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LED chips having fluorescent substrates with microholes and methods for fabricating

  • US 9,196,799 B2
  • Filed: 08/22/2008
  • Issued: 11/24/2015
  • Est. Priority Date: 01/22/2007
  • Status: Active Grant
First Claim
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1. A light emitting diode (LED) chip wafer, comprising:

  • a plurality of LEDs on a wafer, said wafer comprising a first alignment element;

    a fluorescent preform covering at least some of said LEDs and contacting at least two of said plurality of LEDs, said preform comprising a second alignment element, said first and second alignment elements cooperating to provide the desired alignment of said preform over said LEDs; and

    wherein said wafer is capable of being separated into LED chips.

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