Device and method for chip pressing

• US 9,196,600 B2
• Filed: 08/14/2012
• Issued: 11/24/2015
• Est. Priority Date: 03/13/2012
• Status: Active Grant

• Current Assignee: Ableprint Technology Co., Ltd.
• Original Assignee: Ableprint Technology Co., Ltd.
• Inventors: Horng, Chih-Horng
• Primary Examiner(s): KOCH, GEORGE R
• Application Number:
  US13/585,773
• Publication Number:
  US 20130240115A1
• Time in Patent Office: 1,197 Days
• Field of Search: 156/64, 156/351, 156/358, 156/359, 156/366, 156/367, 156/368, 156/378, 156/381, 156/382, 156/580, 156/583.1, 100/48, 100/50
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/75252 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/753 by means of pressure
• CPC Class Codes: H01L 2224/7598 specially adapted for batch processes
• CPC Class Codes: H01L 2224/83203 Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
• CPC Class Codes: H01L 2224/83209 applying isostatic pressure, e.g. degassing using vacuum or a pressurised liquid
• CPC Class Codes: H01L 2224/83862 Heat curing
• CPC Class Codes: H01L 24/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

Disclosed are embodiments related to chip pressing devices. One such chip pressing device includes a bottom portion and a top portion, which is configured to be attached to or separated from the bottom portion, and has a compartment portion, an upper chamber, and a lower chamber, wherein the upper chamber is spaced apart from the lower chamber by the compartment portion. The upper chamber has one or more gas passages, the lower chamber has one or more gas inlets and one or more gas outlets, and the compartment portion has one or more through-holes. One or more pressing heads movably fit into the through-holes; one or more gas pressure sources connected to at least one of the gas passages of the upper chamber, wherein the upper chamber is pressurized, and one or more heated gas sources are connected to the one or more gas inlets of the lower chamber.

Claims

1. A chip pressing device, comprising

a bottom portion;

a top portion, which is configured to be attached to or separated from the bottom portion, and has a compartment portion, an upper chamber, and a lower chamber, wherein the upper chamber is spaced apart from the lower chamber by the compartment portion, the upper chamber having one or more gas passages, the lower chamber having one or more gas inlets and one or more gas outlets, the compartment portion having one or more through-holes;

one or more pressing heads, which is configured to movably fit into the through-hole;

one or more gas pressure sources, connected to at least one of the gas passages of the upper chamber, wherein the upper chamber is pressurized through the gas passage connected to the gas pressure source so as to push the pressing heads towards the bottom portion; and

one or more heating gas sources, connected to the one or more gas inlets of the lower chamber,

wherein when the bottom portion and the top portion are attached to each other, the bottom portion tightly seals the lower chamber of the top portion.

2. The chip pressing device of claim 1, further comprising:

one or more cooling gas sources, connected to the one or more gas inlets of the lower chamber.

3. The chip pressing device of claim 1, wherein the gas pressure source is connected to the one or more gas inlets of the lower chamber.

4. The chip pressing device of claim 1, wherein the gas passage has one or more gas outlets, and the upper chamber is depressurized through the gas outlet of the gas passage.

5. The chip pressing device of claim 1, wherein the upper chamber has one or more gas outlets, and the upper chamber is be depressurized through the gas outlet of the upper chamber.

6. The chip pressing device of claim 1, wherein the compartment portion comprises one or more compartment chambers having at least one gas inlet and at least one gas outlet.

7. The chip pressing device of claim 6, wherein the gas inlet of the compartment chamber is connected to one or more cooling gas sources.

8. The chip pressing device of claim 1, wherein the gas pressure source is a constant gas pressure source.

9. The chip pressing device of claim 1, wherein the gas pressure source is an adjustable gas pressure source.

10. The chip pressing device of claim 1, further comprising:

one or more pressure sensors, which are disposed in the upper chamber.

11. The chip pressing device of claim 10, wherein the one or more pressure sensors are configured to transmit detection signals to the gas pressure source.

12. The chip pressing device of claim 1, further comprising:

one or more temperature sensors, which are disposed in the lower chamber.

13. The chip pressing device of claim 12, wherein the one or more temperature sensors are configured to transmit detection signals to the heating gas source.

14. The chip pressing device of claim 1, wherein the gas pressure source is provided with a heater.

15. The chip pressing device of claim 1, wherein the heating gas source is an adjustable pressure heating gas source or a constant pressure heating gas source.

16. The chip pressing device of claim 6, further comprising:

a vacuum source, which is connected to the compartment chamber.

