Device components with surface-embedded additives and related manufacturing methods

• US 9,185,798 B2
• Filed: 06/09/2014
• Issued: 11/10/2015
• Est. Priority Date: 08/07/2010
• Status: Active Grant

• Current Assignee: TPK Holding Co., Ltd.
• Original Assignee: Innova Dynamics, Inc. (TPK Holding Co., Ltd.)
• Inventors: Young, Michael Eugene, Srinivas, Arjun Daniel, Robinson, Matthew R., Mittal, Alexander Chow
• Primary Examiner(s): Nguyen, Dao H
• Application Number:
  US14/299,938
• Publication Number:
  US 20150014022A1
• Time in Patent Office: 519 Days
• Field of Search: 257/434, 257/436, 257/439, 257/E31.117, 257/E31.119, 257/E31.127, 257/E21.449, 136/243, 136/246, 136/251, 136/265
• US Class Current: 1/1
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: H01L 31/0481 characterised by the composition of the encapsulation material
• CPC Class Codes: H01L 31/05 Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells electrodes H01L31/0224; electrical interconnection of thin film solar cells formed on a common substrate H01L31/046; particular structures for electrical interconnecting of adjacent thin film solar cells in the module H01L31/0465; electrical interconnection means specially adapted for electrically connecting two or more PV modules H02S40/36
• CPC Class Codes: H01L 31/055 where light is absorbed and re-emitted at a different wavelength by the optical element directly associated or integrated with the PV cell, e.g. by using luminescent material, fluorescent concentrators or up-conversion arrangements
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 1/0313 Organic insulating material
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 2201/0302 Properties and characteristics in general
• CPC Class Codes: H05K 2201/0326 Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
• CPC Class Codes: H05K 2201/0364 Conductor shape
• CPC Class Codes: H05K 2201/10977 Encapsulated connections
• CPC Class Codes: Y02E 10/50 Photovoltaic [PV] energy
• CPC Class Codes: Y02E 10/52 PV systems with concentrators
• CPC Class Codes: Y02E 10/542 Dye sensitized solar cells

Abstract

Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes.

Claims

1. A device with surface-embedded metallic nanowires, comprising:

a first layer;

a second layer; and

an interlayer disposed between the first layer and the second layer, wherein the interlayer includes;

a polymeric film; and

metallic nanowires at least partially embedded into the polymeric film and localized within an embedding region of the polymeric film, wherein a thickness of the embedding region is less than an overall thickness of the polymeric film, and a remainder of the polymeric film is devoid of any metallic nanowire.

2. The device of claim 1, wherein the thickness of the embedding region is no greater than 50% of the overall thickness of the polymeric film.

3. The device of claim 1, wherein the thickness of the embedding region is no greater than 30% of the overall thickness of the polymeric film.

4. The device of claim 1, wherein the metallic nanowires include silver nanowires.

5. The device of claim 1, wherein at least one of the metallic nanowires partially extends out from a surface of the polymeric film.

6. The device of claim 1, wherein at least one of the metallic nanowires is fully embedded below a surface of the polymeric film.

7. The device of claim 1, wherein the metallic nanowires are patterned to form an array of interconnects.

8. The device of claim 7, further comprising a metallization that is electrically connected to at least one of the interconnects.

9. The device of claim 1, wherein a loading of the metallic nanowires in the polymeric film is above an electrical percolation threshold.

10. The device of claim 1, wherein the interlayer has a sheet resistance that is no greater than 200 Ω

/sq.

11. The device of claim 1, wherein the interlayer has a sheet resistance that is no greater than 100 Ω

/sq.

12. The device of claim 1, wherein the interlayer has a light transmittance that is at least 85%.

13. The device of claim 1, wherein the interlayer has a light transmittance that is at least 90%.

14. The device of claim 1, wherein the device is a touch module, and the interlayer is a transparent conducting electrode.

15. The device of claim 1, further comprising a display device, and the first layer, the interlayer, and the second layer are coupled to the display device.

16. The device of claim 15, wherein the display device is selected from a flat panel display, a liquid crystal display, a plasma display, an organic light-emitting diode display, a quantum dot display, and a flexible display.

17. The device of claim 1, wherein the interlayer and the metallic nanowires correspond to a first interlayer and first metallic nanowires, respectively, and further comprising:

a second interlayer disposed between the first interlayer and the second layer, wherein the second interlayer includes;

a host material; and

second metallic nanowires at least partially embedded into the host material.

18. The device of claim 1, wherein the metallic nanowires are at least partially embedded into the polymeric film in a grid pattern.

19. The device of claim 1, wherein the polymeric film is a film of a thermoplastic polymer.

20. The device of claim 1, wherein the polymeric film is a film of a polymer selected from a polycarbonate and an acrylic polymer.

21. A device with surface-embedded metallic nanowires, comprising:

a first layer;

a display device;

a second layer disposed between the first layer and the display device; and

metallic nanowires at least partially embedded into the second layer.

22. The device of claim 21, wherein the metallic nanowires are localized within an embedding region of the second layer, such that a remainder of the second layer is devoid of any metallic nanowire.

23. The device of claim 22, wherein a thickness of the embedding region is less than an overall thickness of the second layer.

24. The device of claim 22, wherein a thickness of the embedding region is no greater than 50% of an overall thickness of the second layer.

25. The device of claim 21, wherein the metallic nanowires include silver nanowires having an average diameter in the range of 1 nm to 100 nm and an average length in the range of 500 nm to 50 μ

m.

26. The device of claim 21, wherein at least one of the metallic nanowires extends out from the second layer to an extent from 1 nm to 50 nm.

27. The device of claim 21, wherein the metallic nanowires are at least partially embedded into the second layer in a pattern to form an array of interconnects.

28. The device of claim 21, wherein the first layer is a cover lens.

29. The device of claim 21, wherein the second layer is a polymeric film.

30. The device of claim 21, wherein the display device is selected from a flat panel display, a liquid crystal display, a plasma display, an organic light-emitting diode display, a quantum dot display, and a flexible display.