Pressure activated high density switch array
First Claim
1. A method for operating a testing system to test a device, wherein the testing system comprises a pressing module, the method comprising:
- attaching the device to the pressing module of the testing system;
while the testing system operates in a first mode of testing, pressing the pressing module to a first position such that (i) the device is electrically coupled to a first component via a first pin, and (ii) the device is electrically isolated from a second component via a second pin; and
while the testing system operates in a second mode of testing, pressing the pressing module to a second position such that (i) the device is electrically isolated from first component via the first pin, and (ii) the device is electrically coupled to the second component via the second pin.
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Abstract
Some of the embodiments of the present disclosure provide a method for operating a testing system to test a device, wherein the testing system comprises a pressing module, the method comprising attaching the device to the pressing module of the testing system; while the testing system operates in a first mode of testing, pressing the pressing module to a first position such that (i) the device is electrically coupled to a first component via a first pin, and (ii) the device is electrically isolated from a second component via a second pin; and while the testing system operates in a second mode of testing, pressing the pressing module to a second position such that (i) the device is electrically isolated from first component via the first pin, and (ii) the device is electrically coupled to the second component via the second pin.
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Citations
20 Claims
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1. A method for operating a testing system to test a device, wherein the testing system comprises a pressing module, the method comprising:
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attaching the device to the pressing module of the testing system; while the testing system operates in a first mode of testing, pressing the pressing module to a first position such that (i) the device is electrically coupled to a first component via a first pin, and (ii) the device is electrically isolated from a second component via a second pin; and while the testing system operates in a second mode of testing, pressing the pressing module to a second position such that (i) the device is electrically isolated from first component via the first pin, and (ii) the device is electrically coupled to the second component via the second pin. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A testing system configured to test a device, the testing system comprising:
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a pressing module, wherein the device is attached to the pressing module while the device is being tested; a first pin; and a second pin, wherein while the testing system operates in a first mode of testing, the pressing module is configured to be pressed to a first position such that (i) the device is electrically coupled to a first component via the first pin, and (ii) the device is electrically isolated from a second component via the second pin, and wherein while the testing system operates in a second mode of testing, the pressing module is configured to be pressed to a second position such that (i) the device is electrically isolated from first component via the first pin, and (ii) the device is electrically coupled to the second component via the second pin. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification