Methods of manufacturing array camera modules incorporating independently aligned lens stacks

• US 9,185,276 B2
• Filed: 11/07/2014
• Issued: 11/10/2015
• Est. Priority Date: 11/07/2013
• Status: Active Grant

• Current Assignee: FotoNation Limited (Adeia Inc.)
• Original Assignee: Pelican Imaging Corporation
• Inventors: Rodda, Errol Mark, Duparr, Jacques
• Primary Examiner(s): GRAY, LINDA LAMEY
• Application Number:
  US14/536,537
• Publication Number:
  US 20150122411A1
• Time in Patent Office: 368 Days
• US Class Current: 1/1
• CPC Class Codes: G02B 13/001 Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras G02B23/243 takes precedence
• CPC Class Codes: G02B 27/62 Optical apparatus specially adapted for adjusting optical elements during the assembly of optical systems
• CPC Class Codes: G02B 3/0056 arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses G02B3/0043 takes precedence; miniaturised objectives for electronic devices employing wafer level optics G02B13/0085
• CPC Class Codes: G02B 5/201 in the form of arrays
• CPC Class Codes: G02B 7/02 for lenses supports for magnifying lenses G02B25/002
• CPC Class Codes: G02B 7/021 for more than one lens
• CPC Class Codes: G02B 7/023 permitting adjustment
• CPC Class Codes: G06T 7/55 from multiple images
• CPC Class Codes: H01L 25/042 the devices being arranged next to each other solar cells H01L31/042
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14621 Colour filter arrangements
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H04N 23/10 for generating image signals from different wavelengths
• CPC Class Codes: H04N 23/16 Optical arrangements associated therewith, e.g. for beam-splitting or for colour correction
• CPC Class Codes: H04N 23/45 for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: H04N 23/741 : by increasing the dynamic range of the image compared to the dynamic range of the electronic image sensors
• CPC Class Codes: H04N 23/88 : for colour balance, e.g. white-balance circuits or colour temperature control
• CPC Class Codes: H04N 23/90 : Arrangement of cameras or camera modules, e.g. multiple cameras in TV studios or sports stadiums
• CPC Class Codes: H04N 23/951 : by using two or more images to influence resolution, frame rate or aspect ratio
• CPC Class Codes: H04N 25/134 : based on three different wavelength filter elements
• CPC Class Codes: Y10T 156/1056 : Perforating lamina
• CPC Class Codes: Y10T 156/1062 : Prior to assembly
• CPC Class Codes: Y10T 156/1304 : Means making hole or aperture in part to be laminated
• CPC Class Codes: Y10T 156/1309 : and securing separate part over hole or aperture
• CPC Class Codes: Y10T 29/49826 : Assembling or joining

Abstract

Array cameras, and array camera modules incorporating independently aligned lens stacks are disclosed. Processes for manufacturing array camera modules including independently aligned lens stacks can include: forming at least one hole in at least one carrier; mounting the at least one carrier relative to at least one sensor so that light passing through the at least one hole in the at least one carrier is incident on a plurality of focal planes formed by arrays of pixels on the at least one sensor; and independently mounting a plurality of lens barrels to the at least one carrier, so that a lens stack in each lens barrel directs light through the at least one hole in the at least one carrier and focuses the light onto one of the plurality of focal planes.

Claims

1. A method of assembling an array camera module, comprising:

forming at least one hole in at least one carrier;

mounting the at least one carrier relative to at least one sensor so that light passing through the at least one hole in the at least one carrier is incident on a plurality of focal planes formed by arrays of pixels on the at least one sensor;

independently mounting a plurality of lens barrels to the at least one carrier, so that a lens stack in each lens barrel directs light through the at least one hole in the at least one carrier and focuses the light onto one of the plurality of focal planes; and

mounting a module cap over the lens barrels, where the module cap includes at least one opening that admits light into the lens stacks contained within the plurality of lens barrels.

2. The method of claim 1, wherein forming at least one hole in at least one carrier comprises forming at least one hole in a single carrier.

3. The method of claim 2, wherein mounting the single carrier relative to at least one sensor comprises mounting the single carrier relative to a plurality of sensors.

4. The method of claim 3, wherein:

each of the plurality of sensors is mounted to a first side of the single carrier;

each of the plurality of lens barrels is mounted to a second opposite side of the single carrier; and

the plurality of sensors comprises a separate sensor for each of the plurality of lens barrels.

