High performance surface mount electrical interconnect with external biased normal force loading

• US 9,196,980 B2
• Filed: 03/13/2012
• Issued: 11/24/2015
• Est. Priority Date: 06/02/2009
• Status: Active Grant

• Current Assignee: James Rathburn
• Original Assignee: HSIO Technologies LLC
• Inventors: Rathburn, James
• Primary Examiner(s): Sawyer, Steven T
• Application Number:
  US13/418,853
• Publication Number:
  US 20120244728A1
• Time in Patent Office: 1,351 Days
• US Class Current: 1/1
• CPC Class Codes: H01C 1/14 Terminals or tapping points or electrodes specially adapted for resistors in general H01R; Arrangements of terminals or tapping points or electrodes on resistors
• CPC Class Codes: H01G 4/228 Terminals
• CPC Class Codes: H01R 12/523 by an interconnection through aligned holes in the boards or multilayer board
• CPC Class Codes: H01R 12/7082 Coupling device supported only by cooperation with PCB
• CPC Class Codes: H05K 1/0231 Capacitors or dielectric substances
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/049 PCB for one component, e.g. for mounting onto mother PCB
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/4038 Through-connections; Vertical interconnect access [VIA] connections H05K3/403, H05K3/42 take precedence
• CPC Class Codes: H05K 3/4092 Integral conductive tabs, i.e. conductive parts partly detached from the substrate
• CPC Class Codes: H05K 7/1069 with spring contact pieces
• CPC Class Codes: H05K 7/1092 with built-in components, e.g. intelligent sockets
• CPC Class Codes: Y10T 29/43 Electric condenser making
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49099 Coating resistive material on a base
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49222 forming array of contacts or terminals

Abstract

A surface mount electrical interconnect adapted to provide an interface between solder balls on a BGA device and a PCB. A socket substrate is provided with a first surface, a second surface, and a plurality of openings sized and configured to receive the solder balls on the BGA device. A plurality of electrically conductive contact tabs are attached to the socket substrate so that contact tips on the contact tabs extend into the openings. The contact tips electrically couple with the BGA device when the solder balls are positioned in the openings. Vias electrically couple the contact tabs to contact pads located proximate the second surface of the socket substrate. Solder balls are bonded to the contact pads to electrically and mechanically couple the electrical interconnect to the PCB.

Claims

1. A surface mount electrical interconnect forming an interface between a first set of solder balls on a BGA device and a PCB, the electrical interconnect comprising:

a socket substrate comprising a first surface, a second surface, and a plurality of openings sized and configured to receive the first set of solder balls on the BGA device;

a plurality of electrically conductive contact tabs attached to the socket substrate so that contact tips on the contact tabs extend into the openings an amount that permits the solder balls of the BGA device to be inserted into the openings with no resistance;

a force generally parallel with the first surface of the socket substrate laterally shifting the BGA device so the contact tips engage with the first set of solder balls near an upper radii thereof proximate a second interface of the first set of solder balls with the BGA device to electrically couple the contact tabs with the BGA device and to secure the first set of solder balls in the openings;

vias electrically coupling the contact tabs to contact pads located proximate the second surface of the socket substrate; and

a second set of solder balls bonded to the contact pads that electrically and mechanically couple the electrical interconnect to the PCB; and

wherein the electrically conductive contact tabs are attached to and extend into the openings generally parallel with the first surface of the socket substrate.

2. The electrical interconnect of claim 1 comprising at least one dielectric layer printed on the first surface of the socket substrate mechanically supporting the contact tabs.

3. The electrical interconnect of claim 1 wherein the vias comprise conductive plating extending along surfaces of the openings.

4. The electrical interconnect of claim 1 wherein the vias comprise discrete structures separate from the openings.

5. The electrical interconnect of claim 1 comprising at least one additional circuitry plane in the socket substrate, the additional circuitry plane selected from one of a ground plane, a power plane, an electrical connection to other circuit members, a dielectric layer, or a flexible circuit.

6. The electrical interconnect of claim 1 comprising a plurality of conductive contact tabs electrically and mechanically coupled to the vias and extending into the openings in a spaced configuration.

7. The electrical interconnect of claim 1 wherein the contact tabs comprise a discrete contact members located in a plurality of the openings in the socket substrate.

8. The electrical interconnect of claim 1 comprising at least one printed electrical device located on the socket substrate and electrically coupled to at least a one of the contact tabs, wherein the electrical device is selected from one of shielding, near device decoupling, capacitors, transistors, resistors, filters, signal or power altering and enhancing devices, memory devices, embedded IC devices, RF antennae, and the like.

9. The electrical interconnect of claim 1 comprising:

at least one dielectric layer printed on one of the first or second surfaces of the socket substrate, the dielectric layer comprising a plurality recesses; and

an optical quality material deposited in recesses.

10. An electrical interconnect assembly comprising:

a housing that retains the electrical interconnect of claim 1;

a BGA device with a first set of solder balls located in the openings in the socket substrate and electrically coupled to the contact tips of the contact tabs; and

a PCB soldered to the contact pads located at the second surface of the socket substrate.

11. The electrical interconnect of claim 1 comprising an external loading mechanism laterally shifting the BGA device parallel to the first surface of the socket substrate.

12. The electrical interconnect of claim 1 wherein releasing the force permits the BGA device to be removed from the socket substrate without resistance.

13. The electrical interconnect of claim 1 wherein the contact tips comprise a curve surface complementary to a shape of the upper radii of the first set of solder balls on the BGA device.

14. The electrical interconnect of claim 1 wherein a lower surface of the BGA device adjacent the second interface is adjacent the first surface of the socket interface when the first set of solder balls are positioned in the openings.

15. The electrical interconnect of claim 7 wherein the openings are configured to permit the contact members to flex to facilitate inserting the first set of solder balls on the BGA device into the openings.

16. The electrical interconnect of claim 7 wherein the contact tabs comprises a spring arm that flex during insertion of the first set of solder balls on the BGA device into the openings.

17. A surface mount electrical interconnect forming an interface between a first set of solder balls on a BGA device and a PCB, the electrical interconnect comprising:

a socket substrate comprising a first surface, a second surface, and a plurality of openings sized and configured to receive the first set of solder balls on the BGA device;

a plurality of electrically conductive contact tabs attached to the first surface of the socket substrate so that contact tips on the contact tabs extend into the openings generally parallel to the first surface an amount that permits the solder balls of the BGA device to be inserted into the openings with no resistance so a lower surface of the BGA device is adjacent the first surface of the socket substrate;

a force generally parallel with the first surface of the socket substrate laterally shifting the BGA device so the contact tips engage with the first set of solder balls near an upper radii thereof proximate a second interface of the first set of solder balls with the BGA device to electrically couple the contact tabs with the BGA device and to secure the first set of solder balls in the openings;

vias electrically coupling the contact tabs to contact pads located proximate the second surface of the socket substrate; and

a second set of solder balls bonded to the contact pads that electrically and mechanically couple the electrical interconnect to the PCB.