Defect pattern evaluation method, defect pattern evaluation apparatus, and recording media
First Claim
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1. A defect pattern evaluation method, comprising:
- performing, after a predetermined process for manufacturing a semiconductor device, optical defect inspection on a pattern on a substrate;
detecting defects by the optical defect inspection;
classifying, on the basis of a pattern layout that corresponds to coordinates of the defects, the defects by a type of the pattern layout;
counting a number of the defects that are in each type of the pattern layout;
calculating, using a computer, a defect occurrence rate for each type of the pattern layout by dividing the number of defects counted in each type of the pattern layout by a number of pattern layouts in each type of the pattern layout; and
outputting the defect occurrence rate for each of the pattern layout as an evaluation result.
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Abstract
According to a defect pattern evaluation method of an embodiment, defects are detected by performing optical defect inspection on a pattern on a substrate. Then, the defects are classified according to a type of a pattern layout using a pattern layout corresponding to coordinates of the defects. Further, a computer calculates a defect occurrence rate by dividing the number of defects of each pattern layout by an arrangement number of the pattern layouts in an inspection region. Then, the defect occurrence rate of each pattern layout is output as an evaluation result.
10 Citations
20 Claims
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1. A defect pattern evaluation method, comprising:
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performing, after a predetermined process for manufacturing a semiconductor device, optical defect inspection on a pattern on a substrate; detecting defects by the optical defect inspection; classifying, on the basis of a pattern layout that corresponds to coordinates of the defects, the defects by a type of the pattern layout; counting a number of the defects that are in each type of the pattern layout; calculating, using a computer, a defect occurrence rate for each type of the pattern layout by dividing the number of defects counted in each type of the pattern layout by a number of pattern layouts in each type of the pattern layout; and outputting the defect occurrence rate for each of the pattern layout as an evaluation result. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A defect pattern evaluation apparatus, comprising:
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a classifying unit that classifies, on the basis of a pattern layout that corresponds to coordinates of defects, the defects by a type of the pattern layout, the defects being detected by performing, after a predetermined process for manufacturing a semiconductor device, optical defect inspection on a pattern on a substrate; a counting unit that counts a number of defects that are in each type of the pattern layout; a defect occurrence rate calculating unit that calculates a defect occurrence rate for each type of the pattern layout by dividing the number of defects counted in each type of the pattern layout by a number of pattern layouts in each type of the pattern layout; and an output unit that outputs the defect occurrence rate for each type of the pattern layout as an evaluation result. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A non-transitory computer-readable recording medium on which a defect evaluation program is recorded, the defect evaluation program causing a computer to evaluate a pattern on a substrate which has been subjected to, after a predetermined process for manufacturing a semiconductor device, optical defect inspection, the defect evaluation program causing the computer to execute:
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classifying, on the basis of a pattern layout that corresponds to coordinates of defects detected by the optical defect inspection, the defects by a type of the pattern layout; counting a number of defects that are in each type of the pattern layout; calculating a defect occurrence rate for each type of the pattern layout by dividing the number of defects counted in each type of the pattern layout by a number of pattern layouts in each type of the pattern layout; and outputting the defect occurrence rate for each type of the pattern layout as an evaluation result. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification