Sealed body, method for manufacturing sealed body, light-emitting device, and method for manufacturing light-emitting device

• US 9,202,843 B2
• Filed: 08/25/2014
• Issued: 12/01/2015
• Est. Priority Date: 06/16/2011
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Shimomura, Akihisa
• Primary Examiner(s): Dang, Trung Q
• Application Number:
  US14/467,238
• Publication Number:
  US 20140361320A1
• Time in Patent Office: 463 Days
• Field of Search: 257/40, 257/88, 257/98
• US Class Current: 1/1
• CPC Class Codes: B32B 2309/02 Temperature
• CPC Class Codes: B32B 2309/105 Thickness
• CPC Class Codes: B32B 2309/60 In a particular environment
• CPC Class Codes: B32B 2309/65 Dust free, e.g. clean room
• CPC Class Codes: B32B 2310/0812 using induction
• CPC Class Codes: B32B 2310/0843 using laser
• CPC Class Codes: B32B 2457/20 Displays, e.g. liquid crystal displays, plasma displays
• CPC Class Codes: B32B 2457/206 Organic displays, e.g. OLED
• CPC Class Codes: B32B 37/06 characterised by the heating method
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 71/421 using coherent electromagnetic radiation, e.g. laser annealing
• CPC Class Codes: Y10T 428/24744 Longitudinal or transverse tubular cavity or cell

Abstract

A highly productive method for sealing substrates with the use of glass frit is provided. A method for sealing substrates with the use of glass frit, which can be used for a substrate provided with a material having low heat resistance, is provided. A highly airtight sealed body which is manufactured by such a method is provided. A light-emitting device having high productivity and high reliability and a manufacturing method thereof are provided. A heat generation layer containing a conductive material which generates heat by induction heating is formed to overlap with a region where a paste including a frit material and a binder is applied. Alternatively, a conductive material which generates heat by induction heating is added to the paste itself. The paste is locally heated by induction heating to remove the binder included in the paste.

Claims

1. A sealed body comprising:

a first substrate;

a second substrate;

a glass frit comprising a conductive material;

a heat generation layer between the first substrate and the glass frit, the heat generation layer comprising a conductive material;

a wiring between the second substrate and the glass frit; and

a sealant between the first substrate and the second substrate, the sealant being positioned outside of the glass frit;

wherein the heat generation layer, the glass fit and the wiring overlap one another, and

wherein a closed space surrounded by the first substrate, the second substrate, and the glass frit is formed.

2. The sealed body according to claim 1, wherein the conductive material comprises any one of iron, tungsten, and molybdenum.

3. The sealed body according to claim 1, the glass frit further comprising a binder and a frit material.

4. The sealed body according to claim 3, wherein the frit material comprises one or more compounds selected from magnesium oxide, calcium oxide, barium oxide, lithium oxide, sodium oxide, potassium oxide, boron oxide, vanadium oxide, zinc oxide, tellurium oxide, aluminum oxide, silicon dioxide, lead oxide, tin oxide, phosphorus oxide, ruthenium oxide, rhodium oxide, iron oxide, copper oxide, titanium oxide, tungsten oxide, bismuth oxide, and antimony oxide.

5. A light-emitting device comprising the sealed body according to claim 1, wherein the second substrate is provided with a light-emitting unit.

6. The light-emitting device according to claim 5, the light-emitting unit comprising an EL element, the EL element comprising:

an anode;

a cathode; and

an EL layer between the anode and the cathode,

wherein the EL layer comprises a light-emitting layer.

7. The light-emitting device according to claim 5, wherein the first substrate is provided with a color filter.

8. A lighting device comprising the light-emitting device according to claim 5.

9. A display device comprising the light-emitting device according to claim 5.

17. The sealed body according to claim 1, wherein the glass frit further comprises an absorber having an absorption property with respect to a laser light.

19. The sealed body according to claim 1, further comprising an insulating layer between the glass frit and the wiring.

10. A light-emitting device comprising:

a first substrate provided with a color filter;

a second substrate provided with a light-emitting unit;

a glass frit comprising a conductive material;

a heat generation layer between the first substrate and the glass frit, the heat generation layer comprising a conductive material;

a wiring between the second substrate and the glass frit; and

a sealant between the first substrate and the second substrate, the sealant being positioned outside of the glass frit;

wherein the heat generation layer, the glass frit and the wiring overlap one another, and

wherein a closed space surrounded by the first substrate, the second substrate, and the glass fit is formed.

11. The light-emitting device according to claim 10, wherein the conductive material comprises any one of iron, tungsten, and molybdenum.

12. The light-emitting device according to claim 10, the glass frit further comprising a binder and a frit material.

13. The light-emitting device according to claim 12, wherein the frit material comprises one or more compounds selected from magnesium oxide, calcium oxide, barium oxide, lithium oxide, sodium oxide, potassium oxide, boron oxide, vanadium oxide, zinc oxide, tellurium oxide, aluminum oxide, silicon dioxide, lead oxide, tin oxide, phosphorus oxide, ruthenium oxide, rhodium oxide, iron oxide, copper oxide, titanium oxide, tungsten oxide, bismuth oxide, and antimony oxide.

14. The light-emitting device according to claim 10, the light-emitting unit comprising an EL element, the EL element comprising:

an anode;

a cathode; and

an EL layer between the anode and the cathode,

wherein the EL layer comprises a light-emitting layer.

15. A lighting device comprising the light-emitting device according to claim 10.

16. A display device comprising the light-emitting device according to claim 10.

18. The light-emitting device according to claim 10, wherein the glass frit further comprises an absorber having an absorption property with respect to a laser light.

20. The light-emitting device according to claim 10, further comprising an insulating layer between the glass fit and the wiring.