Method of manufacturing semiconductor device having oxide semiconductor layer
First Claim
1. A method for manufacturing a semiconductor device, comprising the steps of:
- forming an insulating layer comprising an oxide over a substrate;
adding oxygen to the insulating layer to increase an oxygen concentration in the insulating layer;
forming an oxide semiconductor layer over the insulating layer after adding oxygen to the insulating layer; and
heating the oxide semiconductor layer at a temperature of 200°
C. or higher.
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Abstract
An object is to provide favorable interface characteristics of a thin film transistor including an oxide semiconductor layer without mixing of an impurity such as moisture. Another object is to provide a semiconductor device including a thin film transistor having excellent electric characteristics and high reliability, and a method by which a semiconductor device can be manufactured with high productivity. A main point is to perform oxygen radical treatment on a surface of a gate insulating layer. Accordingly, there is a peak of the oxygen concentration at an interface between the gate insulating layer and a semiconductor layer, and the oxygen concentration of the gate insulating layer has a concentration gradient. The oxygen concentration is increased toward the interface between the gate insulating layer and the semiconductor layer.
150 Citations
17 Claims
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1. A method for manufacturing a semiconductor device, comprising the steps of:
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forming an insulating layer comprising an oxide over a substrate; adding oxygen to the insulating layer to increase an oxygen concentration in the insulating layer; forming an oxide semiconductor layer over the insulating layer after adding oxygen to the insulating layer; and heating the oxide semiconductor layer at a temperature of 200°
C. or higher. - View Dependent Claims (2, 3, 4, 5, 6, 14)
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7. A method for manufacturing a semiconductor device, comprising the steps of:
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forming a gate electrode layer over a substrate; forming a gate insulating layer comprising an oxide over the gate electrode layer; adding oxygen to the gate insulating layer to increase an oxygen concentration in the gate insulating layer; forming an oxide semiconductor layer on the gate insulating layer after adding oxygen to the gate insulating layer; and heating the oxide semiconductor layer at a temperature of 200°
C. or higher. - View Dependent Claims (8, 9, 10, 11)
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12. A method for manufacturing a semiconductor device, comprising the steps of:
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forming an insulating layer comprising an oxide over a substrate; adding oxygen to the insulating layer to increase an oxygen concentration in the insulating layer; forming an oxide semiconductor layer over the insulating layer after adding oxygen to the insulating layer; forming an insulating film over the oxide semiconductor layer; and heating the oxide semiconductor layer at a temperature of 200°
C. or higher. - View Dependent Claims (13, 15, 16, 17)
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Specification