5. The method of claim 4, wherein the at least one hole in the single carrier are spaced to enable an active alignment tool to grip the lens barrel during an active alignment process.

6. The method of claim 3, wherein each of the plurality of sensors is mounted to a substrate and mounting the single carrier relative to the plurality of sensors comprises mounting the single carrier in a fixed location relative to the substrate.

7. The method of claim 6, wherein each of the plurality of sensors is positioned proximate a first side of the single carrier and each of the plurality of lens barrels is mounted to a second opposite side of the single carrier.

8. The method of claim 7, wherein the at least one hole in the single carrier are spaced to enable an active alignment tool to grip the lens barrel during an active alignment process.

9. The method of claim 2, wherein mounting the single carrier relative to at least one sensor comprises mounting the single carrier relative to a single sensor.

10. The method of claim 9, wherein:

the single sensor is mounted to a first side of the single carrier; and

each of the plurality of lens barrels is mounted to a second opposite side of the single carrier.

11. The method of claim 10, wherein the at least one hole in the single carrier are spaced to enable an active alignment tool to grip the lens barrel during an active alignment process.

12. The method of claim 9, wherein the single sensor is mounted to a substrate and mounting the single carrier relative to the single sensor comprises mounting the single carrier in a fixed location relative to the substrate.

13. The method of claim 12, wherein the single sensor is positioned proximate a first side of the single carrier and each of the plurality of lens barrels is mounted to a second opposite side of the single carrier.

14. The method of claim 13, wherein the at least one hole in the single carrier are spaced to enable an active alignment tool to grip the lens barrel during an active alignment process.

15. The method of claim 1, wherein forming at least one hole in at least one carrier comprises forming a ledge in at least one hole in the at least one carrier and mounting at least one spectral filter on the ledge.

16. The method of claim 1, further comprising mounting at least one spectral filter within at least one hole in the at least one carrier.

17. The method of claim 16, wherein the at least one spectral filter is selected from the group consisting of a color filter and an IR-cut filter.

18. The method of claim 1, further comprising mounting an interface device relative to the at least one carrier.

19. The method of claim 18, wherein the interface device is mounted to the carrier.

20. The method of claim 18, wherein the at least one sensor and the interface device are mounted to a substrate and mounting the at least one carrier relative to the at least one sensor comprises mounting the at least one carrier in a fixed location relative to the substrate.

21. The method of claim 1, wherein independently mounting a plurality of lens barrels to the at least one carrier comprises using active alignment to separately mount each of the lens barrels to one of the at least one carrier.

22. The method of claim 21, wherein the at least one hole in the at least one carrier are spaced to enable an active alignment tool to grip the lens barrel during the active alignment process.

23. The method of claim 1, wherein the at least one opening in the module cap are dimensioned so that the module cap is not visible within the field of view of any of the lens stacks and so that light does not reflect from the module cap into the lens stacks.

24. The method of claim 1, wherein the module cap is mounted to the at least one carrier so that a small air gap exists between the module cap and the top of the lens barrels and the method further comprises applying a small bead of adhesive to each of the lens barrels to seal the air gap between the module cap and the lens barrels.

25. The method of claim 1, wherein the carrier is constructed from a material selected from the group consisting of ceramic and glass.

27. The method of assembling an array camera module of claim 1, wherein each of the plurality of lens barrels forms an aperture and is positioned so that an outermost lens of the lens stack in the lens barrel directs light into the lens stack.

26. A method of assembling an array camera module, comprising:

forming a plurality of holes in a carrier;

mounting the carrier relative to a plurality of sensors so that light passing through each of the plurality of holes in the carrier is incident on one of a plurality of focal planes formed by the plurality of sensors;

mounting at least one spectral filter within at least one of the plurality of holes in the carrier;

independently mounting a plurality of lens barrels to the carrier, so that a lens stack in each lens barrel directs light through the at least one hole in the at least one carrier and focuses the light onto a focal plane formed by a corresponding sensor in the plurality of sensors; and

mounting a module cap over the lens barrels so that the module cap is attached to the carrier and a small air gap exists between the module cap and the top of the lens barrels, where the module cap includes a plurality of openings that each admits light into one of the plurality lens stacks contained within the plurality of lens barrels; and

applying a small bead of adhesive to each of the lens barrels to seal the air gap between the module cap and the lens barrels.

28. The method of assembling an array camera module of claim 26, wherein each of the plurality of lens barrels forms an aperture and is positioned so that an outermost lens of the lens stack in the lens barrel directs light into the lens stack.