Semiconductor package
First Claim
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1. A semiconductor package, comprising:
- a substrate;
a first passivation layer disposed on the substrate;
an under bump metallurgy layer disposed on the first passivation layer;
a passive device disposed on the under bump metallurgy layer;
an additional under bump metallurgy layer disposed on the first passivation layer, isolated from the under bump metallurgy layer; and
a conductive pillar disposed on the additional under bump metallurgy layer, wherein the conductive pillar and the passive device are at the same level.
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Abstract
A semiconductor package includes a substrate, a first passivation layer disposed on the substrate, and an under bump metallurgy layer disposed on the first passivation layer. A passive device is disposed on the under bump metallurgy layer, and an additional under bump metallurgy layer is disposed on the first passivation layer, isolated from the under bump metallurgy layer. A conductive pillar is disposed on the additional under bump metallurgy layer, wherein the conductive pillar and the passive device are at the same level.
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17 Claims
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1. A semiconductor package, comprising:
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a substrate; a first passivation layer disposed on the substrate; an under bump metallurgy layer disposed on the first passivation layer; a passive device disposed on the under bump metallurgy layer; an additional under bump metallurgy layer disposed on the first passivation layer, isolated from the under bump metallurgy layer; and a conductive pillar disposed on the additional under bump metallurgy layer, wherein the conductive pillar and the passive device are at the same level. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification