Light emitting devices for light emitting diodes (LEDs)

• US 9,203,004 B2
• Filed: 10/01/2013
• Issued: 12/01/2015
• Est. Priority Date: 11/22/2010
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Hussell, Christopher P., Andrews, Peter Scott, Reiherzer, Jesse Colin, Emerson, David T.
• Primary Examiner(s): LE, DUNG ANH
• Application Number:
  US14/043,494
• Publication Number:
  US 20140097453A1
• Time in Patent Office: 791 Days
• Field of Search: 257 12- 13, 257/81, 257/84, 257/88, 257 98- 99, 438/22, 438 27- 28, 438 47- 52, 438/E31.117, 438/E21.592, 313/501, 313/503, 313/505, 313509-510
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Light emitting devices for light emitting diodes (LEDs) are disclosed. In one embodiment a light emitting device can include a substrate, one or more LEDs disposed over the substrate, and the LEDs can include electrical connectors for connecting to an electrical element. A light emitting device can further include a retention material disposed over the substrate and the retention material can be disposed over at least a portion of the electrical connectors. The LEDs can be connected in a pattern that is non-linear.

Claims

1. A light emitting device, comprising:

a substrate;

one or more light emitting diodes (LEDs) disposed over the substrate comprising electrical connectors;

a solder mask disposed over at least a portion of the substrate; and

a retention material disposed over the substrate, wherein the retention material is disposed over at least a portion of the electrical connectors, and also over at least a portion of the solder mask.

2. The light emitting device of claim 1, further comprising at least two electrical elements disposed on the substrate in an annular configuration with at least one space between ends of the electrical elements and at least one electrostatic discharge device (ESD) disposed on the substrate and positioned in the space between the ends of the electrical elements, wherein the retention material is at least partially disposed over the at least one ESD.

3. The light emitting device of claim 1, wherein the retention material forms a dam.

4. The light emitting device of claim 1, wherein the electrical connectors comprise wirebonds.

5. The light emitting device of claim 1, wherein the one or more LEDs are arranged at least partially in a checkerboard configuration.

6. The light emitting device of claim 1, wherein the one or more LEDs are electrically connected in series as a string of LEDs.

7. The light emitting device of claim 6, wherein a first string of LEDs comprises LEDs configured in at least a first non-linear pattern, at least a second non-linear pattern that is different from the first non-linear pattern, and at least a third linear pattern.