Grounding of a shield within an implantable medical lead

• US 9,186,499 B2
• Filed: 04/27/2010
• Issued: 11/17/2015
• Est. Priority Date: 04/30/2009
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Olsen, James M., Klardie, Michael R., Stone, Richard T., Cai, Chad Q., Bondhus, Spencer M., Conroy, Mark J., Abraham, Timothy R.
• Primary Examiner(s): LEVICKY, WILLIAM J
• Application Number:
  US13/264,171
• Publication Number:
  US 20120035695A1
• Time in Patent Office: 2,030 Days
• Field of Search: 607/116
• US Class Current: 1/1
• CPC Class Codes: A61B 2090/3966 Radiopaque markers visible in an X-ray image
• CPC Class Codes: A61B 90/39 Markers, e.g. radio-opaque or breast lesions markers
• CPC Class Codes: A61N 1/048 Electrodes characterised by a specific connection between lead and electrode
• CPC Class Codes: A61N 1/0488 Details about the lead
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/0551 Spinal or peripheral nerve electrodes
• CPC Class Codes: A61N 1/08 Arrangements or circuits for monitoring, protecting, controlling or indicating for external stimulators A61N1/3603; for implantable neurostimulators A61N1/36128; for heart stimulators A61N1/37; for defibrillators A61N1/3925
• CPC Class Codes: A61N 1/086 Magnetic resonance imaging [MRI] compatible leads
• CPC Class Codes: A61N 1/3718 Monitoring of or protection against external electromagnetic fields or currents
• CPC Class Codes: A61N 1/3752 Details of casing-lead connections
• CPC Class Codes: A61N 2001/058 Fixing tools
• CPC Class Codes: A61N 2001/0582 Suture sleeves
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/4921 with bonding
• CPC Class Codes: Y10T 29/49227 Insulator making
• CPC Class Codes: Y10T 29/49826 Assembling or joining

Abstract

Grounding of a shield that is located in an implantable medical lead may be done in many ways. The ground pathway may couple to the shield at a point that is outside of a header of an implantable medical device to which the implantable medical lead is attached. The ground pathway may couple to the shield at a point that is within the header of the implantable medical device. The ground pathway may terminate at the metal can of the implantable medical device. As another option, the ground pathway may terminate at a ground plate that is mounted to the header. The ground pathway may be direct current coupled from the shield to the can or ground plate. Alternatively, the ground pathway may include one or more capacitive couplings that provide a pathway for induced radio frequency current.

Claims

1. A method of grounding a shield of an implantable lead that includes filars and electrodes at a proximal end and at a distal end wherein the filars provide an electrical connection between the electrodes at the proximal end and the electrodes at the distal end, comprising:

establishing a pathway capable of conducting electrical energy at radio frequencies between the shield at a first point along the lead and a metal can of an implantable medical device, where the first point along the lead is spaced apart from a proximal end of the lead that is positioned within a header of the implantable medical device such that an entire length of the pathway and the first point are outside of the header.

2. The method of claim 1, wherein establishing the pathway comprises providing a direct current coupling of a metal conductor to the shield at the first point and providing a direct current coupling of the metal conductor to the metal can.

3. The method of claim 2, wherein providing a direct current coupling of a metal conductor to the shield at the first point comprises:

providing a connection block affixed to the can, the connection block providing a pass-through and providing a metal conductor within the pass-through that has a direct current pathway from the pass-through to the metal can;

providing a ground electrode on the external surface of the shield where the ground electrode is electrically coupled to the shield; and

establishing physical contact between the ground electrode and the metal conductor within the pass-through.

4. The method of claim 3, wherein the pass-through is a slot.

5. The method of claim 3, wherein the metal conductor within the pass-through comprises a set screw and wherein establishing physical contact comprises abutting the set screw to the ground electrode.

6. The method of claim 3, wherein the metal conductor within the pass-through comprises a spring-loaded connector and wherein establishing physical contact comprises trapping the ground electrode within the spring-loaded connector.

7. The method of claim 2, wherein providing a direct current coupling of a metal conductor to the shield at the first point comprises:

providing a metal wire with a direct current coupling to the can on a first end of the metal wire;

providing a metal connector with a direct current coupling to a second end of the metal wire;

providing a ground electrode on the external surface of the lead where the ground electrode is electrically coupled to the shield; and

establishing physical contact between the ground electrode and the metal connector.

8. The method of claim 7, wherein providing the direct current coupling of the can to the first end of the metal wire comprises welding the first end to the can.

9. The method of claim 7, wherein providing the direct current coupling of the can to the first end of the metal wire comprises creating an adhesive bond to maintain physical contact between the first end and the can.

10. The method of claim 7, wherein the metal connector comprises a spring-loaded connector.

11. The method of claim 1, wherein establishing the pathway comprises creating a capacitive coupling of a metal conductor to the shield at the first point and creating a direct current coupling of the metal conductor to the metal can.

12. The method of claim 1, wherein establishing the pathway comprises creating a direct current coupling of a metal conductor to the shield at the first point and creating a capacitive coupling of the metal conductor to the metal can.

13. The method of claim 1, wherein establishing the pathway comprises creating a capacitive coupling of a metal conductor to the shield at the first point and creating a capacitive coupling of the metal conductor to the metal can.

14. The method of claim 13, wherein providing a capacitive coupling of the metal conductor to the metal can comprises creating an adhesive bond with the metal conductor and an adhesive bond with the can to maintain the metal conductor in close proximity to the metal can.

15. The method of claim 13, wherein providing a capacitive coupling of the metal conductor to the shield at the first point comprises:

creating an adhesive bond with the metal conductor and an adhesive bond with the lead nearby the first point to maintain the metal conductor in close proximity to the first point.

