Conductivity based on selective etch for GaN devices and applications thereof
First Claim
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1. A method for forming porous GaN, comprising:
- exposing GaN to an electrolyte;
coupling the GaN to one terminal of a power supply and coupling an electrode immersed in the electrolyte to another terminal of the power supply to thereby form a circuit; and
energizing the circuit to electrochemically (EC) etch a plurality of pores in at least a first portion of the GaN and thereby form porous GaN, wherein electrochemically etching the plurality of pores does not require ultraviolet illumination of the GaN.
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Abstract
This invention relates to methods of generating NP gallium nitride (GaN) across large areas (>1 cm2) with controlled pore diameters, pore density, and porosity. Also disclosed are methods of generating novel optoelectronic devices based on porous GaN. Additionally a layer transfer scheme to separate and create free-standing crystalline GaN thin layers is disclosed that enables a new device manufacturing paradigm involving substrate recycling. Other disclosed embodiments of this invention relate to fabrication of GaN based nanocrystals and the use of NP GaN electrodes for electrolysis, water splitting, or photosynthetic process applications.
20 Citations
51 Claims
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1. A method for forming porous GaN, comprising:
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exposing GaN to an electrolyte; coupling the GaN to one terminal of a power supply and coupling an electrode immersed in the electrolyte to another terminal of the power supply to thereby form a circuit; and energizing the circuit to electrochemically (EC) etch a plurality of pores in at least a first portion of the GaN and thereby form porous GaN, wherein electrochemically etching the plurality of pores does not require ultraviolet illumination of the GaN. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46)
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47. A method of manufacturing nanocrystals, comprising:
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providing a material comprising at least one of GaN or InGaN with an n-type doped surface layer; exposing the material to an electrolyte; coupling the material to one terminal of a power supply and an electrode immersed in the electrolyte to another terminal of the power supply to thereby form a circuit; energizing the circuit to electrochemically (EC) etch the doped surface layer and create a continuous porous layer at a surface of the material, wherein electrochemically etching the doped surface layer does not require ultraviolet illumination of the GaN; and
,subjecting the continuous porous layer to a mechanical disturbance to break the continuous porous layer into nanocrystals. - View Dependent Claims (48)
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49. A method of manufacturing an electrode, comprising:
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providing a material comprising at least one of GaN or InGaN with an n-type doped surface layer; exposing the material to an electrolyte; coupling the material to one terminal of a power supply and an electrode immersed in the electrolyte to another terminal of the power supply to thereby form a circuit; and
,energizing the circuit to electrochemically (EC) etch the doped surface layer and create a porous layer on the surface of a structure suitable for use as an electrode for electrolysis, water splitting, or photosynthetic process applications, wherein electrochemically etching the doped surface layer does not require ultraviolet illumination of the GaN. - View Dependent Claims (50)
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51. A method for generating porous GaN, comprising:
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forming a GaN layer on a substrate comprising sapphire, silicon, silicon carbide, or bulk GaN; and electrochemically (EC) etching the GaN layer under a bias voltage between 5 volts and 60 volts to form a porous layer in at least a portion of the GaN layer, wherein electrochemically etching the GaN layer does not require ultraviolet illumination of the GaN.
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Specification