LED module for modified lamps and modified LED lamp

• US 9,203,001 B2
• Filed: 02/26/2010
• Issued: 12/01/2015
• Est. Priority Date: 03/09/2009
• Status: Expired due to Fees

• Current Assignee: Tridonic Jennersdorf GMBH (Zumtobel Group AG)
• Original Assignee: Tridonic Jennersdorf GMBH (Zumtobel Group AG)
• Inventors: Pachler, Peter
• Primary Examiner(s): Parker, Kenneth
• Assistant Examiner(s): Fan, Bo
• Application Number:
  US13/255,694
• Publication Number:
  US 20120068204A1
• Time in Patent Office: 2,104 Days
• Field of Search: 257/89, 257/88, 257/98, 362/235, 362/249, 362/231, 313/512, 313/110, 313/506, 313/112, 313/498
• US Class Current: 1/1
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

An LED module includes a printed circuit board (PCB) or a surface mount device (SMD) mount, an LED chip mounted on the PCB or the SMD mount, a cover mounted on the LED chip and a surface of the PCB or the SMD mount which surrounds the LED chip. The surface of the PCB or the SMD mount on which the spherical cover is mounted may be covered on its side walls with a white reflective material which is in contact with the LED chip.

Claims

1. An LED module comprising:

a printed circuit board (PCB) or a surface mount device (SMD) mount;

an LED die mounted on the PCB or the SMD mount; and

a semi-spherical cover attached to a white reflective material, said white reflective material covering at least a portion of a surface of the PCB or the SMD mount, and said semi-spherical cover covering the LED die;

wherein the white reflective material is in contact with and encircles the opposing lateral side walls of the LED die, and

wherein the white reflective material does not extend above a top surface of the LED die when viewing the LED module from the side.

2. The LED module as claimed in claim 1, wherein the white reflective material is a layer which has a thickness of between 5 μ

m and 250 μ

m.

3. The LED module as claimed in claim 1, wherein a lateral side wall of the LED die is coated with a material which is arranged such that it is reflective for the light which strikes the LED die.

4. The LED module as claimed in claim 1, wherein a color conversion material is provided in the semi-spherical cover and/or on the top surface of the LED die.

5. The LED module as claimed in claim 4, wherein the white reflective material is reflective at least for a spectrum which is emitted from the LED die and the color conversion material.

6. The LED module as claimed in claim 5, wherein the LED module emits white light, which is a mixture from the spectrum of the LED die and an emission spectrum of the color conversion material.

7. The LED module as claimed in claim 6, wherein the reflective material is an electrically non-conductive material.

8. The LED module as claimed in claim 1, wherein a multiplicity of LED dies are arranged under the cover.

9. The LED module as claimed in claim 8, wherein the LED die emits a spectrum which is partially converted down by a phosphor, and the LED module includes a further LED die that emits a spectrum which is not affected by the phosphor.

10. A modified LED lamp which has at least one LED module as claimed in claim 9.

11. An LED lamp comprising:

an LED module which has a printed circuit board (PCB) or a surface mount device (SMD) mount and a multiplicity of LED dies which are mounted on the PCB or the SMD mount; and

a semi-spherical cover attached to a white reflective material, said white reflective material covering at least a portion of a surface of the PCB or the SMD mount, and said semi-spherical cover covering the multiplicity of LED dies,

wherein the white reflective material is in contact with and encircles the opposing lateral side walls of the multiplicity of LED dies,

wherein the white reflective material does not extend above a top surface of the multiplicity of LED dies when viewing the LED module from the side, and

wherein at least one LED die of the multiplicity of LED dies emits blue light which is partially converted by a phosphor, and wherein at least one LED die of the multiplicity of LED dies emits light in the red spectrum, which is not affected by the phosphor.

12. The LED module as claimed in claim 11, wherein the white reflective material comprises a layer which has a thickness of between 100 μ

m and 150 μ

m.

13. The LED module as claimed in claim 11, wherein a lateral side wall of the multiplicity of LED dies is coated with a material which is arranged such that it is reflective for light which strikes the multiplicity of LED dies.

14. The LED module as claimed in claim 11, wherein a color conversion material is provided in the semi-spherical cover and/or on an upper surface of the multiplicity of LED dies.

15. The LED module as claimed in claim 14, wherein the white reflective material is reflective at least for a spectrum which is emitted from the multiplicity of LED dies and the color conversion material.

16. The LED module as claimed in claim 15, wherein the LED module emits white light, which is a mixture of the spectrum of the multiplicity of LED dies and an emission spectrum of the color conversion material.