16. An implantable medical system, comprising:

an implantable medical device housed within a metal can and having a header portion that houses electrical contacts;

an implantable lead comprising a shield and filars and further comprising electrodes at a proximal end and at a distal end, wherein the filars provide a direct current connection between the electrodes at the proximal end and the electrodes at the distal end, the proximal end being positioned within the header so that the electrodes on the proximal end establish physical contact with the electrical contacts within the header;

a ground conductor entirely outside of the header;

a first coupling at a first point along the implantable lead that is spaced from the proximal end and the header, the first coupling establishing a radio frequency pathway between the shield at the first point and the ground conductor; and

a second coupling at the can that establishes a radio frequency pathway between the ground conductor and the metal can.

17. The implantable medical system of claim 16, wherein the radio frequency pathway between the shield at the first point and the ground conductor is also a direct current pathway between the shield at the first point and the ground conductor.

18. The implantable medical system of claim 16, wherein the implantable lead comprises a ground electrode electrically coupled to the shield at the first point, and wherein the first coupling is at least one of a connection block with a set screw abutting the ground electrode electrically connected to the shield, a connection block with a spring loaded connector trapping the ground electrode electrically connected to the shield, a weld holding the ground conductor to the ground electrode, or an adhesive bond holding the ground conductor to the ground electrode.

19. The implantable medical system of claim 16, wherein the radio frequency pathway between the ground conductor and the metal can is also a direct current pathway between the ground conductor and the metal can.

20. The implantable medical system of claim 19, wherein the radio frequency pathway between the shield at the first point and the ground conductor is a capacitive coupling between the shield at the first point and the ground conductor.

21. The implantable medical system of claim 16, wherein the radio frequency pathway between the ground conductor and the metal can is a capacitive coupling between the ground conductor and the metal can.

22. An implantable medical system, comprising:

an implantable medical device housed within a metal can and having a header portion that houses electrical contacts, a ground plate being affixed to an exterior surface of the header;

an implantable lead comprising a shield and filars and further comprising electrodes at a proximal end and at a distal end, wherein the filars provide a direct current connection between the electrodes at the proximal end and the electrodes at the distal end, the proximal end being positioned within the header so that the electrodes on the proximal end establish physical contact with the electrical contacts within the header;

a ground conductor entirely outside of the header;

a first coupling at a first point along the implantable lead that establishes a radio frequency pathway between the shield at the first point and the ground conductor; and

a second coupling at the ground plate that establishes a radio frequency pathway between the ground conductor and the ground plate.

23. The implantable medical system of claim 22, wherein the radio frequency pathway between the shield at the first point and the ground conductor is also a direct current pathway between the shield at the first point and the ground conductor.

24. The implantable medical system of claim 22, wherein the radio frequency pathway between the ground conductor and the ground plate is also a direct current pathway between the ground conductor and the ground plate.

25. The implantable medical system of claim 22, wherein the ground plate comprises a metal attachment block that affixes the proximal end of the implantable lead within the header.

26. The implantable medical system of claim 22, wherein the first point is spaced from the proximal end and the header.

27. The implantable medical system of claim 22, wherein the ground conductor comprises a capacitive coupling.

28. A method of grounding a shield of an implantable lead that includes filars and electrodes at a proximal end and at a distal end wherein the filars provide an electrical connection between the electrodes at the proximal end and the electrodes at the distal end, comprising:

providing an implantable medical device having a can and a header attached to the can, the header define a lead passageway;

providing a connection block affixed to the can and positioned outside of the header, the connection block providing a pass-through and providing a metal conductor within the pass-through that has a radio frequency pathway from the pass-through to the metal can;

providing a ground electrode on the lead distal of the header when the proximal end of the lead is fully inserted into the header such that the ground electrode is outside of the header, where the ground electrode is electrically coupled to the shield; and

establishing physical contact between the ground electrode and the metal conductor within the pass-through.

29. A method, comprising:

providing an implantable medical device housed within a metal can and having a header portion that houses electrical contacts;

providing an implantable lead comprising a shield and filars and further comprising electrodes at a proximal end and at a distal end, wherein the filars provide a direct current connection between the electrodes at the proximal end and the electrodes at the distal end;

establishing a ground for the shield by providing a ground conductor entirely outside of the header with a first coupling at a first point along the implantable lead that is spaced from the proximal end and the header, the first coupling establishing a radio frequency pathway between the shield at the first point and the ground conductor and with a second coupling at the can that establishes a radio frequency pathway between the ground conductor and the metal can, wherein the first coupling that is outside of the header is at least one of a connection block with a set screw abutting the ground electrode electrically connected to the shield, a connection block with a spring loaded connector trapping the ground electrode electrically connected to the shield, a weld holding the ground conductor to the ground electrode, or an adhesive bond holding the ground conductor to the ground electrode; and

inserting the proximal end of the lead within the header so that the electrodes on the proximal end establish physical contact with the electrical contacts within the header.

30. A method, comprising:

providing an implantable medical device housed within a metal can and having a header portion that houses electrical contacts, a ground plate being affixed to an exterior surface of the header;

providing an implantable lead comprising a shield and filars and further comprising electrodes at a proximal end and at a distal end, wherein the filars provide a direct current connection between the electrodes at the proximal end and the electrodes at the distal end, the proximal end being positioned within the header so that the electrodes on the proximal end establish physical contact with the electrical contacts within the header; and

establishing a ground for the shield by providing a ground conductor entirely outside of the header with a first coupling at a first point along the implantable lead that establishes a radio frequency pathway between the shield at the first point and the ground conductor and with a second coupling at the ground plate that establishes a radio frequency pathway between the ground conductor and the ground plate.