Semiconductor device and manufacturing method thereof

• US 9,202,822 B2
• Filed: 12/12/2011
• Issued: 12/01/2015
• Est. Priority Date: 12/17/2010
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Endo, Yuta, Sasaki, Toshinari, Noda, Kosei, Sato, Hitomi, Sato, Yuhei
• Primary Examiner(s): Sun, Yu-Hsi D
• Assistant Examiner(s): SINGAL, ANKUSH K
• Application Number:
  US13/316,604
• Publication Number:
  US 20120153275A1
• Time in Patent Office: 1,450 Days
• Field of Search: 257/43
• US Class Current: 1/1
• CPC Class Codes: H01L 21/28088 the final conductor layer next to the insulator being a composite, e.g. TiN
• CPC Class Codes: H01L 21/288 from a liquid, e.g. electrolytic deposition
• CPC Class Codes: H01L 27/1225 with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
• CPC Class Codes: H01L 29/42384 for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor
• CPC Class Codes: H01L 29/4908 for thin film semiconductor, e.g. gate of TFT
• CPC Class Codes: H01L 29/66742 Thin film unipolar transistors
• CPC Class Codes: H01L 29/7869 having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate

Abstract

To manufacture a transistor whose threshold voltage is controlled without using a backgate electrode, a circuit for controlling the threshold voltage, and an impurity introduction method. To manufacture a semiconductor device having favorable electrical characteristics, high reliability, and low power consumption using the transistor. A gate electrode including a tungsten oxide film whose composition is controlled is used. The composition or the like is adjusted by a film formation method of the tungsten oxide film, whereby the work function can be controlled. By using the tungsten oxide film whose work function is controlled as part of the gate electrode, the threshold of the transistor can be controlled. Using the transistor whose threshold voltage is controlled, a semiconductor device having favorable electrical characteristics, high reliability, and low power consumption can be manufactured.

Claims

1. A semiconductor device comprising:

a gate electrode essentially consisting of a tungsten oxide;

a gate insulating film in contact with the gate electrode; and

an oxide semiconductor film part of which at least overlaps with the gate electrode with the gate insulating film interposed therebetween,

wherein a work function of the gate electrode is higher than or equal to 4.9 eV and lower than or equal to 5.6 eV, and

wherein the oxide semiconductor film includes two or more elements selected from In, Ga, Zn, Sn, and Al.

2. The semiconductor device according to claim 1, further comprising a pair of electrodes between the oxide semiconductor film and the gate insulating film.

3. The semiconductor device according to claim 1,

wherein the oxide semiconductor film is provided over a base insulating film, and

wherein a pair of electrodes is included between the oxide semiconductor film and the base insulating film.

4. The semiconductor device according to claim 1, further comprising:

an interlayer insulating film over the oxide semiconductor film; and

a pair of electrodes between the oxide semiconductor film and the interlayer insulating film.

5. The semiconductor device according to claim 1, wherein the gate electrode is formed by a sputtering method using one or more gases selected from a rare gas, oxygen, and nitrogen as a gas included in a film formation gas.

6. The semiconductor device according to claim 1, wherein the gate electrode includes nitrogen at greater than or equal to 0.1 at % and lower than or equal to 20 at %.

7. The semiconductor device according to claim 1, wherein the gate electrode is formed by performing oxidation treatment on a film including tungsten.

8. The semiconductor device according to claim 1, wherein the work function of the gate electrode is higher than or equal to 5.2 eV and lower than or equal to 5.6 eV.

18. The semiconductor device according to claim 1, wherein the gate electrode is formed by a sputtering method using two or more targets selected from tungsten target, tungsten dioxide target, tungsten trioxide target, and target of tungsten oxide with another valence.

9. A semiconductor device comprising:

a gate electrode including a first film comprising tungsten, oxygen and nitrogen, wherein a concentration of nitrogen in the first film is higher than or equal to 0.1 at % and lower than or equal to 20 at %;

a gate insulating film in contact with the tungsten oxide first film; and

an oxide semiconductor film part of which at least overlaps with the gate electrode with the gate insulating film interposed therebetween,

wherein a work function of the gate electrode is higher than or equal to 4.9 eV and lower than or equal to 5.6 eV, and

wherein the oxide semiconductor film includes two or more elements selected from In, Ga, Zn, Sn, and Al.

10. The semiconductor device according to claim 9, further comprising a pair of electrodes between the oxide semiconductor film and the gate insulating film.

11. The semiconductor device according to claim 9,

wherein the oxide semiconductor film is provided over a base insulating film, and

wherein a pair of electrodes is included between the oxide semiconductor film and the base insulating film.

12. The semiconductor device according to claim 9, further comprising:

an interlayer insulating film over the oxide semiconductor film; and

a pair of electrodes between the oxide semiconductor film and the interlayer insulating film.

13. The semiconductor device according to claim 9, wherein the first film is formed by a sputtering method using one or more gases selected from a rare gas, oxygen, and nitrogen as a gas included in a film formation gas.

14. The semiconductor device according to claim 9, wherein the film further comprises argon.

15. The semiconductor device according to claim 9, wherein the first film is formed by performing oxidation treatment on a film including tungsten.

16. The semiconductor device according to claim 9, wherein the work function of the gate electrode is higher than or equal to 5.2 eV and lower than or equal to 5.6 eV.

17. The semiconductor device according to claim 9, wherein the gate electrode includes a second film comprising any one of Al, Ti, Cr, Co, Ni, Cu, Y, Zr, Mo, Ag, and Ta.

19. The semiconductor device according to claim 9, wherein the first film is formed by a sputtering method using two or more targets selected from tungsten target, tungsten dioxide target, tungsten trioxide target, and target of tungsten oxide with another valence.

20. A semiconductor device comprising:

an oxide semiconductor film comprising a first region and a second region;

a gate insulating film overlapping with the first region and not overlapping with the second region; and

a gate electrode overlapping with the oxide semiconductor film with the gate insulating film interposed therebetween,

wherein the gate electrode essentially consists of a tungsten oxide,

wherein resistance of the second region is lower than that of the first region

wherein a work function of the gate electrode is higher than or equal to 4.9 eV and lower than or equal to 5.6 eV, and

wherein the oxide semiconductor film includes two or more elements selected from In, Ga, Zn, Sn, and Al.

21. The semiconductor device according to claim 20, further comprising:

an interlayer insulating film over the oxide semiconductor film; and

a pair of electrodes over the interlayer insulating film and in contact with the oxide semiconductor film.

22. The semiconductor device according to claim 21, wherein the pair of electrodes in contact with the oxide semiconductor film through a plurality of openings formed in the interlayer insulating film.

23. The semiconductor device according to claim 20, wherein the gate electrode is formed by a sputtering method using one or more gases selected from a rare gas, oxygen, and nitrogen as a gas included in a film formation gas.

24. The semiconductor device according to claim 20, wherein the gate electrode includes nitrogen at greater than or equal to 0.1 at % and lower than or equal to 20 at %.

25. The semiconductor device according to claim 20, wherein the gate electrode is formed by performing oxidation treatment on a film including tungsten.

26. The semiconductor device according to claim 20, wherein the work function of the gate electrode is higher than or equal to 5.2 eV and lower than or equal to 5.6 eV.

27. The semiconductor device according to claim 20, wherein the gate electrode is formed by a sputtering method using two or more targets selected from tungsten target, tungsten dioxide target, tungsten trioxide target, and target of tungsten oxide with another valence.