Method for making light emitting diodes
First Claim
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1. A method for making a light emitting diode, comprising steps of:
- providing a substrate having a first surface and a second surface;
applying a patterned mask layer on the first surface, wherein the patterned mask layer comprises a plurality of linear walls aligned side by side, and a groove is defined between each adjacent linear walls to form an exposed portion of the first surface;
etching the exposed portion and removing the patterned mask layer to form a plurality of three-dimensional structures, wherein the exposed portion is etched along a first etching direction to form two sidewalls in the substrate covered by the plurality of linear walls, the two sidewalls are etched along a second etching direction, the first etching direction is perpendicular to first surface of the substrate, and the second etching direction is paralleled to first surface of the substrate, the plurality of three-dimensional structures are linear protruding structures, a cross-section of each linear protruding structure is an are, and the patterned mask layer remains during the step of etching the exposed portion;
forming a first semiconductor layer, an active layer, and a second semiconductor layer on the second surface;
electrically contacting a first electrode with the first semiconductor layer; and
applying a second electrode to cover a second semiconductor layer surface at a distance from the active layer.
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Abstract
A method for making a LED comprises following steps. A substrate having a first surface and a second surface is provided. A patterned mask layer is applied on a first surface. A number of three-dimensional nano-structures are formed on the first surface and the patterned mask layer is removed. A first semiconductor layer, an active layer and a second semiconductor layer are formed on the second surface. A first electrode and a second electrode are formed to electrically connect with the first semiconductor layer and the second semiconductor pre-layer respectively.
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Citations
20 Claims
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1. A method for making a light emitting diode, comprising steps of:
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providing a substrate having a first surface and a second surface; applying a patterned mask layer on the first surface, wherein the patterned mask layer comprises a plurality of linear walls aligned side by side, and a groove is defined between each adjacent linear walls to form an exposed portion of the first surface; etching the exposed portion and removing the patterned mask layer to form a plurality of three-dimensional structures, wherein the exposed portion is etched along a first etching direction to form two sidewalls in the substrate covered by the plurality of linear walls, the two sidewalls are etched along a second etching direction, the first etching direction is perpendicular to first surface of the substrate, and the second etching direction is paralleled to first surface of the substrate, the plurality of three-dimensional structures are linear protruding structures, a cross-section of each linear protruding structure is an are, and the patterned mask layer remains during the step of etching the exposed portion; forming a first semiconductor layer, an active layer, and a second semiconductor layer on the second surface; electrically contacting a first electrode with the first semiconductor layer; and applying a second electrode to cover a second semiconductor layer surface at a distance from the active layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method for making a light emitting diode, comprising steps of:
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providing a substrate having a first surface and a second surface; forming a first semiconductor layer, an active layer and a second semiconductor layer on the second surface; applying a first electrode electrically contacting with the first semiconductor layer; applying a second electrode to cover a second semiconductor layer surface away from the active layer applying a patterned mask layer on the first surface, wherein the patterned mask layer comprises a plurality of linear walls aligned side by side, and a groove is defined between each adjacent linear walls to form an exposed portion of the first surface; and etching the exposed portion along a first direction and a second direction and removing the patterned mask layer to form a plurality of three-dimensional structures, wherein the exposed portion is etched along the first etching direction to form two sidewalls in the substrate covered by the plurality of linear walls, the two sidewalls are etched along the second etching direction, the first direction is substantially perpendicular to the first surface, the second direction is substantially paralleled to the first surface, and the patterned mask layer remains during the step of etching the exposed portion. - View Dependent Claims (18, 19, 20)
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Specification