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Method for manufacturing semiconductor device and adhesive for mounting flip chip

  • US 9,209,155 B2
  • Filed: 08/05/2013
  • Issued: 12/08/2015
  • Est. Priority Date: 08/06/2012
  • Status: Active Grant
First Claim
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1. A method for producing a semiconductor device, comprising:

  • step 1 of positioning a semiconductor chip on a substrate via an adhesive, the semiconductor chip including bump electrodes each having an end made of solder;

    step 2 of heating the semiconductor chip at a temperature of the melting point of the solder or higher to solder and bond the bump electrodes of the semiconductor chip to an electrode portion of the substrate, and concurrently to temporarily attach the adhesive; and

    step 3 of removing voids by heating the adhesive under a pressurized atmosphere,the adhesive having an activation energy Δ

    E of 100 kJ/mol or less, a reaction rate of 20% or less at 2 seconds at 260°

    C., and a reaction rate of 40% or less at 4 seconds at 260°

    C., as determined by differential scanning calorimetry and Ozawa method.

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