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Device components with surface-embedded additives and related manufacturing methods

  • US 9,185,798 B2
  • Filed: 06/09/2014
  • Issued: 11/10/2015
  • Est. Priority Date: 08/07/2010
  • Status: Active Grant
First Claim
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1. A device with surface-embedded metallic nanowires, comprising:

  • a first layer;

    a second layer; and

    an interlayer disposed between the first layer and the second layer, wherein the interlayer includes;

    a polymeric film; and

    metallic nanowires at least partially embedded into the polymeric film and localized within an embedding region of the polymeric film, wherein a thickness of the embedding region is less than an overall thickness of the polymeric film, and a remainder of the polymeric film is devoid of any metallic nanowire.

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