Low profile image sensor

• US 9,190,443 B2
• Filed: 03/07/2014
• Issued: 11/17/2015
• Est. Priority Date: 03/12/2013
• Status: Active Grant

• Current Assignee: Optiz, Inc.
• Original Assignee: Optiz, Inc.
• Inventors: Oganesian, Vage, Lu, Zhenhua
• Primary Examiner(s): Jahan, Bilkis
• Assistant Examiner(s): QUINTO, KEVIN V
• Application Number:
  US14/200,146
• Publication Number:
  US 20140264691A1
• Time in Patent Office: 620 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14632 Wafer-level processed structures
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A sensor package comprising a host substrate with opposing first and second surfaces, an aperture extending therethrough, circuit layers, and first contact pads. A second substrate at least partially in the aperture has opposing first and second surfaces, a plurality of photo detectors, second contact pads at the second substrate first surface and electrically coupled to the photo detectors, and trenches formed into the second substrate first surface, conductive traces extending from the second contact pads and into the trenches. A third substrate has a first surface mounted to the first surface of the second substrate. The third substrate includes a cavity formed into its first surface and positioned over the photo detectors. Electrical connectors connect the first contact pads and conductive traces. A lens module is mounted to the host substrate for focusing light through the third substrate and onto the photo detectors.

Claims

1. An image sensor package, comprising:

a host substrate assembly including;

a first substrate with opposing first and second surfaces,

an aperture extending through the first substrate between the first and second surfaces,

one or more circuit layers,

a plurality of first contact pads electrically coupled to the one or more circuit layers;

a sensor chip mounted to the host substrate assembly and disposed at least partially in the aperture, wherein the sensor chip includes;

a second substrate with opposing first and second surfaces,

a plurality of photo detectors formed on or in the second substrate,

a plurality of second contact pads formed at the first surface of the second substrate which are electrically coupled to the photo detectors,

one or more trenches formed into the first surface of the second substrate,

a plurality of conductive traces each extending from one of the second contact pads and into the one or more trenches, and

a third substrate having a first surface mounted to the first surface of the second substrate, wherein the third substrate includes a cavity formed into the first surface of the third substrate that is positioned over the photo detectors;

electrical connectors each electrically connecting one of the first contact pads and one of the plurality of conductive traces; and

a lens module mounted to the host substrate assembly, wherein the lens module includes one or more lenses disposed for focusing light through the third substrate and onto the photo detectors.

2. The image sensor package of claim 1, wherein the electrical connectors are conductive bumps that each electrically connect one of the first contact pads to one of the plurality of conductive traces.

3. The image sensor package of claim 1, wherein the one or more trenches is a plurality of open sided trenches that include bottom surfaces shaped as discrete shoulders.

4. An image sensor package, comprising:

a host substrate assembly including;

a first substrate with opposing first and second surfaces,

an aperture extending through the first substrate between the first and second surfaces,

one or more circuit layers,

a plurality of first contact pads electrically coupled to the one or more circuit layers;

a sensor chip mounted to the host substrate assembly and disposed at least partially in the aperture, wherein the sensor chip includes;

a second substrate with opposing first and second surfaces,

a plurality of photo detectors formed on or in the second substrate,

a plurality of second contact pads formed at the first surface of the second substrate which are electrically coupled to the photo detectors,

one or more trenches formed into the first surface of the second substrate,

a plurality of conductive traces each extending from one of the second contact pads and into the one or more trenches, and

a third substrate having a first surface mounted to the first surface of the second substrate, wherein the third substrate includes a cavity formed into the first surface of the third substrate that is positioned over the photo detectors;

electrical connectors each electrically connecting one of the first contact pads and one of the plurality of conductive traces; and

a lens module mounted to the host substrate assembly, wherein the lens module includes one or more lenses disposed for focusing light through the third substrate and onto the photo detectors;

wherein the one or more trenches is a single open sided trench that includes a bottom surface shaped as an annular shoulder.

5. An image sensor package, comprising:

a host substrate assembly including;

a first substrate with opposing first and second surfaces,

an aperture extending through the first substrate between the first and second surfaces,

one or more circuit layers,

a plurality of first contact pads electrically coupled to the one or more circuit layers;

a sensor chip mounted to the host substrate assembly and disposed at least partially in the aperture, wherein the sensor chip includes;

a second substrate with opposing first and second surfaces,

a plurality of photo detectors formed on or in the second substrate,

a plurality of second contact pads formed at the first surface of the second substrate which are electrically coupled to the photo detectors,

one or more trenches formed into the first surface of the second substrate,

a plurality of conductive traces each extending from one of the second contact pads and into the one or more trenches, and

a third substrate having a first surface mounted to the first surface of the second substrate, wherein the third substrate includes a cavity formed into the first surface of the third substrate that is positioned over the photo detectors;

