Semiconductor component and method of manufacture

• US 9,209,132 B2
• Filed: 05/21/2014
• Issued: 12/08/2015
• Est. Priority Date: 07/26/2013
• Status: Active Grant

• Current Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Original Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Inventors: Sharma, Umesh, Liu, Rong, Holland, Phillip
• Primary Examiner(s): Ingham, John C
• Application Number:
  US14/283,913
• Publication Number:
  US 20150028460A1
• Time in Patent Office: 566 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/11 Manufacturing methods
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/5283 Cross-sectional geometry
• CPC Class Codes: H01L 23/53238 Additional layers associated with copper layers, e.g. adhesion, barrier, cladding layers
• CPC Class Codes: H01L 23/5329 Insulating materials
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 27/0255 using diodes as protective elements
• CPC Class Codes: H01L 27/0288 using passive elements as protective elements, e.g. resistors, capacitors, inductors, spark-gaps
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/12035 Zener diode

Abstract

A common mode filter monolithically integrated with a protection device. In accordance with an embodiment a semiconductor material having a resistivity of at least 5 Ohm-centimeters is provided. A protection device is formed from a portion of the semiconductor material and a dielectric material is formed over the semiconductor material. A coil is formed over the dielectric material.

Claims

1. A method for manufacturing a semiconductor component, comprising:

providing a semiconductor material having a resistivity of at least 5 Ohm-centimeters;

forming a protection device from the semiconductor material by

forming a doped region of a first conductivity type in the semiconductor material;

forming the protection device from the doped region of the first conductivity type, wherein forming the protection device comprises forming an ElectroStatic Discharge protection device; and

monolithically integrating a common mode filter over the semiconductor material.

2. The method of claim 1, wherein forming the ElectroStatic Discharge protection device comprises forming first and second diodes from the semiconductor material.

3. The method of claim 1, wherein providing the semiconductor material comprises providing the semiconductor material having a resistivity of at least 500 Ohm-centimeters.

4. The method of claim 1, wherein forming the common mode filter comprises:

forming a first layer of material over a layer of dielectric material; and

forming a first electrically conductive coil structure over the first layer of material.

5. The method of claim 4, wherein the first layer of material is a photosensitive material.

6. A method for manufacturing a semiconductor component, comprising:

providing a semiconductor material having a resistivity of at least 5 Ohm-centimeters;

forming a doped region of a first conductivity type in the semiconductor material;

forming a protection device from the doped region of a first conductivity type from the doped region of the semiconductor material; and

monolithically integrating a common mode filter over the semiconductor material by

forming a first layer of material over a layer of dielectric material; and

forming a first electrically conductive coil structure over the first layer of material;

forming a second layer of material over the electrically conductive coil structure and over a portion of the first layer of material;

forming a second electrically conductive coil structure over the second layer of material;

forming a third layer of material over the second electrically conductive coil structure and over a portion of the second layer of material;

forming an opening in the third layer of material; and

forming an electrically conductive material in the opening in the third layer of material, wherein the first, second, and third layers of material are photosensitive materials.

7. The method of claim 6, further including forming solder balls over the electrically conductive material in the opening in the third layer of photosensitive material.

8. A method for manufacturing a chip scale package that includes a common mode filter monolithically integrated with a protection device, comprising:

providing a semiconductor material having a resistivity of at least 5 Ohm-centimeters;

forming a first doped region of a first conductivity type in the semiconductor material;

forming the protection device from the first doped region;

forming at least one contact to the semiconductor material;

forming the common mode filter over the semiconductor material by forming a first layer of photosensitive material over the semiconductor material and the at least one contact; and

forming an opening in the first layer of photosensitive material that exposes the at least one contact.

9. The method of claim 8, wherein forming the protection device comprises forming the protection device having a capacitance less than 10 picoFarads.

10. The method of claim 8, wherein forming the common mode filter further comprises:

forming a first electrically conductive material over the photosensitive material;

forming a first masking structure over the first electrically conductive material, the first masking structure protecting a portion of the first electrically conductive material and having an opening that exposes a portion of the first electrically conductive material and the opening in the first layer of photosensitive material; and

forming a second electrically conductive material on the exposed portions of the first electrically conductive material and in the opening in the first layer of photosensitive material.

11. The method of claim 10, wherein forming the common mode filter further comprises:

removing the first masking structure to expose portions of the second electrically conductive material;

removing portions of the first electrically conductive material that were protected by the first masking structure to expose portions of the first layer of photosensitive material; and

forming a second layer of photosensitive material over exposed portions of the first photosensitive material and over the second electrically conductive material.

12. The method of claim 11, wherein forming the common mode filter further comprises:

forming an opening in the second layer of photosensitive material;

forming a second masking structure over the second layer of photosensitive material, the second masking structure having an opening; and

forming a third electrically conductive material in the opening.

13. The method of claim 12, wherein forming the common mode filter further comprises:

removing the second masking structure to expose portions of the second electrically conductive material;

exposing portions of the second layer of photosensitive material that were protected by the second masking structure; and

forming a third layer of photosensitive material over exposed portions of the second photosensitive material and over the third electrically conductive material.

14. The method of claim 13, wherein forming the common mode filter further comprises:

forming an opening in the third layer of photosensitive material;

forming a third masking structure over the third layer of photosensitive material, the third masking structure having an opening; and

forming a fourth electrically conductive material in the opening.

15. The method of claim 14, wherein forming the first masking structure includes forming the first masking structure to have an opening having a spiral-shaped portion and wherein forming the second masking structure includes forming the second masking structure to have an opening having a spiral-shaped portion.

16. A monolithically integrated common mode filter and protection device configured as a chip scale package, comprising:

a semiconductor material having a resistivity of at least 5 Ohm-centimeters;

a protection device formed from the semiconductor material;

a first layer of material over the semiconductor material, the first layer of the first material having an opening filled with a first electrically conductive material, wherein the first layer of material is a photosensitive material; and

a first coil over the first layer of material.

17. The monolithically integrated common mode filter and protection device of claim 16, further including:

a second layer material over the first layer of material having an opening filled with a second electrically conductive material, wherein the second layer of material is a photosensitive material; and

a second coil over the second layer of layer of material.