Handheld imaging device with integrated chip incorporating on shared wafer image processor and central processor

• US 9,179,020 B2
• Filed: 09/15/2012
• Issued: 11/03/2015
• Est. Priority Date: 07/15/1997
• Status: Expired due to Fees

• Current Assignee: Google LLC (Alphabet Inc.)
• Original Assignee: Google Inc. (Alphabet Inc.)
• Inventors: Silverbrook, Kia
• Primary Examiner(s): Menberu, Beniyam
• Application Number:
  US13/620,969
• Publication Number:
  US 20130010129A1
• Time in Patent Office: 1,144 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: B41J 15/044 Cassettes or cartridges containing continuous copy material, tape, for setting into printing devices
• CPC Class Codes: B41J 2/14 Structure thereof only for on-demand ink jet heads
• CPC Class Codes: B41J 2/14427 Structure of ink jet print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/16 Production of nozzles
• CPC Class Codes: B41J 2/1601 Production of bubble jet print heads B41J2/1606, B41J2/162 take precedence
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1626 etching
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1629 wet etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1635 dividing the wafer into individual chips
• CPC Class Codes: B41J 2/1637 molding
• CPC Class Codes: B41J 2/1639 sacrificial molding
• CPC Class Codes: B41J 2/1642 thin film formation by CVD [chemical vapor deposition]
• CPC Class Codes: B41J 2/1643 thin film formation by plating
• CPC Class Codes: B41J 2/1645 thin film formation by spincoating
• CPC Class Codes: B41J 2/1646 thin film formation by sputtering
• CPC Class Codes: B41J 2/1648 Production of print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/16585 for paper-width or non-reciprocating print heads
• CPC Class Codes: B41J 2/175 : Ink supply systems ; Circuit parts therefor
• CPC Class Codes: B41J 2/17503 : Ink cartridges
• CPC Class Codes: B41J 2/17513 : Inner structure
• CPC Class Codes: B41J 2/17546 : electronically
• CPC Class Codes: B41J 2/17596 : Ink pumps, ink valves
• CPC Class Codes: B41J 2002/041 : Electromagnetic transducer
• CPC Class Codes: B41J 2002/14491 : Electrical connection
• CPC Class Codes: B41J 2202/21 : Line printing
• CPC Class Codes: B41J 29/02 : Framework
• CPC Class Codes: B42D 15/02 : Postcards; Greeting, menu, business or like cards; Letter cards or letter-sheets B42D25/00 takes precedence; envelopes B65D27/00
• CPC Class Codes: B42D 2035/08 : Alphanumerical data
• CPC Class Codes: B42D 2035/34 : Markings visible under particular conditions or containing coded information
• CPC Class Codes: B42D 2035/50 : Corresponding markings appearing in different shapes or at different places
• CPC Class Codes: B42D 25/00 : Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof printing processes to produce identification or security features B41M3/14
• CPC Class Codes: B42D 25/20 : characterised by a particular use or purpose
• CPC Class Codes: B42D 25/23 : Identity cards
• CPC Class Codes: B82Y 30/00 : Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: G03B 17/02 : Bodies
• CPC Class Codes: G03B 27/00 : Photographic printing apparatus
• CPC Class Codes: G03B 27/02 : Exposure apparatus for contact printing
• CPC Class Codes: G06F 1/1626 : with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
• CPC Class Codes: G06F 12/0866 : for peripheral storage systems, e.g. disk cache
• CPC Class Codes: G06F 21/79 : in semiconductor storage media, e.g. directly-addressable memories
• CPC Class Codes: G06F 21/86 : Secure or tamper-resistant housings
• CPC Class Codes: G06F 2212/2022 : Flash memory
• CPC Class Codes: G06F 2221/2129 : Authenticate client device independently of the user
• CPC Class Codes: G06F 3/12 : Digital output to print unit , e.g. line printer, chain printer
• CPC Class Codes: G06K 1/121 : by printing code marks applying code marks to labels B65C9/46; marking or coding completed packages B65B61/26
• CPC Class Codes: G06K 19/06037 : multi-dimensional coding
• CPC Class Codes: G06K 19/073 : Special arrangements for circuits, e.g. for protecting identification code in memory protection against unauthorised use of computer memory G06F12/14
• CPC Class Codes: G06K 7/10722 : Photodetector array or CCD scanning
• CPC Class Codes: G06K 7/14 : using light without selection of wavelength, e.g. sensing reflected white light G06K7/10831 - G06K7/1097 take precedence
• CPC Class Codes: G06K 7/1417 : 2D bar codes
• CPC Class Codes: G06T 1/20 : Processor architectures; Processor configuration, e.g. pipelining
• CPC Class Codes: G06T 3/02 : Affine transformations for image registration G06T3/147; for image mosaicing G06T3/4038
• CPC Class Codes: G07F 7/08 : by coded identity card or credit card or other personal identification means without personal verification means G07F7/02
• CPC Class Codes: G07F 7/086 : by passive credit-cards adapted therefor, e.g. constructive particularities to avoid counterfeiting, e.g. by inclusion of a physical or chemical security-layer for security documents G07D7/00; for the reading of record-carriers in general G06K7/00; for the design of coded credit-cards G06K19/10
