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Semiconductor package with air pressure sensor

  • US 9,200,973 B2
  • Filed: 06/28/2012
  • Issued: 12/01/2015
  • Est. Priority Date: 06/28/2012
  • Status: Active Grant
First Claim
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1. A semiconductor package, comprising:

  • a substrate comprising a plurality of build-up layers;

    a semiconductor die housed in the substrate;

    a cavity disposed in one or more of the build-up layers, above the semiconductor die;

    an air pressure sensor disposed in the plurality of build-up layers and comprising the cavity and an electrode disposed above the cavity, the electrode electrically coupled to the semiconductor die; and

    one or more openings exposing a portion of the air pressure sensor to air pressure ambient to the semiconductor package.

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