Electrical connector insulator housing
First Claim
Patent Images
1. A socket housing comprising:
- a housing including a plurality of dielectric layers including at least two different dielectric materials, the housing comprising a material sets varied by layer and within a given layer, such that the housing comprises a three-dimensional dielectric structure having of a variety of dielectric properties;
at least one contact member positioned in a plurality of recesses in the housing, distal ends of the contact members adapted to electrically couple with circuit members;
plating in at least one of the recesses to electrically couple a contact member with at least one of the conductive traces;
at least one of a conductive, a non-conductive, or a semi-conductive material in at least one of the layers that tune the impedance of the contact members; and
a plurality of conductive traces extending along at least one layer of the housing.
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Accused Products
Abstract
A socket housing and method of making the socket housing. A plurality of dielectric layers are printed with a plurality of recesses on a substrate. The dielectric layers include at least two different dielectric materials. A sacrificial material is printed in the recesses. The assembly is removed from the substrate and the sacrificial material is removed from the recesses. At least one contact member is located in a plurality of the recesses. Distal ends of the contact members are adapted to electrically couple with circuit members.
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Citations
15 Claims
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1. A socket housing comprising:
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a housing including a plurality of dielectric layers including at least two different dielectric materials, the housing comprising a material sets varied by layer and within a given layer, such that the housing comprises a three-dimensional dielectric structure having of a variety of dielectric properties; at least one contact member positioned in a plurality of recesses in the housing, distal ends of the contact members adapted to electrically couple with circuit members; plating in at least one of the recesses to electrically couple a contact member with at least one of the conductive traces; at least one of a conductive, a non-conductive, or a semi-conductive material in at least one of the layers that tune the impedance of the contact members; and a plurality of conductive traces extending along at least one layer of the housing. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of making a socket housing comprising the steps of:
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forming a housing including a plurality of dielectric layers including at least two different dielectric materials, the housing comprising a material sets varied by layer and within a given layer, such that the housing comprises a three-dimensional dielectric structure having of a variety of dielectric properties; locating at least one contact member in a plurality of recesses in the housing, distal ends of the contact members adapted to electrically couple with circuit members; plating at least one of the recesses to electrically couple the contact member with at least one of the conductive traces; depositing at least one of a conductive, a non-conductive, or a semi-conductive materials in at least one of the layers that tune the impedance of the contact members; and forming a plurality of conductive traces extending along at least one layer of the housing. - View Dependent Claims (11, 12, 13, 14, 15)
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Specification