Semiconductor device having field plate electrode and method for manufacturing the same

• US 9,184,261 B2
• Filed: 12/12/2013
• Issued: 11/10/2015
• Est. Priority Date: 02/09/2011
• Status: Active Grant

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Kobayashi, Hitoshi, Tomita, Shigeki
• Primary Examiner(s): Lee, Jae
• Application Number:
  US14/104,820
• Publication Number:
  US 20140179094A1
• Time in Patent Office: 698 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 29/0649 Dielectric regions, e.g. SiO2 regions, air gaps
• CPC Class Codes: H01L 29/407 Recessed field plates, e.g. trench field plates, buried field plates
• CPC Class Codes: H01L 29/42368 the thickness being non-uniform
• CPC Class Codes: H01L 29/42376 characterised by the length or the sectional shape
• CPC Class Codes: H01L 29/66666 Vertical transistors H01L29/66712, H01L29/66742 take precedence
• CPC Class Codes: H01L 29/66734 with a step of recessing the gate electrode, e.g. to form a trench gate electrode
• CPC Class Codes: H01L 29/7813 with trench gate electrode, e.g. UMOS transistors trench gate electrodes per se H01L29/4236

Abstract

According to one embodiment, in a semiconductor device, a first semiconductor layer of a first conductivity type has a first impurity concentration. A second semiconductor layer of the first conductivity type is formed on the first semiconductor layer and has a second impurity concentration lower than the first impurity concentration. A field plate electrode is formed in a lower portion of a trench formed in the second semiconductor layer through a first insulating film so as to bury the lower portion of the trench. A second insulating film is formed in the upper portion of the trench so as to be in contact with the top surface of the field plate electrode. A gate electrode is formed in the upper portion of the trench through a gate insulating film so as to bury the upper portion of the trench to sandwich the second insulating film.

Claims

1. A method for manufacturing a semiconductor device, comprising:

forming a second semiconductor layer of a first conductivity type on a first semiconductor layer of the first conductivity type;

forming a trench in the second semiconductor layer;

forming a first conductive film in the trench through a first insulating film so as to bury the trench;

removing the first insulating film of the upper portion of the trench on an opening side of the trench;

oxidizing the side surface of the upper portion of the exposed trench and the entire upper portion of the exposed first conductive film so as to form a gate insulating film and a second insulating film;

forming a gate electrode between the gate insulating film and the second insulating film;

forming a third semiconductor layer of the second conductivity type in the upper portion of the second semiconductor layer; and

forming a fourth semiconductor layer of the first conductivity type in the upper portion of the third semiconductor layer.

2. The method for manufacturing the semiconductor device according to claim 1, wherein the gate insulating film of the target thickness is obtained simultaneously with or after the oxidation of the entire upper portion of the first conductive film.

3. The method for manufacturing the semiconductor device according to claim 1, wherein the side surface of the upper portion of the exposed trench and the upper portion of the exposed first conductive film are thermally oxidized by hydrogen burning oxidation.

4. The method for manufacturing the semiconductor device according to claim 3, wherein hydrogen burning oxidation is performed at a temperature of about 800°

C. to about 900°

C.

5. The method for manufacturing the semiconductor device according to claim 3, wherein a ratio of an oxidation rate of the first conductive film to an oxidation rate of the second semiconductor layer is 4 or more.

6. The method for manufacturing the semiconductor device according to claim 1, wherein the side surface of the upper portion of the exposed trench and the upper portion of the exposed first conductive film are thermally oxidized by steam oxidation.

7. The method for manufacturing the semiconductor device according to claim 1, further comprising:

forming a fifth semiconductor layer of the second conductivity type so as to reach the third semiconductor layer through the fourth semiconductor layer.