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Power spectrum analysis for defect screening in integrated circuit devices

  • US 9,188,622 B1
  • Filed: 12/01/2011
  • Issued: 11/17/2015
  • Est. Priority Date: 12/01/2011
  • Status: Active Grant
First Claim
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1. A method of screening defects in a sample of a device, comprising:

  • supplying a time-varying electrical signal to the sample between a power pin and a ground pin of the sample, wherein the time-varying electrical signal is periodic and has a sine-wave, square-wave, or periodic chirp waveform;

    measuring a power spectrum at a selected one of a plurality of pins of the sample wherein the measured power spectrum represents a response of the sample solely to said time-varying electrical signal and wherein, while measuring the power spectrum, each pin of the device other than the selected pin and the ground and power pins is floating or else biased at constant voltage; and

    identifying an indication of a defect in the sample based on results of comparing the power spectrum with one or more power spectra of the device that have a known defect status.

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