Multi wireless charging apparatus and method for manufacturing the same

• US 9,178,378 B2
• Filed: 09/11/2012
• Issued: 11/03/2015
• Est. Priority Date: 10/25/2011
• Status: Active Grant

• Current Assignee: Wit Co., Ltd.
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Yoon, Young Seok
• Primary Examiner(s): Levin, Naum B
• Application Number:
  US13/610,647
• Publication Number:
  US 20130099730A1
• Time in Patent Office: 1,148 Days
• US Class Current: 1/1
• CPC Class Codes: H02J 50/005 Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices
• CPC Class Codes: H02J 50/10 using inductive coupling
• CPC Class Codes: H02J 50/402 the two or more transmitting or the two or more receiving devices being integrated in the same unit, e.g. power mats with several coils or antennas with several sub-antennas
• CPC Class Codes: H02J 50/70 involving the reduction of electric, magnetic or electromagnetic leakage fields
• CPC Class Codes: H02J 7/0013 acting upon several batteries simultaneously or sequentially H02J7/1423 takes precedence
• CPC Class Codes: H02J 7/0042 characterised by the mechanical construction
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/0715 provided by an outer layer of PCB
• CPC Class Codes: H05K 2201/086 for inductive purposes, e.g. printed inductor with ferrite core
• CPC Class Codes: H05K 3/10 in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• CPC Class Codes: H05K 3/4611 by laminating two or more circuit boards H05K3/4652 takes precedence
• CPC Class Codes: H05K 3/4691 Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
• CPC Class Codes: H05K 3/4697 having cavities, e.g. for mounting components H05K3/4691 takes precedence
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

The multi wireless charging apparatus of the present invention includes a control unit generally controlling a wireless charging procedure; a plurality of wireless charging units electrically connected to the control unit; and folding units connecting between the wireless charging units, the folding units each having a void therein, which passes through both lateral surfaces thereof, and thereby to be folded up or down.

Also, in the multi wireless charging apparatus of the present invention, each of the wireless charging units includes a shielding film made of a conductive material, such as conductive paste or ferrite, and formed on a lower surface thereof, for electromagnetic field shielding.

Claims

1. A multi wireless charging apparatus, comprising:

a control unit generally controlling a wireless charging procedure;

a plurality of wireless charging units electrically connected to the control unit, each of the plurality of wireless charging units supported by a rigid base layer; and

folding units connecting between the wireless charging units, the folding units each having a void therein and being between neighboring wireless charging units, and thereby to be folded up or down.

2. The multi wireless charging apparatus as set forth in claim 1, wherein the wireless charging unit includes a shielding film made of a conductive material and formed on a lower surface thereof, for electromagnetic field shielding.

3. The multi wireless charging apparatus as set forth in claim 2, wherein the conductive material is conductive paste or ferrite.

4. The multi wireless charging apparatus as set forth in claim 1, wherein the folding units each have the void between at least two double-sided FCCLs, and are folded up or down to allow the plurality of wireless charging units to be stacked in a joining type.

5. The multi wireless charging apparatus as set forth in claim 1, wherein the wireless charging unit includes:

double-sided flexible copper clad laminates (FCCLs) bonded on an upper surface or a lower surface of the rigid base layer by using the rigid base layer therebetween, wherein the double-sided FCCLs each have a circuit layer formed on an upper surface or a lower surface thereof.

6. The multi wireless charging apparatus as set forth in claim 5, wherein the rigid base layer is formed by using a prepreg in which a glass fiber is impregnated with a thermosetting resin.

7. The multi wireless charging apparatus as set forth in claim 5, wherein the circuit layer includes:

a coil pattern consisting of closed loops;

a first end disposed inside the coil pattern;

a first electrode pattern spaced apart from the first end and disposed outside the closed loops of the coil pattern; and

a wiring pattern electrically connecting the first end and the first electrode pattern through a first conductive via hole H1 and a second conductive via hole H2 passing through the double-sided FCCLs.

8. The multi wireless charging apparatus as set forth in claim 5, wherein the wireless charging unit further includes a cover layer covering an uppermost surface or a lowermost surface of the double-sided FCCLs.

9. The multi wireless charging apparatus as set forth in claim 8, wherein the cover layer is an insulating layer made of a thermosetting material and bonded by using an adhesive.

10. The multi wireless charging apparatus as set forth in claim 8, wherein the cover layer is a solder resist coated and hardened layer.

11. A method for manufacturing a multi wireless charging apparatus, comprising:

preparing at least two double-sided FCCLs having circuit patterns formed on an upper surface or a lower surface thereof;

compressing the double-sided FCCLs by using rigid base layers therebetween, the rigid base layers being disposed in regions of a plurality of wireless charging units;

forming a wiring pattern electrically connecting the circuit patterns through a first conductive via hole H1 and a second conductive via hole H2 passing through the compressed double-sided FCCLs and the rigid base layer, in a region of the wireless charging unit;

forming cover layers covering external surfaces of the double-sided FCCLs; and

mounting component devices on a region of a control unit electrically connected to the wireless charging units,

wherein the plurality of wireless charging units are supported by the rigid base layer, and

neighboring wireless charging units are folded up or down based on a void formed in a folding unit between wireless charging units.

12. The method as set forth in claim 11, wherein in the preparing of the double-sided FCCLs, the circuit patterns include:

coil patterns each consisting of closed loops;

first ends disposed inside the coil patterns; and

first electrode patterns spaced apart from the first ends and disposed outside the closed loops of the coil patterns.

13. The method as set forth in claim 12, wherein in the forming of the wiring pattern, the wiring pattern electrically connects the first ends and the first electrode patterns through the first conductive via hole H1 and the second conductive via hole H2.

14. The method as set forth in claim 11, wherein the compressing of the double-sided FCCLs includes:

forming the plurality of rigid base layers made of a prepreg in which a glass fiber is impregnated with a thermosetting resin;

disposing the rigid base layers in the regions of the wireless charging units such that the rigid base layers are spaced apart from each other at a distance corresponding to a region of each folding unit; and

heat-compressing the double-sided FCCLs by using the rigid base layers therebetween.

15. The method as set forth in claim 11, wherein the forming of the cover layers includes:

bonding an insulating layer made of a thermosetting material by using an adhesive on the external surfaces of the double-sided FCCLs; and

providing shielding films made of a conductive material and formed on an external surface of the insulating layer, in the regions of the wireless charging units, for electromagnetic field shielding.

16. The method as set forth in claim 15, wherein the conductive material is conductive paste or ferrite.

17. The method as set forth in claim 11, wherein the forming of the cover layers includes:

forming a solder resist layer by coating and hardening solder resist on the external surfaces of the double-sided FCCLs; and

providing shielding films made of a conductive material and formed on an external surface of the solder resist layer, in the regions of the wireless charging units, for electromagnetic field shielding.

18. The method as set forth in claim 17, wherein the conductive material is conductive paste or ferrite.