Power semiconductor device and power conversion device

• US 9,179,581 B2
• Filed: 06/20/2011
• Issued: 11/03/2015
• Est. Priority Date: 06/21/2010
• Status: Active Grant

• Current Assignee: Hitachi Astemo Ltd. (Hitachi, Ltd.)
• Original Assignee: Hitachi Automotive Systems Limited (Hitachi, Ltd.)
• Inventors: Suwa, Tokihito, Kaneko, Yujiro, Takagi, Yusuke, Fujino, Shinichi, Shimura, Takahiro
• Primary Examiner(s): Sinclair, David M
• Assistant Examiner(s): MILLISER, THERON S
• Application Number:
  US13/163,950
• Publication Number:
  US 20110310585A1
• Time in Patent Office: 1,597 Days
• Field of Search: 361/820
• US Class Current: 1/1
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/06181 On opposite sides of the body
• CPC Class Codes: H01L 2224/291 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/29139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/33181 On opposite sides of the body
• CPC Class Codes: H01L 2224/37099 Material
• CPC Class Codes: H01L 2224/37599 Material
• CPC Class Codes: H01L 2224/40137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73215 Layer and wire connectors
• CPC Class Codes: H01L 2224/73221 Strap and wire connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83801 Soldering or alloying
• CPC Class Codes: H01L 2224/8384 Sintering
• CPC Class Codes: H01L 2224/84 using a strap connector
• CPC Class Codes: H01L 23/3107 : the device being completely enclosed
• CPC Class Codes: H01L 23/473 : by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 23/49562 : for devices being provided for in H01L29/00
• CPC Class Codes: H01L 23/49575 : Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/33 : of a plurality of layer connectors
• CPC Class Codes: H01L 24/34 : Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/36 : Structure, shape, material or disposition of the strap connectors prior to the connecting process
• CPC Class Codes: H01L 24/40 : of an individual strap connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/112 : Mixed assemblies
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/013 : Alloys
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/1203 : Rectifying Diode
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H02M 7/537 : using semiconductor devices only, e.g. single switched pulse inverters
• CPC Class Codes: H05K 5/0247 : Electrical details of casings, e.g. terminals, passages for cables or wiring
• CPC Class Codes: H05K 7/1432 : specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14322 : wherein the control and power circuits of a power converter are arranged within the same casing
• CPC Class Codes: H05K 7/20845 : for automotive electronic casings H05K7/2089 takes precedence
• CPC Class Codes: H05K 7/2089 : for power electronics, e.g. for inverters for controlling motor
• CPC Class Codes: H05K 7/20927 : Liquid coolant without phase change

Abstract

A power semiconductor device includes a plurality of power semiconductor elements constituting upper and lower arms of an inverter circuit, a first sealing member sealing the plurality of power semiconductor elements, a positive electrode-side terminal and a negative electrode-side terminal each connected with any of the plurality of power semiconductor elements and protruding from the first sealing member, a second sealing member sealing at least a part of the positive electrode-side terminal and at least a part of the negative electrode-side terminal, and a case in which the power semiconductor elements sealed with the first sealing member are housed.

Claims

1. A power semiconductor device, comprising:

a series circuit of a first power semiconductor element for an upper arm of an inverter and a second power semiconductor element for a lower arm of the inverter;

a first sealing member sealing the series circuit;

an internal terminal protruding from the first sealing member, for supplying DC power to the series circuit; and

an external wiring including an inner-side external terminal connected to the internal terminal and an outer-side external terminal, wherein;

the series circuit comprises a first positive conductor plate and a first negative conductor plate that are arranged opposite to each other so that the first power semiconductor element is sandwiched between the first positive conductor plate and the first negative conductor plate, and also comprises a second positive conductor plate and a second negative conductor plate that are arranged opposite to each other so that the second power semiconductor element is sandwiched between the second positive conductor plate and the second negative conductor plate;

the first positive conductor plate and the first negative conductor plate each have two opposite surfaces, one of which faces toward the first power semiconductor element and the other of which is exposed from the first sealing member;

the second positive conductor plate and the second negative conductor plate each have two opposite surfaces, one of which faces toward the second power semiconductor element and the other of which is exposed from the first sealing member;

the first negative conductor plate and the second positive conductor plate are electrically connected with each other;

the internal terminal comprises a first positive connection terminal formed on the first positive conductor plate, a first negative connection terminal formed on the second negative conductor plate, and a first AC connection terminal formed on the second positive conductor plate;

the external wiring comprises a positive wiring, a negative wiring and an AC wiring;

the inner-side external terminal comprises a second positive connection terminal formed on one side of the positive wiring, a second negative connection terminal formed on one side of the negative wiring, and a second AC connection terminal formed on one side of the AC wiring;

the outer-side external terminal comprises a third positive connection terminal formed on the other side of the positive wiring, a third negative connection terminal formed on the other side of the negative wiring, and a third AC connection terminal formed on the other side of the AC wiring;

each of the first positive connection terminal, the first negative connection terminal, the first AC connection terminal, the positive wiring, the negative wiring, and the AC wiring has a main surface and a side surface, the respective side surface being perpendicular to and smaller than the respective main surface;

the first positive connection terminal, the first negative connection terminal, and the first AC connection terminal are aligned along one surface of the first sealing member across a direction along which the first positive conductor plate, the second negative conductor plate and the second positive conductor plate are arranged at their portions protruding from the first sealing member so that the side surfaces of the first positive connection terminal, the first negative connection terminal and the first AC connection terminal are opposite to each other;

the positive wiring, the negative wiring, and the AC wiring are arranged so that the second positive connection terminal, the second negative connection terminal and the second AC connection terminal are aligned along the first positive connection terminal, the first negative connection terminal and the first AC connection terminal, and are also arranged so that the main surfaces of the positive wiring and the negative wiring are at least partially opposite to each other at the third positive connection terminal and the third negative connection terminal to form a layer structure; and

the first positive connection terminal, the first negative connection terminal, and the first AC connection terminal are connected to the second positive connection terminal, the second negative connection terminal and the second AC connection terminal respectively, such that magnetic fluxes are generated in directions canceling each other out by current flowing in the first positive connection terminal and the first negative connection terminal through each layer of the layer structure of the positive wiring and the negative wiring.

2. A power semiconductor device according to claim 1, further comprising a case in which the series circuit sealed with the first sealing member and the internal terminal are housed, wherein:

the case is formed of an electrically conductive member; and

an eddy current is induced in the case by current flowing through the series circuit connected to the internal terminal.

3. A power semiconductor device according to claim 1, further comprising a case in which the series circuit sealed with the first sealing member and the internal terminal are housed, wherein:

the case is provided with a heat dissipation surface including fins for heat dissipation outside thereof; and

the power semiconductor elements, constituting the series circuit sealed with the first sealing member, are arranged opposite to the heat dissipation surface inside the case.

4. A power semiconductor device according to claim 1, further comprising:

a control terminal that transmits a drive signal of the first and second power semiconductor elements; and

a bus bar for the control terminal connected by metallic bonding to the control terminal.

5. A power semiconductor device according to claim 4, wherein:

the control terminal and the internal terminal each protrude in a same direction from the first sealing member;

the control terminal and the internal terminal are each bent in a same direction at each of their ends; and

a bent end of the control terminal and that of the internal terminal are metallically bonded with the bus bar for control terminal and the inner-side external terminal, respectively.

6. A power semiconductor device according to claim 5, wherein:

the control terminal and the internal terminal are aligned at their portions protruding from the first sealing member.

7. A power semiconductor device according to claim 1, further comprising a case in which the series circuit sealed with the first sealing member and the internal terminal are housed, wherein:

the case has one opening face;

the connection section between the internal terminal and the inner-side external terminal is arranged inward of the case from the opening face; and

the outer-side external terminal extends out of the case from the opening face.

8. A power semiconductor device according to claim 1, further comprising:

a supporting member supporting the external wiring;

a flow path former that forms a flow path; and

a case in which the series circuit sealed with the first sealing member and the internal terminal are housed, wherein;

the case is mechanically connected to the flow path former; and

the supporting member is fixed to the case.

9. A power semiconductor device according to claim 1, further comprising:

a second sealing member sealing a connection section between the internal terminal and the inner-side external terminal; and

a case in which the series circuit sealed with the first sealing member and the internal terminal are housed, wherein;

the second sealing member is filled in a space between an inside of the case and the first sealing member.