Method for controlling ion energy distribution

• US 9,208,992 B2
• Filed: 01/27/2015
• Issued: 12/08/2015
• Est. Priority Date: 04/26/2010
• Status: Active Grant

• Current Assignee: AES Global Holdings Pte Ltd. (Advanced Energy Industries, Inc. (China))
• Original Assignee: Advanced Energy Industries Incorporated
• Inventors: Brouk, Victor, Heckman, Randy, Hoffman, Daniel J.
• Primary Examiner(s): BRAYTON, JOHN JOSEPH
• Application Number:
  US14/606,857
• Publication Number:
  US 20150144596A1
• Time in Patent Office: 315 Days
• Field of Search: 156/345, 118/723, 216/67, 204/192.12, 204/298.08, 204/298.15
• US Class Current: 1/1
• CPC Class Codes: C23C 14/345 using substrate bias
• CPC Class Codes: C23C 16/50 using electric discharges generation and control of plasma in discharge tubes for surface treatment H01J37/32, H01J37/34
• CPC Class Codes: H01J 37/24 Circuit arrangements not adapted to a particular application of the tube and not otherwise provided for
• CPC Class Codes: H01J 37/32009 Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources plasma generation in general H05H1/24
• CPC Class Codes: H01J 37/32082 Radio frequency generated discharge H01J37/32357, H01J37/32366, H01J37/32394 and H01J37/32403 take precedence
• CPC Class Codes: H01J 37/32174 Circuits specially adapted for controlling the RF discharge
• CPC Class Codes: H01J 37/32935 Monitoring and controlling tubes by information coming from the object and/or discharge
• CPC Class Codes: H01J 37/3299 Feedback systems

Abstract

Methods for regulating ion energies in a plasma chamber are disclosed. An exemplary method includes placing a substrate in a plasma chamber, forming a plasma in the plasma chamber, controllably switching power to the substrate so as to apply a periodic voltage function to the substrate, and modulating, over multiple cycles of the periodic voltage function, the periodic voltage function responsive to a desired distribution of energies of ions at the surface of the substrate so as to effectuate the desired distribution of ion energies on a time-averaged basis.

Claims

1. A method for plasma-based processing, comprising:

placing a substrate in a substrate support inside of a plasma chamber;

forming a plasma in the plasma chamber;

generating a periodic voltage function at a surface the substrate inside the plasma chamber, each cycle of the periodic voltage function at the surface of the substrate including a positive pulse peak followed by a constant negative voltage, a magnitude of the constant negative voltage is constant within each cycle of the periodic voltage function, and the constant negative voltage results in a monoenergetic distribution of ion energy at the surface of the substrate;

wherein generating the periodic voltage function at the surface the substrate includes;

producing a positive DC voltage outside of the plasma chamber with a DC voltage source, a magnitude of the DC voltage defines a magnitude of the constant negative voltage at the surface of the substrate and establishes an energy level of the monoenergetic distribution of ion energy at the surface of the substrate;

coupling the positive DC voltage to the substrate support to apply a positive voltage pulse peak to the substrate support that effectuates the positive pulse peak at the surface of the substrate, a magnitude of the positive DC voltage is unvarying while the positive DC voltage is coupled to the substrate support;

decoupling the positive DC voltage from the substrate support and coupling a ground potential to the substrate support after the positive DC voltage is decoupled from the substrate support, wherein the application of the ground potential effectuates a drop in a voltage of the substrate support to a first-lower-level and effectuates a drop in the positive pulse peak at the surface of the substrate to the constant negative voltage at the surface of the substrate;

decoupling the ground potential from the substrate support while maintaining the positive DC voltage decoupled from the substrate support; and

providing, while the ground potential and the positive DC voltage are decoupled from the substrate support, an uninterrupted compensation current, which is fixed in magnitude, to the substrate support with a current source that is separate from the DC voltage source to ramp down the voltage of the substrate support from the first-lower-level to a second-negative-lower-level, wherein the ramp down of the voltage at the substrate support maintains the constant negative voltage at the surface of the substrate, and the constant negative voltage at the surface of the substrate effectuates the monoenergetic distribution of ion energy at the surface of the substrate.

2. The method of claim 1 including:

monitoring a rate of change of the ramp down of the voltage that is applied to the substrate support to obtain a measure of current of ions at the surface of the substrate; and

controlling, based upon the current of the ions, the compensation current output from the current source, while the ground potential and the DC voltage are decoupled from the substrate support, to maintain the monoenergetic distribution of ion energy.

