Organic light emitting display and method for manufacturing the same

• US 9,196,662 B2
• Filed: 05/15/2015
• Issued: 11/24/2015
• Est. Priority Date: 08/31/2012
• Status: Active Grant

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Display Co., Ltd.
• Inventors: Choi, Ho-Won, Lee, Jae-Do
• Primary Examiner(s): ZHU, SHENG-BAI
• Application Number:
  US14/713,661
• Publication Number:
  US 20150249114A1
• Time in Patent Office: 193 Days
• Field of Search: 257/40, 257/88, 257/91, 257/E91.001, 438/29, 438/23, 438/34
• US Class Current: 1/1
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 2203/04111 Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
• CPC Class Codes: G06F 3/0412 Digitisers structurally integrated in a display
• CPC Class Codes: G06F 3/0443 using a single layer of sensing electrodes
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
• CPC Class Codes: H10K 30/87 Light-trapping means
• CPC Class Codes: H10K 50/805 Electrodes
• CPC Class Codes: H10K 50/865 comprising light absorbing layers, e.g. light-blocking layers
• CPC Class Codes: H10K 59/1201 Manufacture or treatment
• CPC Class Codes: H10K 59/38 comprising colour filters or colour changing media [CCM]
• CPC Class Codes: H10K 59/40 OLEDs integrated with touch screens
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/80 using temporary substrates
• CPC Class Codes: Y02E 10/549 Organic PV cells

Abstract

Disclosed are an organic light emitting display that has a configuration excluding a polarizing plate and exhibits improved flexibility and visibility, and a method for manufacturing the same, the organic light emitting display includes a touch electrode array facing the organic light emitting diode on the second buffer layer, the touch electrode array including first and second touch electrodes intersecting each other and an exterior light shielding layer including at least a color filter layer, an adhesive layer formed between the organic light emitting diode and the touch electrode array.

Claims

1. A method for fabricating an organic light emitting display comprising:

forming a first etch stopper film and a first buffer layer on a first substrate, and forming a thin film transistor array comprising a thin film transistor in each of a plurality of pixels defined in a matrix form and an organic light emitting diode connected to a thin film transistor of each pixel in an active region of the first buffer layer;

forming a second etch stopper film and a second buffer layer on a second substrate;

forming a touch electrode array on the second buffer layer, wherein the touch electrode array comprises first and second touch electrodes intersecting each other, and an exterior light shielding layer comprising at least a color filter layer;

joining the first and second substrates via an adhesive layer between the organic light emitting diode and the touch electrode array;

removing the first substrate and the second substrate; and

adhering a film substrate to the exposed first etch stopper film and covering the exposed second etch stopper film with a cover glass.

2. The method according to claim 1, further comprising forming a black matrix layer within the exterior light shielding layer.

3. The method according to claim 2, wherein the forming the touch electrode array comprises:

forming a metal bridge on the second buffer layer;

forming a first interlayer insulating film comprising a contact hole at both ends of the metal bridge on the second buffer layer;

patterning a transparent electrode on the first interlayer insulating film, to form a plurality of first electrode patterns connected through the contact hole to the metal bridge in an island shape in a first direction, and a plurality of second electrode patterns, each having the same shape as each of the first electrode patterns, and forming a connection pattern to integrally connect adjacent second electrode patterns.

4. The method according to claim 3, further comprising:

forming a second interlayer insulating film on the first interlayer insulating film including the plurality of first electrode patterns, the plurality of second electrode patterns and the connection pattern; and

forming a common transparent electrode pattern that covers the plurality of first electrode patterns, the plurality of second electrode patterns and the connection pattern, on the second interlayer insulating film.

5. The method according to claim 3, wherein forming the black matrix layer and the color filter layer is processed during the forming a first interlayer insulating film.

6. The method according to claim 4, wherein forming the black matrix layer and the color filter layer is processed during the forming a second interlayer insulating film on the first interlayer insulating film.

7. The method according to claim 4, wherein forming one of the black matrix layer and the color filter layer is processed during the forming a first interlayer insulating film and forming the other is processed during the forming a second interlayer insulating film on the first interlayer insulating film.

8. The method according to claim 3, wherein forming the black matrix layer and color filter layer is processed directly on the second buffer layer before the forming a metal bridge on the second buffer layer.

9. The method according to claim 4, wherein forming the black matrix layer and the color filter layer are processed on the common transparent electrode pattern after the forming a common transparent electrode pattern that covers the plurality of first electrode patterns, the plurality of second electrode patterns and the connection pattern.

10. The method according to claim 1, wherein the step of removing the first substrate and the second substrate is carried out by etching or laser-irradiating the first substrate and the second substrate.