Methods for forming an electrode device with reduced impedance

• US 9,192,757 B2
• Filed: 09/14/2012
• Issued: 11/24/2015
• Est. Priority Date: 09/14/2011
• Status: Active Grant

• Current Assignee: Neuronexus Technologies Incorporated (NEL Group, Inc.)
• Original Assignee: Greatbatch Limited (Greatbatch Incorporated)
• Inventors: Seymour, John P.
• Primary Examiner(s): Stoklosa, Joseph
• Assistant Examiner(s): ANTISKAY, BRIAN MICHAEL
• Application Number:
  US13/617,355
• Publication Number:
  US 20130066182A1
• Time in Patent Office: 1,166 Days
• Field of Search: 600372-373, 600377-378, 600/393, 600544-545, 607115-118
• US Class Current: 1/1
• CPC Class Codes: A61B 2562/0285 Nanoscale sensors
• CPC Class Codes: A61B 2562/125 characterised by the manufacture of electrodes
• CPC Class Codes: A61B 5/24 Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
• CPC Class Codes: A61B 5/68 Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
• CPC Class Codes: A61N 1/04 Electrodes electrosurgical electrodes A61B18/14
• CPC Class Codes: A61N 1/05 for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/0534 Electrodes for deep brain stimulation

Abstract

Improved low-cost, highly reliable methods for increasing the electrochemical surface area of neural electrodes are described. A mono-layer of polymeric nanospheres is first deposited on a metallization supported on a dielectric substrate. The nanospheres self-assemble into generally repeating lattice forms with interstitial space between them. Then, the geometric surface area of the metallization material is increased by either selectively etching part-way into its depth at the interstitial space between adjacent nanospheres. Another technique is to deposit addition metallization material into the interstitial space. The result is undulation surface features provided on the exposed surface of the metallization. This helps improve the electrochemical surface area when the treated metallizations are fabricated into electrodes.

Claims

1. A neural interface system, which comprises:

a) a substrate;

b) at least one first electrically conductive metallization extending from a first metallization lower surface supported on the substrate to a first metallization upper surface, wherein the first metallization lower and upper surfaces are spaced from each other by a first perimeter providing a first metallization height; and

c) at least one second electrically conductive metallization different than the first metallization, the second metallization extending from a second metallization lower surface supported on the first metallization upper surface to a second metallization upper surface, wherein the second metallization lower and upper surfaces are spaced from each other by a second perimeter providing a second metallization height,

d) wherein the first metallization has a first cross-sectional width at spaced locations where its first upper surface meets the first perimeter, and the second metallization has a second cross-sectional width at spaced locations where its second lower surface meets the second perimeter, and wherein the first width of the first metallization is greater than the second width of the second metallization to thereby provide an exposed portion of the first metallization upper surface adjacent to the second perimeter of the second metallization, and

e) wherein the substrate supporting the first and second metallizations is configured as an electrode contactable with body tissue.

2. The neural interface system of claim 1 wherein the substrate is of a dielectric material selected from the group consisting of parylene, polyimide, silicone, silicon carbide, and silicon.

3. The neural interface system of claim 1 wherein the at least one second metallization comprises gold and the at least one first metallization is of a material selected from the group consisting of platinum, iridium, platinum/iridium alloy, iridium oxide, and titanium nitride.

4. The neural interface system of claim 1 wherein the first width of the first metallization ranges from 0.25 micron to 20 microns.

5. The neural interface system of claim 1 wherein there are at least two second metallizations supported on the first metallization and wherein the second metallizations do not contact each other to thereby provide at least one recess between the second metallizations.

6. The neural interface system of claim 5 wherein the at least one recess extends from 50% to 90% into the first height of the first metallization from the first upper surface thereof.

7. The neural interface system of claim 5 wherein there are at least two second metallizations supporting respective third metallizations supported on the first metallization and wherein the second and third metallizations do not contact each other to thereby provide at least one recess between the second and third metallizations.

8. The neural interface system of claim 1 wherein there are a plurality of upstanding second metallizations supported on the upper surface of the first metallization.

9. The neural interface system of claim 8 wherein the second height of the second metallization ranges from 225 nm to 2,250 nm above the first upper surface of the first metallization.

