Flexible lighting devices

• US 9,184,419 B2
• Filed: 03/10/2014
• Issued: 11/10/2015
• Est. Priority Date: 05/12/2011
• Status: Active Grant

• Current Assignee: Universal Display Corporation
• Original Assignee: Universal Display Corporation
• Inventors: Mandlik, Prashant, Levermore, Peter, Pang, Huiqing, Krall, Emory, Paynter, Jason, Ma, Ruiqing
• Primary Examiner(s): Potter, Roy
• Assistant Examiner(s): PATTON, PAUL E
• Application Number:
  US14/202,430
• Publication Number:
  US 20140248727A1
• Time in Patent Office: 610 Days
• Field of Search: 257/40, 257/E51.018, 257/88, 257/59, 257/100, 257/72, 257/E29.119
• US Class Current: 1/1
• CPC Class Codes: H10K 2102/311 Flexible OLED
• CPC Class Codes: H10K 59/1201 Manufacture or treatment
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/40 Thermal treatment, e.g. annealing in the presence of a solvent vapour
• CPC Class Codes: H10K 71/80 using temporary substrates
• CPC Class Codes: H10K 77/111 Flexible substrates
• CPC Class Codes: Y02E 10/549 Organic PV cells
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A first device and methods for manufacturing the first device are provided. The first device may comprise a flexible substrate and at least one organic light emitting device (OLED) disposed over the flexible substrate. The first device may have a flexural rigidity between 10⁻¹ Nm and 10⁻⁶ Nm, and the ratio of the critical strain energy release rate to the material density factor for the first device may be greater than 0.05 J m/Kg.

Claims

1. A first method, comprising:

providing a substrate having a first surface;

disposing the substrate on a carrier;

disposing an adhesive layer between at least a portion of the substrate and at least a portion of the carrier, and baking the carrier and the adhesive at a temperature that is less than a glass transition temperature of the adhesive layer;

disposing at least one organic light emitting device (OLED) over the first surface of the substrate;

after disposing the at least one OLED, disposing a barrier layer over the OLED; and

removing the adhesive layer from the substrate, wherein the adhesive layer has an adhesive fracture energy of less than 200 J/m² when it is removed from the substrate.

2. The first method of claim 1, wherein a plurality of OLEDs are disposed over the first surface of the substrate.

3. The first method of claim 2, wherein disposing the plurality of OLEDs comprises depositing one or more organic layers through a shadow mask.

4. The first method of claim 2, wherein disposing each of the plurality of OLEDs comprises the steps of:

depositing a first conductive layer over the first surface of the substrate;

depositing an electro-luminescent material over the first conductive layer; and

depositing a second conductive layer over the electro-luminescent material.

5. The first method of claim 4, wherein the electro-luminescent material is deposited as a patterned layer.

6. The first method of claim 1,

wherein the adhesive layer has a glass transition temperature;

and

wherein after the adhesive layer is disposed between the substrate and the carrier, the method further comprises the step of baking the substrate, the carrier, and the adhesive layer at a temperature that is less than the glass transition temperature of the adhesive layer.

7. The first method of claim 1, wherein the step of providing the substrate comprises planarizing the substrate.

8. The first method of claim 7, wherein planarizing the substrate comprises any one of:

depositing a polymer over at least a portion of the first surface and then hard baking the substrate,

depositing an inorganic dielectric material over at least a portion of the first surface of the substrate;

or

depositing a mixture of a polymer and an inorganic dielectric material over at least a portion of the first surface of the substrate.

9. The first method of claim 8, wherein the inorganic dielectric material is deposited using chemical vapor deposition.

10. The first method of claim 1, wherein the carrier has a thermal conductivity of at least 1 W/m/K.

11. The first method of claim 1, wherein the carrier comprises any one of, or some combination of:

a metal, an alloy, a ceramic, or polymer.

12. The first method of claim 1, wherein the adhesive layer has adhesive fracture energy of less than 100 J/m².

13. The first method of claim 1, wherein the step of removing the adhesive layer from the substrate comprises any one of:

applying a force to the substrate;

ablating the adhesive layer;

exposing the adhesive layer to a solvent;

or

baking the adhesive layer.

14. The first method of claim 1, wherein after the barrier layer is disposed over the OLED, the first method further comprises the step of disposing a lamination layer over the barrier layer.

15. The first method of claim 14, wherein the lamination layer comprises any one of:

a polymer membrane coupled to the substrate using an adhesive;

a polymer layer that is thin spun-on to the barrier film;

an evaporated polymer layer;

or

a spray coated, aerosol dispersed polymer layer disposed over the barrier film.

16. A method, comprising:

providing a substrate;

disposing one or more OLEDs over the substrate, wherein each OLED comprises;

a first electrode;

a second electrode; and

an electro-luminescent material disposed between the first and second electrodes;

disposing an encapsulation layer over at least a part of the one or more OLEDs; and

disposing a lamination layer comprising a scattering film over the encapsulation layer, wherein disposing the lamination layer comprises spray coating the lamination layer.

17. The method of claim 16, wherein the lamination layer is an aerosol dispersed polymer layer.

18. The method of claim 16, wherein the substrate is a flexible substrate.

19. A first method, comprising:

(i) providing a substrate having a first surface;

(ii) disposing the substrate on a carrier, disposing an adhesive layer between at least a portion of the substrate and at least a portion of the carrier, baking the carrier and the adhesive at a temperature that is less than a glass transition temperature of the adhesive layer, and disposing at least one organic light emitting device (OLED) over the first surface of the substrate;

(iii) disposing a barrier layer over the OLED; and

(iv) removing the adhesive layer from the substrate, wherein the adhesive layer has an adhesive fracture energy of less than 200 J/m² when it is removed from the substrate.