Integrated circuit module with lead frame micro-needles

• US 9,202,705 B1
• Filed: 08/12/2015
• Issued: 12/01/2015
• Est. Priority Date: 07/09/2014
• Status: Expired due to Fees

• Current Assignee: Philips Healthcare Informatics Incorporated (Koninklijke Philips N.V.)
• Original Assignee: Qualcomm, Inc.
• Inventors: Kaskoun, Kenneth, Zhang, Rongtian, Nowak, Matthew Michael, Gu, Shiqun
• Primary Examiner(s): Parekh, Nitin
• Application Number:
  US14/824,345
• Time in Patent Office: 111 Days
• Field of Search: 438/123, 438/124, 438/127, 257/E23.048
• US Class Current: 1/1
• CPC Class Codes: A61B 2562/12 Manufacturing methods specially adapted for producing sensors for in-vivo measurements
• CPC Class Codes: A61B 5/24 Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
• CPC Class Codes: A61B 5/685 Microneedles
• CPC Class Codes: A61M 2037/0023 Drug applicators using microneedles
• CPC Class Codes: A61M 2037/0053 Methods for producing microneedles
• CPC Class Codes: A61M 37/0015 by using microneedles
• CPC Class Codes: H01L 21/306 Chemical or electrical treatment, e.g. electrolytic etching to form insulating layers H01L21/31
• CPC Class Codes: H01L 21/4842 Mechanical treatment, e.g. punching, cutting, deforming, cold welding
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 23/49548 Cross section geometry H01L23/49562 takes precedence

Abstract

An integrated circuit (IC) module with a lead frame micro-needle for a medical device, and methods of forming the IC module are described. The methods include forming a lead frame blank including a micro-needle integrally formed therein. The micro-needle may be bent beyond an initial lower side of the lead frame blank. The initial lower side may be joined with a protection layer such that the bent micro-needle is embedded in the protection layer, which may be removably attached to the initial lower side and the bent micro-needle. An IC component may be affixed to an upper side of the lead frame blank. The IC component and an upper surface of a core of the lead frame blank may be encapsulated with a molding compound forming a packaging of the IC module. Removal of the protection layer may expose the bent micro-needle projecting away from the packaging.

Claims

1. A method of forming an integrated circuit (IC) module with a lead frame micro-needle for a medical device, comprising:

forming a lead frame blank including a micro-needle integrally formed therein, the micro-needle disposed inward of an outer perimeter of the lead frame blank;

bending the micro-needle beyond an initial lower side of the lead frame blank;

joining the initial lower side of the lead frame blank with a protection layer such that the bent micro-needle is embedded in the protection layer, wherein the protection layer is removably attached to the initial lower side and the bent micro-needle of the lead frame blank;

affixing an IC component to an upper side of the lead frame blank; and

encapsulating the IC component and at least an upper surface of a core of the lead frame blank with a molding compound forming a packaging of the IC module, wherein removal of the protection layer exposes the bent micro-needle projecting away from the packaging.

2. The method of claim 1, wherein the micro-needle includes two opposed micro-needles extending toward one another prior to the bending of the two opposed micro-needles beyond the initial lower side of the lead frame blank.

3. The method of claim 1, further comprising:

sterilizing the lead frame blank before mounting the lead frame blank on the protection layer.

4. The method of claim 3, wherein the sterilizing the lead frame blank includes applying at least one member of the group consisting of steam, ethylene oxide, radiation, dry heat, and plasma to the lead frame blank.

5. The method of claim 1, further comprising:

attaching a substrate to the protection layer, wherein a first adhesion strength between the protection layer and the substrate is stronger than a second adhesion strength between the protection layer and at least one of the lead frame blank, the molding compound, or combinations thereof.

6. The method of claim 5, wherein the substrate may be pulled off the packaging with the protection layer remaining attached to the substrate.

7. The method of claim 1, wherein a substrate may be pulled off the packaging such that the protection layer is also pulled off the micro-needle.

8. The method of claim 1, wherein the protection layer is doped with a conductive additive and the medical device includes a circuit coupled to the conductive additive when the medical device is assembled and configured so that the removal of the protection layer activates the IC component.

9. The method of claim 1, wherein the medical device is wearable by a patient, and wherein the IC component includes a sensor coupled to the micro-needle that is configured to sense a parameter when the micro-needle contacts skin of the patient.

10. The method of claim 1, further comprising:

removing an outer frame of the lead frame blank leaving the encapsulated IC component and an inner portion of the lead frame blank.