Light emitting diode device and flip-chip packaged light emitting diode device
First Claim
1. A light emitting diode device, comprising:
- a device substrate;
a first-type doping layer, disposed on said device substrate;
a light emitting layer, disposed on said first-type doping layer;
a second-type doping layer, disposed on said light emitting layer;
a plurality of Ohmic-contact layers and a plurality of planarized buffer layers, disposed on said second-type doping layer, said Ohmic-contact layers and said planarized buffer layers being stacked together, said planarized buffer layers being configured for mending said Ohmic-contact layers;
a reflection layer, disposed on said stacked layers of Ohmic-contact layers and said planarized buffer layers; and
two electrodes, disposed on said reflection layer and said first-type doping layer, respectively.
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Accused Products
Abstract
The present invention relates to a light emitting diode (LED) and a flip-chip packaged LED device. The present invention provides an LED device. The LED device is flipped on and connected electrically with a packaging substrate and thus forming the flip-chip packaged LED device. The LED device mainly has an Ohmic-contact layer and a planarized buffer layer between a second-type doping layer and a reflection layer. The Ohmic-contact layer improves the Ohmic-contact characteristics between the second-type doping layer and the reflection layer without affecting the light emitting efficiency of the LED device and the flip-chip packaged LED device. The planarized buffer layer id disposed between the Ohmic-contact layer and the reflection layer for smoothening the Ohmic-contact layer and hence enabling the reflection layer to adhere to the planarized buffer layer smoothly. Thereby, the reflection layer can have the effect of mirror reflection and the scattering phenomenon on the reflected light can be reduced as well.
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Citations
34 Claims
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1. A light emitting diode device, comprising:
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a device substrate; a first-type doping layer, disposed on said device substrate; a light emitting layer, disposed on said first-type doping layer; a second-type doping layer, disposed on said light emitting layer; a plurality of Ohmic-contact layers and a plurality of planarized buffer layers, disposed on said second-type doping layer, said Ohmic-contact layers and said planarized buffer layers being stacked together, said planarized buffer layers being configured for mending said Ohmic-contact layers; a reflection layer, disposed on said stacked layers of Ohmic-contact layers and said planarized buffer layers; and two electrodes, disposed on said reflection layer and said first-type doping layer, respectively. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A flip-chip packaged light emitting diode device, comprising:
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a packaging substrate; a light emitting diode device, flipped on and connected electrically with said packaging substrate, and said light emitting diode device comprising; a device substrate; a first-type doping layer, disposed on said device substrate; a light emitting layer, disposed on said first-type doping layer; a second-type doping layer, disposed on said light emitting layer; a plurality of Ohmic-contact layers and a plurality of planarized buffer layers, disposed on said second-type doping layer, said Ohmic-contact layers and said planarized buffer layers being stacked together, said planarized buffer layers being configured for mending said Ohmic-contact layers; a reflection layer, disposed on said stacked layers of said Ohmic-contact layers and said planarized buffer layers; and two electrodes, disposed on said reflection layer and said first-type doping layer, respectively. - View Dependent Claims (14)
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15. A light emitting diode device, comprising:
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a device substrate; a first-type doping layer, disposed on said device substrate; a light emitting layer, disposed on said first-type doping layer; a second-type doping layer, disposed on said light emitting layer; a plurality of Ohmic-contact layers and a plurality of planarized buffer layers, disposed on said second-type doping layer, said Ohmic-contact layers and said planarized buffer layers being stacked together, said planarized buffer layers being configured for mending said Ohmic-contact layers; a reflection layer, disposed on said stacked layers of Ohmic-contact layers and said planarized buffer layers, wherein a root-mean-square roughness of a surface between said planarized buffer layers and the reflection layer is less than a surface roughness of the ohmic-contact layers; and two electrodes, disposed on said reflection layer and said first-type doping layer, respectively. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24)
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25. A light emitting diode device, comprising:
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a device substrate; a first-type doping layer, disposed on said device substrate; a light emitting layer, disposed on said first-type doping layer; a second-type doping layer, disposed on said light emitting layer; a plurality of Ohmic-contact layers and a plurality of planarized buffer layers disposed on said second-type doping layer, said Ohmic-contact layers and said planarized buffer layers being stacked together, said planarized buffer layers being configured for mending said Ohmic-contact layers; a reflection layer, disposed on said stacked layers of Ohmic-contact layers and said planarized buffer layers, wherein a root-mean-square roughness of a surface between a planarized buffer layer and the reflection layer is less than a surface roughness of an Ohmic-contact layer; and two electrodes, disposed on said reflection layer and said first-type doping layer, respectively. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32, 33, 34)
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Specification