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Matched multiple charged particle beam systems for lithographic patterning, inspection, and accelerated yield ramp

  • US 9,184,027 B1
  • Filed: 01/28/2015
  • Issued: 11/10/2015
  • Est. Priority Date: 03/05/2013
  • Status: Active Grant
First Claim
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1. A system for writing resist-coated substrates using charged particle beams, comprising:

  • at least one lithography tool, and at least one inspection tool, said lithography tool and said inspection tool both comprising;

    a substrate stage;

    multiple charged particle beam columns, ones of said columns being configured to produce a charged particle beam, different ones of said beams targeting different corresponding portions of the substrate; and

    one or more beam controllers, configured to control said columns to write cut features to the substrate in said lithography tool, and configured to control said columns to image said features in said inspection tool, said features being specified by a design layout database;

    an inspection data analyzer, configured to receive said feature images from said columns, and to automatically identify one or more defects in ones of said features in at least partial dependence on said feature images and the design layout database; and

    a design layout database modifier, configured to automatically modify the design layout database in at least partial dependence on said identified defects;

    wherein said lithography tool and said inspection tool comprise substantially the same substrate stage and substantially the same columns, and the same design layout database is used by said lithography tool and said inspection tool.

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