19. The neural interface system of claim 1 further comprising:

a) a third electrically conductive metallization different than the second metallization, the third metallization extending from a third metallization lower surface supported on the second metallization upper surface to a third metallization upper surface, wherein the third metallization lower and upper surfaces are spaced from each other by a third perimeter providing a third metallization height,

b) wherein the second metallization has a third cross-sectional width at spaced locations where its second upper surface meets the second perimeter,

c) wherein the third metallization has a fourth cross-sectional width at spaced locations where its third lower surface meets the third perimeter,

d) wherein the third width of the second metallization is less than the fourth width of the third metallization to thereby provide an undercut portion of the third metallization lower surface adjacent to the second perimeter of the second metallization, and

e) wherein the substrate supporting the first, second and third metallizations is configured as an electrode contactable with body tissue.

20. The neural interface system of claim 19 wherein there are at least two second metallizations supporting respective third metallizations supported on the first metallization and wherein the second and third metallizations do not contact each other to thereby provide at least one recess between the second and third metallizations.

10. A method for providing a neural interface system, comprising the steps of:

a) providing a substrate;

b) depositing at least one first electrically conductive metallization supported on the substrate, the first metallization extending from a first metallization lower surface supported on the substrate to a first metallization upper surface, wherein the first metallization lower and upper surfaces are spaced from each other by a first perimeter providing a first metallization height;

c) depositing a second electrically conductive metallization different than the first metallization, the second metallization extending from a second metallization lower surface supported on the first metallization upper surface to a second metallization upper surface, wherein the second metallization lower and upper surfaces are spaced from each other by a second perimeter providing a second metallization height;

d) etching at least the second metallization to thereby provide the first metallization having a first cross-sectional width at spaced locations where its first upper surface meets the first perimeter, and the second metallization having a second cross-sectional width at spaced locations where its second lower surface meets the second perimeter, and wherein etching results in the first width of the first metallization being greater than the second width of the second metallization to thereby provide an exposed portion of the first metallization upper surface adjacent to the second perimeter of the second metallization; and

e) configuring the substrate supporting the first and second metallizations as an electrode contactable with body tissue.

11. The method of claim 10 including providing the first width of the first metallization ranging from 0.25 micron to 20 microns.

12. The method of claim 10 including providing the second metallization comprising gold and selecting the first metallization from the group consisting of platinum, iridium, platinum/iridium alloy, iridium oxide, and titanium nitride.

13. The method of claim 10 including providing the substrate as a dielectric material and selecting the dielectric material from the group consisting of parylene, polyimide, silicone, silicon carbide, and silicon.

14. The method of claim 10 including providing at least two second metallizations supported on the first metallization and further providing the second metallizations not contacting each other to thereby provide at least one recess between the second metallizations.

15. The method of claim 14 including providing the at least one recess extending from 50% to 90% into the first height of the first metallization from the first upper surface thereof.

16. The method of claim 10 including depositing at least two second metallizations supported on at least two respective first metallizations and further providing the first and second metallizations not contacting each other to thereby provide at least one recess therebetween.

17. The method of claim 10 including providing a plurality of second metallizations supported on the upper surface of the first metallization.

18. The method of claim 10 including providing the second height of the second metallization ranging from 225 nm to 2,250 nm above the upper surface of the first metallization.

21. A neural interface system, which comprises:

a) a substrate;

b) a first electrically conductive metallization of a less etchable material than gold and extending from a first metallization lower surface supported on the substrate to a first metallization upper surface, wherein the first metallization lower and upper surfaces are spaced from each other by a first perimeter providing a first metallization height;

c) a second, gold metallization extending from a second metallization lower surface supported on the first metallization upper surface to a second metallization upper surface, wherein the second metallization lower and upper surfaces are spaced from each other by a second perimeter providing a second metallization height;

d) a third electrically conductive metallization of a less etchable material than gold and extending from a third metallization lower surface supported on the second metallization upper surface to a third metallization upper surface, wherein the third metallization lower and upper surfaces are spaced from each other by a third perimeter providing a third metallization height;

e) wherein the first metallization has a first cross-sectional width at spaced locations where its first upper surface meets the first perimeter, and the second metallization has a second cross-sectional width at spaced locations where its second lower surface meets the second perimeter, and wherein the first width of the first metallization is greater than the second width of the second metallization to thereby provide an exposed portion of the first metallization upper surface adjacent to the second perimeter of the second metallization, and

f) wherein the second metallization has a third cross-sectional width at spaced locations where its second upper surface meets the second perimeter, and the third metallization has a fourth cross-sectional width at spaced locations where its third lower surface meets the third perimeter, and wherein the third width of the second metallization is less than the fourth width of the third metallization to thereby provide an undercut portion of the third metallization lower surface adjacent to the second perimeter of the second metallization, and

g) wherein the substrate supporting the first, second and third metallizations is configured as an electrode contactable with body tissue.

