Element substrate, inspecting method, and manufacturing method of semiconductor device

• US 9,188,631 B2
• Filed: 04/13/2012
• Issued: 11/17/2015
• Est. Priority Date: 03/07/2005
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Kato, Kiyoshi, Izumi, Konami, Hayakawa, Masahiko, Kamata, Koichiro
• Primary Examiner(s): Tang, Minh N
• Application Number:
  US13/446,614
• Publication Number:
  US 20120200312A1
• Time in Patent Office: 1,313 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: G01R 31/2822 of microwave or radiofrequency circuits of attenuation, gain, e.g. using network analyzers G01R27/28
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: G01R 31/3025 Wireless interface with the DUT
• CPC Class Codes: H01L 27/13 combined with thin-film or thick-film passive components

Abstract

A substrate including a semiconductor layer, where characteristics of an element can be evaluated with high reliability, and an evaluating method thereof are provided. A substrate including a semiconductor layer of the invention has a closed-loop circuit in which an antenna coil and a semiconductor element are connected in series, and a surface of an area over which the circuit is formed is covered with an insulating film. By using such a circuit, a contactless inspection can be carried out. Further, a ring oscillator can be substituted for the closed-loop circuit.

Claims

1. A wireless communication method of a semiconductor device comprising:

applying an electromagnetic wave to the semiconductor device comprising an elementary group including a closed-loop circuit in which an antenna coil and a semiconductor element are electrically connected in series; and

evaluating characteristics of the semiconductor element by measuring power absorbed by the semiconductor device.

2. The wireless communication method of the semiconductor device according to claim 1, wherein the semiconductor device has flexibility.

3. The wireless communication method of the semiconductor device according to claim 1, wherein the power absorbed by the semiconductor device is measured by a magnetic field prober.

4. The wireless communication method of the semiconductor device according to claim 1, wherein static characteristics of the semiconductor element is evaluated in a contactless manner.

5. A wireless communication method of a semiconductor device comprising:

applying an electromagnetic wave to the semiconductor device comprising an antenna coil and a semiconductor element which are electrically connected in series; and

evaluating characteristics of the semiconductor element by measuring power absorbed by the semiconductor device.

6. The wireless communication method of the semiconductor device according to claim 5, wherein the semiconductor device has flexibility.

7. The wireless communication method of the semiconductor device according to claim 5, wherein the power absorbed by the semiconductor device is measured by a magnetic field prober.

8. The wireless communication method of the semiconductor device according to claim 5, wherein static characteristics of the semiconductor element is evaluated in a contactless manner.