Method of forming a low profile image sensor package

• US 9,196,650 B2
• Filed: 05/13/2014
• Issued: 11/24/2015
• Est. Priority Date: 09/10/2012
• Status: Active Grant

• Current Assignee: Optiz, Inc.
• Original Assignee: Optiz, Inc.
• Inventors: Oganesian, Vage
• Primary Examiner(s): Jahan, Bilkis
• Application Number:
  US14/276,023
• Publication Number:
  US 20140248736A1
• Time in Patent Office: 560 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/1464 Back illuminated imager structures
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

An image sensor package, and method of making same, that includes a printed circuit board having a first substrate with an aperture extending therethrough, one or more circuit layers, and a plurality of first contact pads electrically coupled to the one or more circuit layers. A sensor chip mounted to the printed circuit board and disposed at least partially in the aperture. The sensor chip includes a second substrate, a plurality of photo detectors formed on or in the second substrate, and a plurality of second contact pads formed at the surface of the second substrate which are electrically coupled to the photo detectors. Electrical connectors each electrically connect one of the first contact pads and one of the second contact pads. A lens module is mounted to the printed circuit board and has one or more lenses disposed for focusing light onto the photo detectors.

Claims

1. A method of forming an image sensor package, comprising:

providing a first substrate with opposing first and second surfaces and a plurality of image sensors formed thereon, wherein each image sensor includes a plurality of photo detectors formed on or in the first substrate and a plurality of first contact pads formed at the first surface of the first substrate which are electrically coupled to the photo detectors;

forming trenches into the first substrate first surface that extends partially through the first substrate, wherein each of the trenches is disposed between two of the plurality of image sensors;

forming a plurality of conductive traces each extending from one of the first contact pads and into one of the trenches;

dicing the first substrate into multiple separate image sensor assemblies along dicing lines in-between the image sensors, wherein each of the image sensor assemblies includes one of the image sensors;

mounting one of the image sensor assemblies to a printed circuit board, wherein the printed circuit board includes a second substrate with opposing first and second surfaces, an aperture formed through the second substrate, one or more circuit layers, and a plurality of second contact pads electrically coupled to the one or more circuit layers, wherein the first substrate of the one image sensor assembly is at least partially disposed in the aperture; and

wherein the mounting includes electrically connecting each of the plurality of conductive traces of the one image sensor assembly to one of the second contact pads.

2. The method of claim 1, wherein the electrically connecting includes using Ball Grid Array (BGA) or Land Grid Array electrical connectors.

3. The method of claim 1, further comprising:

mounting an optically transparent substrate to the printed circuit board, wherein the optically transparent substrate is disposed over the aperture.

4. The method of claim 1, further comprising:

mounting a lens module to the printed circuit board, wherein the lens module includes one or more lenses disposed for focusing light onto the photo detectors.