electrical connectors each electrically connecting one of the first contact pads and one of the plurality of conductive traces;

a lens module mounted to the host substrate assembly, wherein the lens module includes one or more lenses disposed for focusing light through the third substrate and onto the photo detectors;

a second sensor chip that includes;

a fourth substrate with opposing first and second surfaces,

a plurality of second photo detectors formed on or in the fourth substrate,

a plurality of third contact pads formed at the first surface of the fourth substrate which are electrically coupled to the second photo detectors,

one or more trenches formed into the first surface of the fourth substrate,

a fifth substrate having a first surface mounted to the first surface of the fourth substrate, wherein the fifth substrate includes a cavity formed into the first surface of the fifth substrate that is positioned over the second photo detectors, and

a plurality of second conductive traces each extending from one of the third contact pads and into the one or more trenches of the fourth substrate;

wherein the first substrate further comprises fourth contact pads coupled to the one or more circuit layers;

second electrical connectors each electrically connecting one of the fourth contact pads and one of the plurality of second conductive traces; and

a second lens module mounted to the host substrate assembly, wherein the second lens module includes one or more lenses disposed for focusing light through the fifth substrate and onto the second photo detectors;

wherein the second surface of the fourth substrate is mounted to the second surface of the second substrate.

6. The image sensor package of claim 5, wherein the second electrical connectors are wire bonds.

7. The image sensor package of claim 5, wherein each of the second and fourth substrates are semiconductor substrates.

8. An image sensor package, comprising:

a host substrate assembly including;

a first substrate with opposing first and second surfaces,

an aperture extending through the first substrate between the first and second surfaces,

one or more circuit layers,

a plurality of first contact pads electrically coupled to the one or more circuit layers;

a sensor chip mounted to the host substrate assembly and disposed at least partially in the aperture, wherein the sensor chip includes;

a second substrate with opposing first and second surfaces,

a plurality of photo detectors formed on or in the second substrate,

a plurality of second contact pads formed at the second surface of the second substrate which are electrically coupled to the photo detectors,

one or more trenches formed into the first surface of the second substrate and exposing the second contact pads, and

a third substrate having a first surface mounted to the first surface of the second substrate, wherein the third substrate includes a cavity formed into the first surface of the third substrate that is positioned over the photo detectors;

a fourth substrate with opposing first and second surfaces, wherein the first surface of the fourth substrate is mounted to the second surface of the second substrate, and wherein the fourth substrate includes one or more trenches formed into the first surface of the fourth substrate;

a plurality of conductive traces each extending from one of the second contact pads and into the one or more trenches of the fourth substrate;

electrical connectors each electrically connecting one of the first contact pads and one of the plurality of conductive traces; and

a lens module mounted to the host substrate assembly, wherein the lens module includes one or more lenses disposed for focusing light through the third substrate and onto the photo detectors.

9. The image sensor package of claim 8, wherein the electrical connectors are conductive bumps that each electrically connect one of the first contact pads to one of the plurality of conductive traces.

10. The image sensor package of claim 8, wherein the one or more trenches of the fourth substrate is a single open sided trench that includes a bottom surface shaped as an annular shoulder.

11. The image sensor package of claim 8, wherein the one or more trenches of the fourth substrate is a plurality of open sided trenches that include bottom surfaces shaped as discrete shoulders.

12. The image sensor package of claim 8, further comprising:

a second sensor chip that includes;

a fifth substrate with opposing first and second surfaces,

a plurality of second photo detectors formed on or in the fifth substrate,

a plurality of third contact pads formed at the second surface of the fifth substrate which are electrically coupled to the second photo detectors,

one or more trenches formed into the first surface of the fifth substrate and exposing the third contact pads, and

a sixth substrate having a first surface mounted to the first surface of the fifth substrate, wherein the sixth substrate includes a cavity formed into the first surface of the sixth substrate that is positioned over the second photo detectors;

a seventh substrate having opposing first and second surfaces, wherein the first surface of the seventh substrate is mounted to the second surface of the fifth substrate, and wherein the seventh substrate includes one or more trenches formed into the first surface of the seventh substrate;

a plurality of second conductive traces each extending from one of the third contact pads and into the one or more trenches of the seventh substrate;

wherein the first substrate further comprises fourth contact pads coupled to the one or more circuit layers;

second electrical connectors each electrically connecting one of the fourth contact pads and one of the plurality of second conductive traces; and

a second lens module mounted to the host substrate assembly, wherein the second lens module includes one or more lenses disposed for focusing light through the sixth substrate and onto the second photo detectors;

wherein the second surface of the fourth substrate is mounted to the second surface of the seventh substrate.

13. The image sensor package of claim 12, wherein the second electrical connectors are wire bonds.

14. The image sensor package of claim 12, wherein each of the second, fourth, fifth and seventh substrates are semiconductor substrates.