Multi-use package substrate
First Claim
Patent Images
1. An apparatus, comprising:
- a package substrate having a top surface and a bottom surface, the bottom surface configured to receive a ball grid array, the package substrate for a first stacked silicon interconnect technology (SSIT) product that comprises one or more top dies mounted on an interposer, the first SSIT product having a first top die configuration, wherein the package substrate includes a plurality of exposed pads disposed on the top surface and uncovered by the interposer, the plurality of exposed pads disposed in an arrangement suitable to receive at least one additional die, the exposed pads not soldered to another structure;
wherein the package substrate is compatible with a second SSIT product with a second top die configuration; and
wherein the first top die configuration is different from the second top die configuration;
wherein the first SSIT product is smaller in size than the second SSIT product; and
the first SSIT product has bumps along a side of the first SSIT product that are a same type as that of bumps at corresponding locations on the second SSIT product, the corresponding locations being away from a side of the second SSIT product.
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Abstract
An apparatus includes a package substrate for a first SSIT product with a first top die configuration, wherein the package substrate is compatible with a second SSIT product with a second top die configuration, and wherein the first top die configuration is different from the second top die configuration.
28 Citations
20 Claims
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1. An apparatus, comprising:
a package substrate having a top surface and a bottom surface, the bottom surface configured to receive a ball grid array, the package substrate for a first stacked silicon interconnect technology (SSIT) product that comprises one or more top dies mounted on an interposer, the first SSIT product having a first top die configuration, wherein the package substrate includes a plurality of exposed pads disposed on the top surface and uncovered by the interposer, the plurality of exposed pads disposed in an arrangement suitable to receive at least one additional die, the exposed pads not soldered to another structure;
wherein the package substrate is compatible with a second SSIT product with a second top die configuration; and
wherein the first top die configuration is different from the second top die configuration;
wherein the first SSIT product is smaller in size than the second SSIT product; and
the first SSIT product has bumps along a side of the first SSIT product that are a same type as that of bumps at corresponding locations on the second SSIT product, the corresponding locations being away from a side of the second SSIT product.- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. An apparatus, comprising:
a package substrate having a top surface and a bottom surface, the bottom surface configured to receive a ball grid array;
at least one die; and
an interposer mounted off center on the top surface of the package substrate and electrically coupling the package substrate to the at least one die, wherein the package substrate includes a plurality of exposed pads uncovered by the interposer, the plurality of exposed pads not soldered to another structure, the plurality of exposed pads disposed in an arrangement suitable to electrically support an alternative interposer and support electrical function of the one die and at least one additional die both mounted on the alternative interposer, the exposed pads arranged to electrically support a ball grid array connection with the at least one additional die when mounted to the alternative interposer.- View Dependent Claims (17, 18, 19, 20)
Specification