• CPC Class Codes: G07F 7/12 : Card verification
• CPC Class Codes: G09G 2300/026 : Video wall, i.e. juxtaposition of a plurality of screens to create a display screen of bigger dimensions
• CPC Class Codes: G09G 2310/0281 : Arrangement of scan or data electrode driver circuits at the periphery of a panel not inherent to a split matrix structure
• CPC Class Codes: G11C 11/56 : using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
• CPC Class Codes: G11C 16/22 : Safety or protection circuits preventing unauthorised or accidental access to memory cells
• CPC Class Codes: H01L 23/576 : using active circuits
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H04N 1/00127 : Connection or combination of a still picture apparatus with another apparatus, e.g. for storage, processing or transmission of still picture signals or of information associated with a still picture
• CPC Class Codes: H04N 1/00278 : with a printing apparatus, e.g. a laser beam printer
• CPC Class Codes: H04N 1/00326 : with a data reading, recognizing or recording apparatus, e.g. with a bar-code apparatus arrangements for the associated working of recording or reproducing apparatus with related apparatus G11B31/00
• CPC Class Codes: H04N 1/00355 : Mark-sheet input sensing record carriers G06K7/00; character recognition G06V30/10; document-oriented image-based pattern recognition G06V30/40
• CPC Class Codes: H04N 1/0044 : for image preview or review, e.g. to help the user position a sheet
• CPC Class Codes: H04N 1/00965 : using a plug-in memory module, e.g. memory card, memory stick
• CPC Class Codes: H04N 1/00968 : by scanning marks on a sheet mark-sheet input means H04N1/00355; sensing record carriers G06K7/00
• CPC Class Codes: H04N 1/04 : Scanning arrangements , i.e. arrangements for the displacement of active reading or reproducing elements relative to the original or reproducing medium, or vice versaH04N1/387 takes precedence
• CPC Class Codes: H04N 1/2112 : using still video cameras
• CPC Class Codes: H04N 1/2154 : the still video camera incorporating a hardcopy reproducing device, e.g. a printer
• CPC Class Codes: H04N 1/2307 : Circuits or arrangements for the control thereof, e.g. using a programmed control device, according to a measured quantity H04N1/27, H04N1/29 take precedence
• CPC Class Codes: H04N 1/32122 : in a separate device, e.g. in a memory or on a display separate from image data
• CPC Class Codes: H04N 1/32133 : on the same paper sheet, e.g. a facsimile page header
• CPC Class Codes: H04N 2101/00 : Still video cameras
• CPC Class Codes: H04N 2201/0008 : Connection or combination of a still picture apparatus with another apparatus
• CPC Class Codes: H04N 2201/0084 : Digital still camera
• CPC Class Codes: H04N 2201/3222 : of processing required or performed, e.g. forwarding, urgent or confidential handling
• CPC Class Codes: H04N 2201/3242 : of processing required or performed, e.g. for reproduction or before recording H04N2201/3256 and subgroups take precedence
• CPC Class Codes: H04N 2201/3261 : of multimedia information, e.g. a sound signal
• CPC Class Codes: H04N 2201/3264 : of sound signals
• CPC Class Codes: H04N 2201/3269 : of machine readable codes or marks, e.g. bar codes or glyphs
• CPC Class Codes: H04N 2201/3276 : of a customised additional information profile, e.g. a profile specific to a user ID
• CPC Class Codes: H04N 2201/328 : Processing of the additional information
• CPC Class Codes: H04N 23/00 : Cameras or camera modules comprising electronic image sensors; Control thereof
• CPC Class Codes: H04N 23/843 : Demosaicing, e.g. interpolating colour pixel values
• CPC Class Codes: H04N 25/00 : Circuitry of solid-state image sensors [SSIS]; Control thereof
• CPC Class Codes: H04N 25/76 : Addressed sensors, e.g. MOS or CMOS sensors
• CPC Class Codes: H04N 5/2628 : Alteration of picture size, shape, position or orientation, e.g. zooming, rotation, rolling, perspective, translation
• CPC Class Codes: H05K 1/14 : Structural association of two or more printed circuits providing electric connection to or between printed circuits H05K1/11, H01R12/00
• CPC Class Codes: H05K 1/189 : characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: Y10S 358/9091 : Electronic still camera or scene reproducer

Abstract

A handheld imaging device includes an image sensor for sensing an image; an integrated chip provided on a wafer substrate, the integrated chip integrating on the wafer substrate a dedicated image processor for processing the sensed image, and an image sensor interface for receiving signals from the image sensor; a plurality of processing units provided in the dedicated image processor, the plurality of processing units connected in parallel by a crossbar switch to form a multi-core processing unit for the processor; and a CPU provided in the integrated chip for performing general operating system duties. A transfer of data from the image sensor interface to the dedicated image processor is conducted entirely within the integrated chip and on the shared wafer substrate.

Claims

1. A portable imaging device, comprising:

an image sensor configured for generating signals carrying data related to an image sensed by the image sensor;

an integrated chip provided on a wafer substrate, the integrated chip integrating on the wafer substrate an image processor for processing the image sensed by the image sensor, an image sensor interface for receiving signals from the image sensor, an input buffer for receiving data from the image sensor interface, and an output buffer;

a plurality of processing units provided in the image processor, the plurality of processing units connected in parallel by a crossbar switch to form a multi-core processing unit for the processor;

a data cache integrated in the integrated chip, the data cache connected to the plurality of processing units via a plurality of buses;

a CPU indirectly connected to the crossbar switch is provided in the integrated chip for performing general operating system duties, wherein;

a transfer of data from the image sensor interface to the image processor is conducted entirely within the integrated chip and on the shared wafer substrate;

the crossbar switch is separate from the plurality of buses;

the input buffer is configured to send data to each of the plurality of processing units;

the output buffer is configured to receive data from each of the plurality of processing units; and

the input buffer is separate from the output buffer.

2. The device according to claim 1, further comprising a scanner for scanning a surface for the presence of dots printed thereon.

3. The device according to claim 2, wherein the integrated chip further comprises a scanner interface for receiving from the scanner data indicative of the presence of dots scanned from the surface, and decoding the dots into an image processing script.

4. The device according to claim 3, wherein the CPU is further configured to execute an image processing language interpreter on the image processing script, and provide instructions to the image processor to process the image sensed by the image sensor in accordance with the image processing script.

5. The device according to claim 1, wherein the integrated chip further comprises a print head interface, the print head interface for reading dither-formatted data from the output buffer and passing the dither-formatted data to a print head.

6. The device according to claim 1, wherein the image sensor is a charge-coupled device (CCD), and the image sensor interface includes an analogue/digital converter for converting signals passing between the processor and the CCD.

7. The device according to claim 1, wherein each of the plurality of processing units includes two I/O address generators, and each I/O address generator is connected to a respective one of the plurality of buses.

8. The device according to claim 1, further comprising a printer for printing out the image sensed by the image sensor.

9. The device according to claim 8, further comprising, on the wafer substrate, a print head interface for receiving print data from the plurality of processing units, and sending the print data to the printer.

10. The device according to claim 1, wherein the image sensor interface is configured for converting the signals to a format readable by the plurality of processing units and providing control information from the integrated chip to the image sensor.

11. The device of claim 10, wherein the control information comprises a frame sync pulse and a pixel clock.

12. The device according to claim 7, further comprising a memory external to the integrated chip and configured for storing the data related to the image sensed by the image sensor, wherein the two I/O address generators of each of the plurality of processing units are configured for controlling a transfer of the data related to the image sensed by the image sensor from the image sensor interface to and from the memory.

13. The device according to claim 12, wherein the data cache is disposed between the memory and the plurality of processing units.

14. The device according to claim 13, wherein the two I/O address generators of each of the plurality of processing units controls the transfer of data from the image sensor interface to and from the data cache.

15. The device according to claim 14, wherein the integrated chip further comprises a memory interface separate from the image sensor interface and configured to provide an interface between the data cache and the memory.

16. The device according to claim 1, wherein the CPU is configured to be interrupted whenever data is placed into the output buffer, allowing the CPU to only process the data as it becomes available rather than polling the output buffer continuously.

17. The device according to claim 1, wherein at least one processing unit in the plurality of processing units further comprises at least one internal crossbar for data transport.

18. The device according to claim 1, further comprising:

a second image sensor configured for generating signals carrying data related to a second image sensed by the second image sensor;

the integrated chip further integrating a second image sensor interface configured for receiving the signals from the second image sensor; and

the image sensor interface is separate from the second image sensor interface.

19. The device according to claim 1, wherein each processor in the plurality of processors has an internal microcode RAM to hold a program for that particular processor.

20. The device according to claim 19, wherein the CPU is configured to load the microcode RAM of each processor in the plurality of processors.