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Through substrate features in semiconductor substrates

  • US 9,196,670 B2
  • Filed: 02/13/2014
  • Issued: 11/24/2015
  • Est. Priority Date: 09/25/2009
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a through substrate via disposed in a first region of a semiconductor substrate;

    a through substrate conductor coil disposed in a second region of the semiconductor substrate;

    an insulating liner disposed on sidewall of the through substrate via; and

    a sidewall insulating liner disposed on the sidewall of the semiconductor device, the sidewall insulating liner covering a sidewall of the semiconductor substrate, wherein the insulating liner and the sidewall insulating liner comprise the same material.

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