Image sensing unit, 3D image processing apparatus, 3D camera system, and 3D image processing method

• US 9,179,128 B2
• Filed: 08/27/2013
• Issued: 11/03/2015
• Est. Priority Date: 11/20/2012
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: Park, Chan-Young, Song, Ok-Keun
• Primary Examiner(s): Haskins, Twyler
• Assistant Examiner(s): Haliyur, Padma
• Application Number:
  US14/011,311
• Publication Number:
  US 20140139636A1
• Time in Patent Office: 798 Days
• Field of Search: 348/46, 348/345, 348/340, 348/351, 348/207.99, 348/219.1
• US Class Current: 1/1
• CPC Class Codes: H04N 13/207 using a single 2D image sensor
• CPC Class Codes: H04N 25/702 SSIS architectures characterised by non-identical, non-equidistant or non-planar pixel layout

Abstract

An image sensing unit is disclosed. In one aspect, the sensing unit includes optical sensors for acquiring a two dimensional (2D) image from a subject and micro-structures for supporting the optical sensors and adjusting the heights of the optical sensors.

Claims

1. An image sensing unit, comprising:

a plurality of optical sensors configured to obtain a two dimensional (2D) image from a subject; and

a plurality of micro-structures configured to support the optical sensors and adjust heights of the optical sensors based on electrostatic force applied thereto,

wherein each of the micro-structures comprises a plurality of electrodes, and wherein the micro-structures are configured to adjust the heights of the optical sensors based on electrostatic force applied to the electrodes.

2. An image sensing unit, comprising:

a plurality of optical sensors configured to obtain a two dimensional (2D) image from a subject; and

a plurality of micro-structures configured to support the optical sensors and adjust heights of the optical sensors,

wherein each of the micro-structures comprises;

a substrate;

a first electrode located on the substrate;

a first column extending upward in a first height from one end of the substrate adjacent to the first electrode;

a second electrode extending from the end of the first column in the surface direction of the substrate, facing the first electrode and supporting the optical sensors;

a second column spaced apart from the first column with the first electrode located between the second column and the first column, wherein the second column extends upward from the other end of the substrate in a second height greater than the first height; and

a third electrode extending from the end of the second column in the surface direction of the substrate and facing the second electrode.

3. The image sensing unit of claim 2, wherein the end of the second electrode is located between the first electrode and the third electrode and wherein the first to third electrodes are configured to receive voltages having different polarities.

4. The image sensing unit of claim 3, wherein the end of the second electrode is configured to move to the first electrode when voltages having different polarities are applied to the first electrode and the second electrode, and wherein the end of the second electrode is configured to move to the third electrode when voltages having different polarities are applied to the second electrode and the third electrode.

5. A three dimensional (3D) image processing apparatus, comprising:

an image sensing unit comprising

     1) a plurality of optical sensors configured to obtain a two dimensional (2D) image from a subject and

     2) a plurality of micro-structures configured to support the optical sensors and adjust heights of the optical sensors based on electrostatic force applied thereto; and

an image processor connected to the optical sensors and micro-structures included in the image sensing unit, wherein the image processor is configured to drive the micro-structures to adjust the heights of the optical sensors to generate height information of the optical sensors and process a 2D image into a 3D image on the basis of the height information of the optical sensors,

wherein each of the micro-structures comprises a plurality of electrodes, and wherein the micro-structures are configured to adjust the heights of the optical sensors based on electrostatic force applied to the electrodes.

6. The 3D image processing apparatus of claim 5, further comprising an image storage unit connected to the image processor and storing the 3D image.

7. A three dimensional (3D) camera system, comprising:

an image sensing unit comprising

     1) a plurality of optical sensors configured to obtain a two dimensional (2D) image from a subject and

     2) a plurality of micro-structures configured to support the optical sensors and adjust heights of the optical sensors based on electrostatic force applied thereto;

an image processor connected to the optical sensors and micro-structures included in the image sensing unit, wherein the image processor is configured to drive the micro-structures to adjust the heights of the optical sensors to generate height information of the optical sensors and process a 2D image into a 3D image on the basis of the height information of the optical sensors; and

a lens assembly located between the 3D image processing apparatus and a subject, wherein the lens assembly is configured to magnify or reduce a 2D image of the subject, acquired by the optical sensors included in the 3D image processing apparatus,

wherein each of the micro-structures comprises a plurality of electrodes, and wherein the micro-structures are configured to adjust the heights of the optical sensors based on electrostatic force applied to the electrodes.

8. A three dimensional (3D) image processing method, comprising:

providing a 3D image processing apparatus, wherein the 3D image processing apparatus comprises i) an image sensing unit including

     1) a plurality of optical sensors configured to obtain a two dimensional (2D) image from a subject and

     2) a plurality of micro-structures configured to support the optical sensors and adjust heights of the optical sensors; and

ii) an image processor connected to the optical sensors and micro-structures included in the image sensing unit, wherein the image processor is configured to drive the micro-structures to adjust the heights of the optical sensors to generate height information of the optical sensors and process a 2D image into a 3D image on the basis of the height information of the optical sensors;

acquiring a 2D image of a subject;

storing the 2D image;

adjusting the heights of optical sensors included in the 3D image processing apparatus and comparing sensing values sensed by the optical sensors; and

processing the 2D image into a 3D image on the basis of height information of the optical sensors.

9. The 3D image processing method of claim 8, wherein the sensing values correspond to the quantities of light sensed by the optical sensors.

10. The 3D image processing method of claim 8, wherein the sensing values correspond to focuses of the subject, sensed by the optical sensors.