17. The chip pressing device of claim 1, wherein the bottom portion has a first locating portion, and the top portion has a second locating portion matching the first locating portion.

18. A chip pressing method using the chip pressing device of claim 1, the method comprising:

placing a carrier, on which one or more chips is provided, on the bottom portion of the chip pressing device;

engaging the bottom portion with the top portion of the chip pressing device to make the pressing head contact the chip on the carrier;

introducing pressurized gas into the upper chamber through the gas pressure source to perform pressurization, so as to apply pressure to the pressing head to press the chip tightly onto the carrier or another chip; and

introducing heating gas into the lower chamber through the heating gas source to heat the chip and the carrier.

19. The chip pressing method of claim 18, further comprising:

depressurizing the upper chamber after heating the chip and the carrier.

20. The chip pressing method of claim 19, wherein the gas passage of the upper chamber of the chip pressing device has one or more gas outlets, and the upper chamber is depressurized through the one or more gas outlets of the gas passage after heating the chip and the carrier.

21. The chip pressing method of claim 19, wherein the upper chamber of the chip pressing device has one or more gas outlets, and the upper chamber is depressurized through the one or more gas outlets of the upper chamber after heating the chip and the carrier.

22. The chip pressing method of claim 18, further comprising:

introducing pressurized gas into the upper chamber through the gas pressure source to perform pressurization before the pressing head contacting the chip, so as to apply pressure to the pressing head to move the pressing head to a predetermined position.

23. The chip pressing method of claim 18, wherein the chip pressing device further comprises one or more cooling gas sources connected to the one or more gas inlets of the lower chamber, wherein cooling gas is introduced into the lower chamber through the cooling gas source to cool the chip and the carrier.

24. The chip pressing method of claim 18, wherein in the step of introducing pressurized gas into the upper chamber, the pressure of pressurization ranges from 1 atm to 50 atm.

25. The chip pressing method of claim 18, wherein in the step of introducing heating gas into the lower chamber, the temperature of the heating gas ranges from 40°

C. to 800°

C.

26. The chip pressing method of claim 18, wherein when the chip pressing device comprises multiple heating gas sources, heating gases with different temperatures are introduced into the lower chamber through the multiple heating gas sources respectively, so as to perform a multi-stage temperature heating control.

27. The chip pressing method of claim 18, wherein when the chip pressing device comprises multiple gas pressure sources, gases with different pressures are introduced into the upper chamber through the multiple gas pressure sources respectively, so as to perform a multi-stage pressing head pressurization control.

28. The chip pressing method of claim 27, wherein the multiple gas pressure sources are adjustable gas pressure sources.

29. The chip pressing method of claim 18, wherein the gas pressure source is connected to one or more gas inlets of the lower chamber, so as to supply the pressurized gas into the lower chamber.

30. The chip pressing method of claim 18, wherein the compartment portion of the chip pressing device comprises one or more compartment chambers each having at least one gas inlet and at least one gas outlet.

31. The chip pressing method of claim 30, wherein the gas inlet of the compartment chamber is connected to one or more cooling gas sources, so as to introduce cooling gas into the compartment chamber.

32. The chip pressing method of claim 30, wherein the chip pressing device further comprises a vacuum source connected to the compartment chamber, so as to maintain the compartment chamber in a vacuum state below 1 atm.

33. The chip pressing method of claim 18, wherein the chip pressing device further comprises one or more pressure sensors, which are disposed inside the upper chamber.

34. The chip pressing method of claim 33, wherein the one or more pressure sensors are configured to transmit detection signals to the gas pressure source.

35. The chip pressing method of claim 18, wherein the chip pressing device further comprises one or more temperature sensors, which are disposed inside the lower chamber.

36. The chip pressing method of claim 35, wherein the one or more temperature sensors are configured to transmit detection signals to the heating gas source.

37. The chip pressing method of claim 18, wherein the gas pressure source is provided with a heater, whereby the pressurized gas is heated to a predetermined temperature, the predetermined temperature ranging from 40°

C. to 800°

C.

38. The chip pressing method of claim 18, wherein the heating gas source is an adjustable pressure heating gas source or a constant pressure heating gas source, so as to supply heating gas at a predetermined pressure, the predetermined pressure ranging from 1 atm to 50 atm.

39. The chip pressing method of claim 18, wherein the bottom portion of the chip pressing device has a first locating portion, and the top portion has a second locating portion matching the first locating portion, so as to facilitate location between the top portion and the bottom portion.