Semiconductor device package adapter

• US 9,184,145 B2
• Filed: 04/25/2011
• Issued: 11/10/2015
• Est. Priority Date: 06/02/2009
• Status: Active Grant

• Current Assignee: HSIO Technologies LLC
• Original Assignee: HSIO Technologies LLC
• Inventors: Rathburn, James
• Primary Examiner(s): Williams, Alexander Oscar
• Application Number:
  US13/643,436
• Publication Number:
  US 20130105984A1
• Time in Patent Office: 1,660 Days
• Field of Search: 257/773, 257/737, 257/734, 257/738, 257/778, 257/780, 257/782, 257/779, 439/55, 439/65, 439/66, 295/92, 298/74, 438/107
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/14 of a plurality of bump connectors
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/20 Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/1306 Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01R 12/7076 for connection between PCB and component, e.g. display
• CPC Class Codes: H01R 13/6474 by variation of conductive properties, e.g. by dimension variations
• CPC Class Codes: H01R 13/6585 Shielding material individually surrounding or interposed between mutually spaced contacts
• CPC Class Codes: H01R 2201/20 for testing or measuring purposes
• CPC Class Codes: H05K 2201/10378 Interposers
• CPC Class Codes: H05K 2201/1059 : Connections made by press-fit insertion
• CPC Class Codes: H05K 2201/10734 : Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2201/10962 : Component not directly connected to the PCB
• CPC Class Codes: H05K 3/32 : electrically connecting electric components or wires to printed circuits
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components

Abstract

A semiconductor device packaged adapter for electrically coupling contacts on a first circuit member to contacts on a second circuit member. The adapter typically includes first and second substrates, each with arrays of terminals. Proximal ends of the first terminals on the first substrate are arranged to be soldered to the contacts on the first circuit member and proximal ends of the second terminals on the second substrate are arranged to be soldered to the contacts on the second circuit member. Complementary engaging structures located on distal ends of the first and second terminals engage to electrically and mechanically couple the first circuit member to the second circuit member.

Claims

1. A semiconductor device packaged adapter to electrically couple contacts on a first circuit member to contacts on a second circuit member, the adapter comprising:

a first substrate comprising a plurality of first terminals, proximal ends of the first terminals arranged to be soldered to the contacts on the first circuit member;

a second substrate comprising a plurality of second terminals, proximal ends of the second terminals arranged to be soldered to the contacts on the second circuit member; and

complementary inter-engaging structures located on distal ends of the first and second terminals that engage in a high surface area, multi-point electrical connection to electrically and mechanically couple the first circuit member to the second circuit member.

2. The adapter of claim 1 comprising recesses in the first substrate at proximal ends of the first terminals.

3. The adapter of claim 2 wherein the recesses are sized to receive solder balls on the first circuit member.

4. The adapter of claim 1 comprising recesses in the second substrate at proximal ends of the second terminals, the recesses sized to receive solder balls.

5. The adapter of claim 1 wherein the engaging structures on the second terminals extend above the second substrate.

6. The adapter of claim 1 comprising one or more layers on at least one of the first and second substrates, the layers comprising one of a ground plane, a power plane, or shielding.

7. The adapter of claim 1 comprising electrical shielding covered by a dielectric material surrounding at least the first terminals.

8. The adapter of claim 1 comprising electrical devices in one or more of the first and second substrates.

9. The adapter of claim 1 comprising at least one electrical device printed on the first or second substrate and electrically coupled to at least one terminal.

10. The adapter of claim 1 comprising routing traces on one or more of the first and second substrates, the routing traces changing a pitch between the proximal ends and distal ends of the terminals.

11. The adapter of claim 10 wherein routing traces comprise a conductive material printed in recesses in the first and second substrates.

12. The adapter of claim 1 wherein distal ends of the first terminals comprise at least one flexible beam configured to flex in response to engagement with distal ends of the second terminals.

13. The adapter of claim 1 comprising:

guide features on the first substrate located near distal ends of the first terminals; and

recesses on the second substrate locate near distal ends of the second terminals and configured to receive the guide features.

14. A method of electrically coupling contacts on a first circuit member to contacts on a second circuit member, the method comprising the steps of:

soldering proximal ends of first terminals on a first substrate to the contacts on the first circuit member;

soldering proximal ends of second terminals on a second substrate to the contacts on the first circuit member; and

engaging complementary inter-engaging structures located at distal ends of the first and second terminals in a high surface area, multi-point electrical connection to electrically and mechanically couple the first circuit member to the second circuit member.

15. The method of claim 14 comprising locating solder balls on the first circuit member in recesses in the first substrate at proximal ends of the first terminals.

16. The method of claim 14 comprising depositing one or more of a ground plane, a power plane, or shielding on at least one of the first and second substrates.

17. The method of claim 14 comprising locating electrical shielding covered by a dielectric material around at least the first terminals.

18. The method of claim 14 comprising printing electrical devices on one or more of the first and second substrates.

19. The method of claim 14 comprising changing a pitch between the proximal ends and distal ends, of the terminals on one or more of the first and second substrates.

20. The method of claim 14 comprising printing a conductive material in recesses in the first and second substrates to form the engaging structures on the distal ends.

21. The method of claim 14 comprising flexing distal ends of the first terminals in response to engagement with distal ends of the second terminals.

22. The method of claim 14 wherein the circuit members are selected from one of a dielectric layer, a printed circuit board, a flexible circuit, a bare die device, an integrated circuit device, organic or inorganic substrates, or a rigid circuit.