Method of manufacturing a sensor for sensing analytes
First Claim
1. A method of manufacturing a sensor for sensing analytes, the method comprising:
- with a dicing saw, removing material from a substrate, thereby forming an array of columnar protrusions at a first surface of the substrate;
forming an insulating layer coupled to exposed surfaces of the substrate and exposed surfaces of the array of columnar protrusions;
removing a portion of the insulating layer at a second surface of the substrate, directly opposed to the first surface of the substrate;
with the dicing saw, removing material from a distal end of each columnar protrusion in the array of columnar protrusions, thereby defining a sharp tip, uncovered by the insulating layer, at the distal end of each columnar protrusion in the array of columnar protrusions; and
coupling a conductive layer to the sharp tip of each columnar protrusion in the array of columnar protrusions.
3 Assignments
0 Petitions
Accused Products
Abstract
A method of manufacturing a sensor for sensing analytes, the method including: with a dicing saw, removing material from a substrate, thereby forming an array of columnar protrusions at a first surface of the substrate; forming an insulating layer coupled to exposed surfaces of the substrate and exposed surfaces of the array of columnar protrusions; removing a portion of the insulating layer at a second surface of the substrate, directly opposed to the first surface of the substrate; with the dicing saw, removing material from a distal end of each columnar protrusion in the array of columnar protrusions, thereby defining a sharp tip, uncovered by the insulating layer, at the distal end of each columnar protrusion in the array of columnar protrusions; and coupling a conductive layer to the sharp tip of each columnar protrusion in the array of columnar protrusions.
43 Citations
9 Claims
-
1. A method of manufacturing a sensor for sensing analytes, the method comprising:
-
with a dicing saw, removing material from a substrate, thereby forming an array of columnar protrusions at a first surface of the substrate; forming an insulating layer coupled to exposed surfaces of the substrate and exposed surfaces of the array of columnar protrusions; removing a portion of the insulating layer at a second surface of the substrate, directly opposed to the first surface of the substrate; with the dicing saw, removing material from a distal end of each columnar protrusion in the array of columnar protrusions, thereby defining a sharp tip, uncovered by the insulating layer, at the distal end of each columnar protrusion in the array of columnar protrusions; and coupling a conductive layer to the sharp tip of each columnar protrusion in the array of columnar protrusions. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
Specification