Semiconductor device
First Claim
1. A semiconductor device comprising:
- a semiconductor film over a substrate;
a first insulating film over the semiconductor film;
a first conductive film over the first insulating film;
a second insulating film over the first conductive film;
a second conductive film having a light-transmitting property and a third conductive film over the second insulating film;
a fourth conductive film having a light-blocking property over the second conductive film;
a third insulating film over the third conductive film and the fourth conductive film; and
a fifth conductive film over the third insulating film,wherein the fourth conductive film includes a first layer including molybdenum in contact with the second conductive film at least partly and a second layer including aluminum in contact with the first layer at least partly,wherein the first layer includes a region in contact with the second conductive film,wherein the second layer includes a region in contact with the first layer,wherein each of the second conductive film, the third conductive film, and the fifth conductive film includes indium tin oxide, andwherein the fifth conductive film is in contact with the third conductive film at least partly.
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Accused Products
Abstract
A semiconductor device includes an oxide semiconductor layer provided over a substrate having an insulating surface; a gate insulating film covering the oxide semiconductor layer; a first conductive layer and a second conductive layer laminated in this order over the gate insulating film; an insulating film covering the oxide semiconductor layer and a gate wiring including a gate electrode (the first and second conductive layers); and a third conductive layer and a fourth conductive layer laminated in this order over the insulating film and electrically connected to the oxide semiconductor layer. The gate electrode is formed using the first conductive layer. The gate wiring is formed using the first conductive layer and the second conductive layer. A source electrode is formed using the third conductive layer. A source wiring is formed using the third conductive layer and the fourth conductive layer.
162 Citations
20 Claims
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1. A semiconductor device comprising:
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a semiconductor film over a substrate; a first insulating film over the semiconductor film; a first conductive film over the first insulating film; a second insulating film over the first conductive film; a second conductive film having a light-transmitting property and a third conductive film over the second insulating film; a fourth conductive film having a light-blocking property over the second conductive film; a third insulating film over the third conductive film and the fourth conductive film; and a fifth conductive film over the third insulating film, wherein the fourth conductive film includes a first layer including molybdenum in contact with the second conductive film at least partly and a second layer including aluminum in contact with the first layer at least partly, wherein the first layer includes a region in contact with the second conductive film, wherein the second layer includes a region in contact with the first layer, wherein each of the second conductive film, the third conductive film, and the fifth conductive film includes indium tin oxide, and wherein the fifth conductive film is in contact with the third conductive film at least partly. - View Dependent Claims (2, 3, 4)
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5. A semiconductor device comprising:
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a semiconductor film over a substrate; a first insulating film over the semiconductor film; a first conductive film over the first insulating film; a second insulating film over the first conductive film; a second conductive film having a light-transmitting property and a third conductive film over the second insulating film; a fourth conductive film having a light-blocking property over the second conductive film; a third insulating film over the third conductive film and the fourth conductive film; and a fifth conductive film over the third insulating film; wherein the fourth conductive film includes a first layer including titanium in contact with the second conductive film at least partly and a second layer including aluminum in contact with the first layer at least partly, wherein the first layer includes a region in contact with the second conductive film, wherein the second layer includes a region in contact with the first layer, wherein each of the second conductive film, the third conductive film, and the fifth conductive film includes indium tin oxide, and wherein the fifth conductive film is in contact with the third conductive film at least partly. - View Dependent Claims (6, 7, 8)
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9. A semiconductor device comprising:
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a semiconductor film over a substrate; a first insulating film over the semiconductor film; a first conductive film over the first insulating film; a second insulating film over the first conductive film; a second conductive film having a light-transmitting property and a third conductive film over the second insulating film; a fourth conductive film having a light-blocking property over the second conductive film; a third insulating film over the third conductive film and the fourth conductive film; and a fifth conductive film over the third insulating film; wherein the fourth conductive film includes a first layer including tungsten in contact with the second conductive film at least partly and a second layer including aluminum in contact with the first layer at least partly, wherein the first layer includes a region in contact with the second conductive film, wherein the second layer includes a region in contact with the first layer, wherein each of the second conductive film, the third conductive film, and the fifth conductive film includes indium tin oxide, and wherein the fifth conductive film is in contact with the third conductive film at least partly. - View Dependent Claims (10, 11, 12)
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13. A semiconductor device comprising:
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a semiconductor film over a substrate; a first insulating film over the semiconductor film; a first conductive film over the first insulating film; a second insulating film over the first conductive film; a second conductive film having a light-transmitting property and a third conductive film over the second insulating film; a fourth conductive film having a light-blocking property over the second conductive film; a third insulating film over the third conductive film and the fourth conductive film; and a fifth conductive film over the third insulating film; wherein the fourth conductive film includes a first layer including tantalum in contact with the second conductive film at least partly and a second layer including aluminum in contact with the first layer at least partly, wherein the first layer includes a region in contact with the second conductive film, wherein the second layer includes a region in contact with the first layer, wherein each of the second conductive film, the third conductive film, and the fifth conductive film includes indium tin oxide, and wherein the fifth conductive film is in contact with the third conductive film at least partly. - View Dependent Claims (14, 15, 16)
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17. A semiconductor device comprising:
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a semiconductor film over a substrate; a first insulating film over the semiconductor film; a first conductive film over the first insulating film; a second insulating film over the first conductive film; a second conductive film having a light-transmitting property and a third conductive film over the second insulating film; a fourth conductive film having a light-blocking property over the second conductive film; a third insulating film over the third conductive film and the fourth conductive film; and a fifth conductive film over the third insulating film; wherein the fourth conductive film includes a first layer including chromium in contact with the second conductive film at least partly and a second layer including aluminum in contact with the first layer at least partly, wherein the first layer includes a region in contact with the second conductive film, wherein the second layer includes a region in contact with the first layer, wherein each of the second conductive film, the third conductive film, and the fifth conductive film includes indium tin oxide, and wherein the fifth conductive film is in contact with the third conductive film at least partly. - View Dependent Claims (18, 19, 20)
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Specification