Method for manufacturing semiconductor devices
First Claim
1. A method for manufacturing a semiconductor device, wherein the semiconductor device has a transistor region and a resistor region, the method comprising:
- forming a first fin structure and a second fin structure on a substrate, wherein the first fin structure and the second fin structure are in the transistor region and the resistor region respectively;
forming a first stack structure and a second stack structure so as to respectively cover a portion of the first fin structure and of the second fin structure, wherein the first stack structure and the second stack structure respectively include a dummy layer and a hard mask layer from bottom to top;
forming a spacer respectively on sidewalls of the first stack structure and of the second stack structure through an atomic layer deposition process, wherein a composition of the spacers includes silicon carbon nitride;
forming an interlayer dielectric covering the first stack structure, the second stack structure and the spacers;
etching the interlayer dielectric so as to expose each of the hard mask layers;
forming a mask layer to cover the second stack structure and a portion of the dielectric layer;
removing the hard mask layer in the first stack structure under a coverage of the mask layer, wherein after the hard mask layer is removed, the height of the spacer is same as the height of the spacer before the hard mask layer is removed;
removing the dummy layer in the first stack structure to leave a first trench;
forming a high-k dielectric layer above sidewalls and a bottom of the first trench;
forming a work function metal layer on the high-k dielectric layer; and
filling up the first trench with a conductive layer after forming the work function metal layer on the high-k dielectric layer.
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Abstract
A method for manufacturing a semiconductor device is provided. A first stack structure and a second stack structure are formed to respectively cover a portion of a first fin structure and a second fin structure. Subsequently, a spacer is respectively formed on the sidewalls of the fin structures through an atomic layer deposition process and the composition of the spacers includes silicon carbon nitride. Afterwards, a interlayer dielectric is formed and etched so as to expose the hard mask layers. A mask layer is formed to cover the second stack structure and a portion of the dielectric layer. Later, the hard mask layer in the first stack structure is removed under the coverage of the mask layer. Then, a dummy layer in the first stack structure is replaced with a conductive layer.
114 Citations
15 Claims
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1. A method for manufacturing a semiconductor device, wherein the semiconductor device has a transistor region and a resistor region, the method comprising:
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forming a first fin structure and a second fin structure on a substrate, wherein the first fin structure and the second fin structure are in the transistor region and the resistor region respectively; forming a first stack structure and a second stack structure so as to respectively cover a portion of the first fin structure and of the second fin structure, wherein the first stack structure and the second stack structure respectively include a dummy layer and a hard mask layer from bottom to top; forming a spacer respectively on sidewalls of the first stack structure and of the second stack structure through an atomic layer deposition process, wherein a composition of the spacers includes silicon carbon nitride; forming an interlayer dielectric covering the first stack structure, the second stack structure and the spacers; etching the interlayer dielectric so as to expose each of the hard mask layers; forming a mask layer to cover the second stack structure and a portion of the dielectric layer; removing the hard mask layer in the first stack structure under a coverage of the mask layer, wherein after the hard mask layer is removed, the height of the spacer is same as the height of the spacer before the hard mask layer is removed; removing the dummy layer in the first stack structure to leave a first trench; forming a high-k dielectric layer above sidewalls and a bottom of the first trench; forming a work function metal layer on the high-k dielectric layer; and filling up the first trench with a conductive layer after forming the work function metal layer on the high-k dielectric layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification