherein the chuck is substantially circular in shape with a diameter of approximately 12 inches.

5. A chuck as in claim 1 wherein the surface is flat to within approximately ±

0.001 inch over its entire surface.

6. A chuck as in claim 1 further comprising one or more inner ring venting ports suitable for venting the inner ring to the atmosphere.

7. A chuck as in claim 1 further comprising at least one gas inflow port in the outer ring and at least one gas outflow port in the outer ring.

8. A chuck as in claim 1 wherein a ledge between the inner ring and the outer ring is substantially coplanar with the surface of the chuck.

9. A chuck as in claim 1 wherein a ledge between the outer ring and the exterior ring is lower than a plane of the surface of the chuck.

10. A chuck as in claim 9 wherein the ledge between the exterior ring and the outer ring is in the range from 0.002 inches to 0.007 inches below the surface of the chuck.

11. A chuck as in claim 1 wherein a ledge outside the exterior ring is lower than a plane of the surface of the chuck.

12. A chuck as in claim 11 wherein the ledge outside the exterior ring is approximately in the range from 0.002 inches to 0.007 inches below the surface of the chuck.