IC chip package disabling device
First Claim
1. A chip package comprising:
- an IC substrate, wherein the IC substrate comprises at least one electronic device;
a photovoltaic cell, wherein the photovoltaic cell generates an electrical current when exposed to light;
a light blocking shield, wherein the light blocking shield prevents light from striking the photovoltaic cell only while the chip package is mounted on a circuit board, and wherein the light blocking shield ceases to prevent light from striking the photovoltaic cell upon the chip package being dismounted from the circuit board; and
a disabling logic, wherein the electrical current, which is generated by the photovoltaic cell in response to the chip package being dismounted from the circuit board, causes the disabling logic to disable the IC substrate.
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Accused Products
Abstract
A chip package comprises: an IC substrate, wherein the IC substrate comprises at least one electronic device; a photovoltaic cell, wherein the photovoltaic cell generates an electrical current when exposed to light; a light blocking shield, wherein the light blocking shield prevents light from striking the photovoltaic cell only while the chip package is mounted on a circuit board, and wherein the light blocking shield ceases to prevent light from striking the photovoltaic cell upon the chip package being dismounted from the circuit board; and a disabling logic, wherein the electrical current, which is generated by the photovoltaic cell in response to the chip package being dismounted from the circuit board, causes the disabling logic to disable the IC substrate.
18 Citations
20 Claims
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1. A chip package comprising:
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an IC substrate, wherein the IC substrate comprises at least one electronic device; a photovoltaic cell, wherein the photovoltaic cell generates an electrical current when exposed to light; a light blocking shield, wherein the light blocking shield prevents light from striking the photovoltaic cell only while the chip package is mounted on a circuit board, and wherein the light blocking shield ceases to prevent light from striking the photovoltaic cell upon the chip package being dismounted from the circuit board; and a disabling logic, wherein the electrical current, which is generated by the photovoltaic cell in response to the chip package being dismounted from the circuit board, causes the disabling logic to disable the IC substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A computer system comprising:
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a system bus; a chip package electrically coupled to the system bus, wherein the chip package comprises; an IC substrate, wherein the IC substrate comprises at least one electronic device; a photovoltaic cell, wherein the photovoltaic cell generates an electrical current when exposed to light; a light blocking shield, wherein the light blocking shield prevents light from striking the photovoltaic cell only while the chip package is mounted on a circuit board, and wherein the light blocking shield ceases to prevent light from striking the photovoltaic cell upon the chip package being dismounted from the circuit board; and a disabling logic, wherein the electrical current, which is generated by the photovoltaic cell in response to the chip package being dismounted from the circuit board, causes the disabling logic to disable the IC substrate. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A chip package comprising:
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an IC substrate, wherein the IC substrate comprises at least one electronic device; a disabling post assembly, wherein the disabling post assembly comprises; a post cap; a post connected to the post cap, wherein the post cap is connected to a first end of the post, wherein the post traverses through a post channel in the IC substrate, and wherein the post cap is initially positioned above the IC substrate; a post base connected to a second end of the post, wherein the post base is connected to a surface of a circuit board to which the chip package is electrically connected, wherein the post cap is physically pulled through the IC substrate while the chip package is subsequently removed from the circuit board, and wherein removing the chip package causes the post cap to physically destroy the IC substrate. - View Dependent Claims (18, 19, 20)
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Specification