22. The neural interface system of claim 21 wherein the second and third widths are substantially the same or the third width is less than the second width.

23. The neural interface system of claim 21 further comprising:

a) a fourth, gold metallization extending from a fourth metallization lower surface supported on the third metallization upper surface to a fourth metallization upper surface, wherein the fourth metallization lower and upper surfaces are spaced from each other by a fourth perimeter providing a fourth metallization height;

b) wherein the third metallization has a fifth cross-sectional width at spaced locations where its third upper surface meets the third perimeter, and the fourth metallization has a sixth cross-sectional width at spaced locations where its fourth lower surface meets the fourth perimeter, and wherein the fifth width of the third metallization is greater than the sixth width of the fourth metallization to thereby provide an exposed portion of the third metallization upper surface adjacent to the fourth perimeter of the fourth metallization, and

c) wherein the substrate supporting the first, second, third and fourth metallizations is configured as an electrode contactable with body tissue.

24. The neural interface system of claim 23 further comprising:

a) a fifth electrically conductive metallization of a less etchable material than gold and extending from a fifth metallization lower surface supported on the fourth metallization upper surface to a fifth metallization upper surface, wherein the fifth metallization lower and upper surfaces are spaced from each other by a fifth perimeter providing a fifth metallization height,

b) wherein the fourth metallization has a seventh cross-sectional width at spaced locations where its fourth upper surface meets the fourth perimeter, and the fifth metallization has an eighth cross-sectional width at spaced locations where its fifth lower surface meets the fifth perimeter, and wherein the seventh width of the fourth metallization is less than the eighth width of the fifth metallization to thereby provide an undercut portion of the fifth metallization lower surface adjacent to the fourth perimeter of the fourth metallization, and

c) wherein the substrate supporting the first, second, third, fourth and fifth metallizations is configured as an electrode contactable with body tissue.

25. The neural interface system of claim 24 wherein the sixth and seventh widths are substantially the same or the seventh width is less than the sixth width.

26. The neural interface system of claim 24 further comprising:

a) a sixth, gold metallization extending from a sixth metallization lower surface supported on the fifth metallization upper surface to a sixth metallization upper surface, wherein the sixth metallization lower and upper surfaces are spaced from each other by a sixth perimeter providing a sixth metallization height;

b) wherein the fifth metallization has a ninth cross-sectional width at spaced locations where its fifth upper surface meets the fifth perimeter, and the sixth metallization has a tenth cross-sectional width at spaced locations where its sixth lower surface meets the sixth perimeter, and wherein the ninth width of the fifth metallization is greater than the tenth width of the sixth metallization to thereby provide an exposed portion of the fifth metallization upper surface adjacent to the sixth perimeter of the sixth metallization, and

c) wherein the substrate supporting the first, second, third, fourth, fifth and sixth metallizations is configured as an electrode contactable with body tissue.

27. The neural interface system of claim 26 further comprising:

a) a seventh electrically conductive metallization of a less etchable material than gold and extending from a seventh metallization lower surface supported on the sixth metallization upper surface to a seventh metallization upper surface, wherein the seventh metallization lower and upper surfaces are spaced from each other by a seventh perimeter providing a seventh metallization height,

b) wherein the sixth metallization has an eleventh cross-sectional width at spaced locations where its sixth upper surface meets the sixth perimeter, and the seventh metallization has a twelfth cross-sectional width at spaced locations where its seventh lower surface meets the seventh perimeter, and wherein the eleventh width of the sixth metallization is less than the twelfth width of the seventh metallization to thereby provide an undercut portion of the seventh metallization lower surface adjacent to the sixth perimeter of the sixth metallization, and

c) wherein the substrate supporting the first, second, third, fourth, fifth, sixth and seventh metallizations is configured as an electrode contactable with body tissue.

28. The neural interface system of claim 27 wherein the tenth and eleventh widths are the substantially same or the eleventh width is less than the tenth width.

29. The neural interface system of claim 21 wherein the electrode is either a stimulation electrode of a recording electrode.