3. The method of claim 2, wherein coupling and decoupling the DC voltage includes coupling and decoupling the DC voltage with a first field effect transistor and coupling and decoupling the ground potential includes coupling and decoupling the ground potential with a second field effect transistor.

4. The method of claim 1 including:

modulating, over multiple cycles of the periodic voltage function, a magnitude of the constant negative voltage with a modulating function to effectuate a particular ion energy distribution at the surface of the substrate on a time-averaged basis;

wherein the modulating includes;

fixing a magnitude of the DC voltage within each cycle of the periodic voltage function; and

adjusting a magnitude of the DC voltage of the periodic voltage from cycle to cycle based upon the modulating function.

5. A method for plasma-based processing, comprising:

placing a substrate in a substrate support inside of a plasma chamber;

forming a plasma in the plasma chamber;

producing a positive DC voltage outside of the plasma chamber with a DC power supply;

connecting, by closing a first switch, the positive DC voltage to the substrate support to effectuate a positive pulse peak at the surface of the substrate, wherein the positive DC voltage connected to the substrate support charges an inherent capacitance C1 of components, including the substrate support, associated with the plasma chamber, a magnitude of the positive DC voltage is unvarying while the positive DC voltage is connected to the substrate support;

disconnecting, by opening the first switch, the positive DC voltage from the substrate support and connecting, by closing a second switch, a ground potential to the substrate support, wherein the application of the ground potential to the substrate support effectuates a negative voltage at a surface of the substrate that prompts ion current of positive ions in the plasma toward the surface of the substrate;

disconnecting, by opening the second switch, the ground potential from the substrate support;

maintaining both the first and second switches open for a period of time t,

providing with a current source, while the first and second switches are open, an uninterrupted compensation current, which is fixed in magnitude, to the substrate to create a ramp down of the voltage of the substrate support during the period of time t, wherein the ramp down of the voltage at the substrate support compensates for a tendency of the ion current to change the voltage at the surface of the substrate in order to maintain the negative voltage at the surface of the substrate at a constant negative voltage, wherein the constant negative voltage at the surface of the substrate effectuates a monoenergetic distribution of ion energy at the surface of the substrate.

6. The method of claim 5, including:

monitoring a rate of change of the ramp down of the voltage that is applied to the substrate support to obtain a measure of the ion current at the surface of the substrate; and

controlling, based upon the ion current, the compensation current output from the current source to maintain a slope of the ramp down of voltage and the monoenergetic distribution of ion energy.

7. A method for plasma-based processing, comprising:

placing a substrate in a substrate support inside of a plasma chamber;

forming a plasma in the plasma chamber;

receiving an ion-energy setting for a desired ion energy at a surface of the substrate;

producing a positive DC voltage outside of the plasma chamber that has a magnitude that is determined by the ion-energy setting;

connecting, by closing a first switch, the positive DC voltage to the substrate support to effectuate a positive pulse peak at the surface of the substrate, a magnitude of the positive DC voltage is unvarying while the positive DC voltage is connected to the substrate support;

disconnecting, by opening the first switch, the positive DC voltage from the substrate support and connecting, by closing a second switch, a ground potential to the substrate support, wherein the application of the ground potential to the substrate support effectuates a negative voltage at a surface of the substrate that prompts ion current of positive ions in the plasma toward the surface of the substrate;

disconnecting, by opening the second switch, the ground potential from the substrate support;

maintaining both the first and second switches open for a period of time t,

providing with a current source, while the first and second switches are open, an uninterrupted compensation current, which is fixed in magnitude, to the substrate support to create a ramp down of the voltage of the substrate support during the period of time t, wherein the ramp down of the voltage at the substrate support compensates for a tendency of the ion current to change the voltage at the surface of the substrate in order to maintain the negative voltage at the surface of the substrate at a constant negative voltage, wherein the constant negative voltage at the surface of the substrate effectuates the desired ion energy at the surface of the substrate.

8. The method of claim 7, including:

monitoring a rate of change of the ramp down of the voltage that is applied to the substrate support to obtain a measure of the ion current at the surface of the substrate; and

controlling, based upon the ion current, the compensation current output from the current source to maintain a slope of the ramp down of voltage and the desired ion energy.

9. The method of claim 8 including:

controlling, based upon the ion current, the compensation current output from the current source so that the compensation current is one of greater than the ion current or less than the ion current to produce a distribution of ion energies at the surface of the substrate.

10. The method of claim 7 including:

modulating a magnitude of the positive DC voltage with a modulating function to effectuate a particular ion energy distribution at the surface of the substrate on a time-averaged basis.