Transferable probe tips
First Claim
1. A transferable probe tip, wherein the transferable probe tip comprises:
- a metallic non-compliant probe, wherein the metallic probe is non-compliant from a bottom portion of the metallic probe through an upper portion of the metallic probe that is affixed to a non-compliant tip;
a delamination layer, wherein the delamination layer covers a portion of the metallic probe, and wherein the delamination layer comprises SiO2; and
a bonding alloy, wherein the bonding alloy contacts the metallic probe at a portion of the probe that is not covered by the delamination layer.
1 Assignment
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Accused Products
Abstract
Transferable probe tips including a metallic probe, a delamination layer covering a portion of the metallic probe, and a bonding alloy, wherein the bonding alloy contacts the metallic probe at a portion of the probe that is not covered by the delamination layer are provided herein. Also, techniques for creating a transferable probe tip are provided, including etching a handler substrate to form one or more via arrays, depositing a delamination layer in each via array, depositing one or more metals in each via array to form a probe tip structure, and depositing a bonding alloy on a portion of the probe tip structure that is not covered by the delamination layer. Additionally, techniques for transferring transferable probe tips are provided, including removing a handler substrate from a probe tip structure, and transferring the probe tip structure via flip-chip joining the probe tip structure to a target probe head substrate.
27 Citations
22 Claims
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1. A transferable probe tip, wherein the transferable probe tip comprises:
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a metallic non-compliant probe, wherein the metallic probe is non-compliant from a bottom portion of the metallic probe through an upper portion of the metallic probe that is affixed to a non-compliant tip; a delamination layer, wherein the delamination layer covers a portion of the metallic probe, and wherein the delamination layer comprises SiO2; and a bonding alloy, wherein the bonding alloy contacts the metallic probe at a portion of the probe that is not covered by the delamination layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for creating a transferable probe tip, comprising the steps of:
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etching a handler substrate to form one or more via arrays; depositing a delamination layer in each via array, wherein the delamination layer comprises SiO2; depositing one or more metals in each via array to form a non-compliant probe structure, wherein the probe structure is non-compliant from a bottom portion of the probe structure through an upper portion of the probe structure that is affixed to a non-compliant tip of the probe structure; and depositing a bonding alloy on a portion of the non-compliant probe tip structure that is not covered by the delamination layer. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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Specification