Semiconductor package with air pressure sensor
First Claim
Patent Images
1. A semiconductor package, comprising:
- a substrate comprising a plurality of build-up layers;
a semiconductor die housed in the substrate;
a cavity disposed in one or more of the build-up layers, above the semiconductor die;
an air pressure sensor disposed in the plurality of build-up layers and comprising the cavity and an electrode disposed above the cavity, the electrode electrically coupled to the semiconductor die; and
one or more openings exposing a portion of the air pressure sensor to air pressure ambient to the semiconductor package.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor package having an air pressure sensor and methods to form a semiconductor package having an air pressure sensor are described. For example, a semiconductor package includes a plurality of build-up layers. A cavity is disposed in one or more of the build-up layers. An air pressure sensor is disposed in the plurality of build-up layers and includes the cavity and an electrode disposed above the cavity. Also described are various approaches to fabricating a semiconductor package having a hermetically sealed region.
-
Citations
14 Claims
-
1. A semiconductor package, comprising:
-
a substrate comprising a plurality of build-up layers; a semiconductor die housed in the substrate; a cavity disposed in one or more of the build-up layers, above the semiconductor die; an air pressure sensor disposed in the plurality of build-up layers and comprising the cavity and an electrode disposed above the cavity, the electrode electrically coupled to the semiconductor die; and one or more openings exposing a portion of the air pressure sensor to air pressure ambient to the semiconductor package. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
-
Specification