Light emitting device with encapsulant formed with barriers and light emitting device package having the same

• US 9,190,577 B2
• Filed: 04/08/2013
• Issued: 11/17/2015
• Est. Priority Date: 10/22/2009
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Hwang, Jung Ha, Jo, Kyoung Woo
• Primary Examiner(s): Jung, Michael
• Application Number:
  US13/858,712
• Publication Number:
  US 20130234188A1
• Time in Patent Office: 953 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2113/13 comprising an assembly of point-like light sources
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/508 having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
• CPC Class Codes: H01L 33/54 having a particular shape

Abstract

Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device (LED) comprises an LED chip, a barrier over the LED chip, and an encapsulating material containing a phosphor, wherein the encapsulating material is disposed inside the barrier over the LED chip.

Claims

1. A light emitting device comprising:

a light emitting diode chip;

a plurality of barriers on a top surface of the light emitting diode chip, the barriers being separated from each other; and

an encapsulant including a phosphor at an inner portion of the barriers on the light emitting diode chip,

wherein a lateral width of the light emitting diode chip is substantially the same with a lateral width of the encapsulant including the phosphor,

wherein the barriers comprise a dummy pad and a pad, and

wherein the dummy pad is not electrically connected to the pad.

2. The light emitting device as claimed in claim 1, wherein the barriers include a thixotropic material.

3. The light emitting device as claimed in claim 1, wherein the barriers include at least two barriers separated from each other at an outer peripheral portion of the light emitting diode chip.

4. The light emitting device as claimed in claim 1,

wherein the barriers are disposed on a substantially center portion of the outer peripheral portion of the light emitting diode chip.

5. The light emitting device as claimed in claim 1, wherein the barriers are formed on both a side surface and a top surface of an outer peripheral portion of the light emitting diode chip.

6. The light emitting device as claimed in claim 1, wherein the barriers include an Ag epoxy.

9. The light emitting device as claimed in claim 1, wherein the barriers are formed on a top surface of an outer peripheral portion of the light emitting diode chip.

10. The light emitting device as claimed in claim 1, wherein the barriers are connected to an outer peripheral portion of the light emitting diode chip.

11. The light emitting device as claimed in claim 1, wherein the barriers include a conductive material or a nonconductive material.

12. The light emitting device as claimed in claim 1, wherein the encapsulant has a flat top surface.

13. The light emitting device as claimed in claim 12, wherein a height of the flat top surface of the encapsulant is substantially equal to a height of a flat top of the barriers.

14. The light emitting device as claimed in claim 1, wherein the encapsulant comprises a flat top surface and the flat top surface of the encapsulant comprises a roughness.

7. A light emitting device comprising:

a light emitting diode chip;

a barrier on a top surface of the light emitting diode chip; and

an encapsulant including a phosphor at an inner portion of the barrier on the light emitting diode chip,

wherein a lateral width of the light emitting diode chip is substantially the same with a lateral width of the encapsulant including the phosphor, and

wherein the barrier comprises four barriers separated from each other at an outer peripheral portion of the light emitting diode chip.

8. The light emitting device as claimed in claim 7, wherein at least one of the barriers comprises a dummy pad, and at least one of the barriers comprises a pad, and

wherein the dummy pad is not electrically connected to the pad.

15. The light emitting device as claimed in claim 7, wherein a height of a top surface of the four barriers is equal to a height of a top most flat top surface of the encapsulant.

16. A light emitting device comprising:

a light emitting diode chip;

at least two barriers on the light emitting diode chip, the at least two barriers separated from each other at an outer peripheral portion of the light emitting diode chip; and

an encapsulant including a phosphor at an inner portion of the barrier on the light emitting diode chip,

wherein the encapsulant comprises a flat top surface,

wherein the flat top surface is substantially the same as a flat top of the barriers, and

wherein one of the barriers is a dummy pad, and the other one of the barriers is a pad, and wherein the dummy pad is not electrically connected to the pad.

17. The light emitting device as claimed in claim 16, wherein the at least two barriers comprises four barriers separated from each other at the outer peripheral portion of the light emitting diode chip.

18. The light emitting device as claimed in claim 16,

wherein the at least two barriers are disposed on a substantially center portion of the outer peripheral portion of the light emitting diode chip.

19. The light emitting device as claimed in claim 16, wherein the at least two barriers are formed on both a side surface and a top surface of an outer peripheral portion of the light emitting diode chip.